Display panels, display modules, and electronic devices

Abstract

This application relates to display panels, display modules, and electronic devices. The display panel includes a substrate, a functional layer, and a touch metal layer; the functional layer and the touch metal layer are sequentially stacked on the substrate; the functional layer includes a first region and a second region, the second region surrounding the first region, and the second region having a first step structure. The number of first step structures is greater than or equal to N, where N is an integer greater than or equal to 2. The N first step structures are arranged along the direction from the first region to the second region, and the touch metal layer extends from the first region to the first step structure. The embodiments of this application solve the problem of etching residue in other film layers caused by large step differences, improving the stability and reliability of the display panel.

Description

Technical Field

[0001] This application relates to the field of display device technology, and more particularly to a display panel, display module and electronic device. Background Technology

[0002] With the widespread application of Organic Light-Emitting Diode (OLED) technology in electronic devices, a wider variety of electronic devices are being developed to meet diverse consumer demands due to their self-emissive, fast-response, and foldable characteristics. However, the planarization layer in OLED displays has a significant step difference at the edges, affecting the performance of other film layers and resulting in poor stability and reliability of the display panel. Utility Model Content

[0003] This application provides a display panel, a display module, and an electronic device. This application solves the problem of etching residue in other film layers caused by large step differences in the film layer, thereby improving the stability and reliability of the display panel.

[0004] In a first aspect, embodiments of this application provide a display panel. The display panel includes a substrate, a functional layer, and a touch metal layer; the functional layer and the touch metal layer are sequentially stacked on the substrate; the functional layer includes a first region and a second region, the second region surrounds the first region, the second region is provided with a first step structure, the number of the first step structures is greater than or equal to N, where N is an integer greater than or equal to 2, the N first step structures are arranged along the direction from the first region to the second region, and the touch metal layer extends from the first region to the first step structure.

[0005] Understandably, the touch metal layer is deposited on the functional layer and can extend from the first region to the second region. After the touch metal layer is deposited, during the patterning process of the touch metal layer, photoresist is applied to the surface of the touch metal layer away from the functional layer. If the step difference at the connection between the first and second regions of the functional layer is large, it will lead to insufficient exposure of the photoresist at the step difference. The photoresist is likely to remain on the sidewalls of the functional layer (the sidewalls are the locations with large step differences in the functional layer). The touch metal layer on the sidewalls of the functional layer is protected by the residual photoresist and cannot be completely removed. The touch metal layer remains at the step difference, connecting the two adjacent parts of the originally independent touch metal layer together, causing a short circuit in the touch metal layer and rendering the touch metal layer malfunctioning.

[0006] This application embodiment, by providing at least two first-step structures in the second region, i.e., a multi-level stepped structure design, helps to solve the problem of etching residue in the touch metal layer caused by large step differences in the functional layers. The step difference of each first-step structure is relatively small, allowing for more sufficient exposure of the photoresist and preventing etching residue in the touch metal layer at high step differences from causing short circuits in the touch metal layer. This ensures the stability and reliability of the touch metal layer and the display panel. The process of this application is simple and easy to implement.

[0007] In one possible implementation, the functional layer includes a first sub-functional layer and a second sub-functional layer, which are sequentially stacked on the substrate. The projection of the first sub-functional layer onto the upper surface of the substrate is smaller than the projection of the second sub-functional layer onto the upper surface of the substrate. In other words, a portion of the second sub-functional layer exposes the edge of the first sub-functional layer, and this exposed portion can form at least one first step structure. When the functional layer has N first step structures, it is difficult to form N first step structures on a single deposited film layer, and the more first step structures there are, the greater the process difficulty in forming multiple first step structures. This application embodiment sets a functional layer including a first sub-functional layer and a second sub-functional layer, and the projection of the first sub-functional layer on the upper surface of the substrate is smaller than the projection of the second sub-functional layer on the upper surface of the substrate. Both the second sub-functional layer and the first sub-functional layer form a first step structure. When manufacturing the display panel, the second sub-functional layer is deposited on the substrate first, and then the first sub-functional layer is deposited. The second sub-functional layer and the first sub-functional layer deposited in two separate steps can both form a first step structure. That is, the first step structure is formed on both types of film layers deposited in two separate steps. The two types of film layers deposited in two separate steps together form N first step structures, avoiding the formation of N first step structures on a single film layer deposited in one step. This effectively reduces the process difficulty of forming N first step structures, which is beneficial to reducing the manufacturing difficulty of the display panel and improving the product yield.

[0008] In one possible implementation, the first sub-functional layer includes at least two first step structures, and / or the second sub-functional layer includes at least two first step structures. By setting the first sub-functional layer to include at least two first step structures, and / or the second sub-functional layer to include at least two first step structures, it is beneficial to increase the number of first step structures. An increased number of first step structures results in smaller step differences between each first step structure, allowing for more thorough photoresist exposure. This prevents etching residues in the touch metal layer at high step differences from causing short circuits in the touch metal layer, thus ensuring the stability and reliability of the touch metal layer and the display panel.

[0009] In one possible implementation, the functional layer includes a first sub-functional layer and a second sub-functional layer, which are sequentially stacked on the substrate. The projection of the first sub-functional layer onto the upper surface of the substrate is larger than the projection of the second sub-functional layer onto the upper surface of the substrate. In other words, the first sub-functional layer covers the second sub-functional layer. By setting the projection of the first sub-functional layer onto the upper surface of the substrate to be larger than the projection of the second sub-functional layer onto the upper surface of the substrate, the dimensions and relative relationship of the first and second sub-functional layers are flexible and can be configured as needed.

[0010] In one possible implementation, the distance between the edge of the first sub-functional layer and the edge of the second sub-functional layer is greater than or equal to 1 μm. By setting the distance between the edge of the first sub-functional layer and the edge of the second sub-functional layer to be greater than or equal to 1 μm, more first step structures can be set on the first sub-functional layer, allowing for more complete exposure of the photoresist, preventing etching residues in the touch metal layer at high step differences from causing short circuits in the touch metal layer, and ensuring the stability and reliability of the touch metal layer and the display panel.

[0011] In one possible implementation, the first sub-functional layer is a planarization layer, and the second sub-functional layer is a light-shielding layer. The main function of the planarization layer is to protect the underlying light-shielding layer and provide a smooth surface for subsequent processes. Furthermore, in the privacy display module architecture, by changing the thickness of the planarization layer, the light emission angle and optical path distance between different light-shielding layers can be adjusted, thereby ensuring the privacy effect. After the photolithography process, the planarization layer has a very large edge difference. The light-shielding layer can be a black matrix, which can block part of the light emitted by the pixels of the display panel, giving the display panel privacy characteristics. This embodiment of the application, by setting the first sub-functional layer as a planarization layer and the second sub-functional layer as a light-shielding layer, and designing a multi-level stepped structure for the film layers with large edge differences, helps to prevent etching residues in the touch metal layer at high edge differences from causing short circuits in the touch metal layer, ensuring the stability and reliability of the touch metal layer and the display panel.

[0012] In one possible implementation, the first thickness of the second sub-functional layer is less than or equal to 3 μm. By setting the first thickness of the second sub-functional layer to less than or equal to 3 μm, the step difference of each first step structure on the second sub-functional layer is relatively small, the photoresist is exposed more fully, and etching residues in the touch metal layer at high step differences are prevented from causing short circuits in the touch metal layer, thus ensuring the stability and reliability of the touch metal layer and the display panel.

[0013] In one possible implementation, the second thickness of the first step structure of the first sub-functional layer is less than or equal to 5 μm. By setting the second thickness of the first step structure of the first sub-functional layer to be less than or equal to 5 μm, the step difference of each first step structure on the first sub-functional layer is relatively small, the photoresist is exposed more fully, and etching residues in the touch metal layer at high step differences are prevented from causing short circuits in the touch metal layer, thus ensuring the stability and reliability of the touch metal layer and the display panel.

[0014] In one possible implementation, the width of the first step structure is greater than or equal to 0.5 μm in the arrangement direction from the first region to the second region. By setting the width of the first step structure to be greater than or equal to 0.5 μm, the photoresist exposure is more complete, preventing etching residues in the touch metal layer at high-step locations from causing short circuits in the touch metal layer, thus ensuring the stability and reliability of the touch metal layer and the display panel.

[0015] In one possible implementation, the slope angle of the first step structure is greater than or equal to 5° and less than or equal to 90°. Setting the slope angle of the first step structure to be greater than or equal to 5° and less than or equal to 90° helps to ensure more complete exposure of the photoresist, prevents etching residues in the touch metal layer at high-step areas from causing short circuits in the touch metal layer, ensures the stability and reliability of the touch metal layer and the display panel, and also helps to reduce the manufacturing difficulty of the first step structure. When the slope angle of the first step structure is less than 5°, the number of first step structures required increases, and the more first step structures there are, the greater the manufacturing difficulty.

[0016] In one possible implementation, the step surface of the first step structure is arc-shaped, and the chamfer of the step surface is less than 90°. By setting the step surface to be arc-shaped and the chamfer of the step surface to be less than 90°, it is beneficial to allow for more complete exposure of the photoresist, prevent etching residues in the touch metal layer at high-step locations from causing short circuits in the touch metal layer, ensure the stability and reliability of the touch metal layer and the display panel, and also help reduce the manufacturing difficulty of the first step structure.

[0017] In one possible implementation, the third thickness of the functional layer is less than or equal to 10 μm. By setting the third thickness of the functional layer to less than or equal to 10 μm, the step difference of each first step structure on the functional layer is relatively small, the photoresist is exposed more fully, and etching residues in the touch metal layer at high step differences are prevented from causing short circuits in the touch metal layer, thus ensuring the stability and reliability of the touch metal layer and the display panel.

[0018] In one possible implementation, the touch-sensitive metal layer includes a second stepped structure, the slope angle of which is the same as that of the first stepped structure, or the chamfer of the step surface of the second stepped structure is the same as that of the step surface of the first stepped structure. The touch-sensitive metal layer can be bonded to the functional layer to achieve a compact arrangement of the layer structure of the display panel.

[0019] Secondly, this application provides a display module, including a cover plate and a display panel as described in any of the foregoing embodiments, wherein the cover plate is located on the light-emitting side of the display panel.

[0020] Thirdly, this application provides an electronic device, including a housing and a display module as described in any of the foregoing embodiments, wherein the display module is disposed in the housing. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0022] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application; Figure 2 yes Figure 1 The diagram shown is a structural schematic of a display module. Figure 3 yes Figure 2 The diagram shows a partial structural representation of the display panel. Figure 4A yes Figure 2 The diagram shows the structure of the display panel. Figure 4B yes Figure 2 The diagram shows the structural diagram of the functional layers of the display panel. Figure 5 yes Figure 2 Another structural diagram of a partial area of ​​the display panel is shown; Figure 6 yes Figure 5 The diagram shows a structural schematic of a portion of the display panel during its fabrication process. Figure 7 This is a structural diagram of the display panel from another perspective; Figure 8 yes Figure 5 The diagram shows a flowchart of the manufacturing process for a partial area of ​​the display panel. Figure 9 yes Figure 2 Another structural diagram of a partial area of ​​the display panel is shown; Figure 10 yes Figure 2Another structural diagram of a partial area of ​​the display panel is shown; Figure 11 yes Figure 2 Another structural diagram of a partial area of ​​the display panel is shown; Figure 12 yes Figure 2 Another structural diagram of a partial area of ​​the display panel is shown; Figure 13 yes Figure 2 Another structural diagram of a partial area of ​​the display panel is shown; Figure 14 yes Figure 2 Another structural diagram of a partial area of ​​the display panel is shown; Figure 15 yes Figure 2 The diagram shows another structural schematic of a partial area of ​​the display panel. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] It should be understood that the terms "first," "second," etc., used in this application are for distinguishing purposes only and should not be construed as indicating or implying relative importance or order.

[0025] In the description of this application, the terms "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0026] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, a mating connection, or an integral connection; those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] like Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of this application. Figure 2 yes Figure 1The diagram shows a possible structure of the display module 20. The electronic device 100 can be a tablet computer, laptop computer, candybar phone, foldable phone, watch, wristband, monitor, in-vehicle display, or television, etc. Figure 1 Take electronic device 100 as an example, which is a candybar mobile phone.

[0028] It is understood that, for ease of description, the display module 20 is defined in the following text as having a first direction X, a second direction Y, and a third direction Z. The first direction X and the second direction Y are set at an angle, and the second direction Y and the third direction Z are set at an angle. The first direction X, the second direction Y, and the third direction Z are different from each other. For example, the first direction X is the width direction of the display module 20, the second direction Y is the length direction of the display module 20, and the third direction Z can be the thickness direction of the display module 20. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other. For example, the first direction X is perpendicular to the second direction Y, and the third direction Z is perpendicular to both the first direction X and the second direction Y. In other embodiments, the coordinate system of the display module 20 can be flexibly set according to specific actual needs.

[0029] The electronic device 100 may include a housing 10 and a display module 20. The display module 20 is disposed on the housing 10. Exemplarily, the housing 10 may include a middle frame 11 and a rear shell 12, which may be integrally formed or separate structures connected by assembly. The display module 20 and the rear shell 12 are located on opposite sides of the middle frame 11 and spaced apart, and the display module 20, the rear shell 12, and the middle frame 11 together form a receiving space. The receiving space can be used to house components of the electronic device 100, such as a motherboard, battery, receiver, or microphone.

[0030] The display module 20 may include a display panel 30 and a cover plate 40. The display panel 30 and the cover plate 40 are stacked, with the cover plate 40 located on the light-emitting side 301 of the display panel 30. The cover plate 40 covers at least a portion of the display panel 30 and is fixedly connected to the display panel 30. For example, the display module 20 may include a connecting layer 21, through which the cover plate 40 is fixedly connected to the display panel 30. The connecting layer 21 may be optically clear adhesive (OCA). The cover plate 40 allows for user touch operation and may be made of transparent glass, plastic, or other materials with good light transmittance. Light emitted from the display panel 30 enters the cover plate 40 through the light-emitting side 301 and exits the cover plate 40.

[0031] The display module 20 can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), or a mini light-emitting diode (Mini Light-Emitting Diode). (e.g., Mini LED). The display module 20 can be used to display images, meeting multiple user needs. This application embodiment does not limit the specific structure of the display module 20; it can be configured as needed.

[0032] Electronic device 100 may include a camera module 101. The camera module 101 is mounted in an accommodating space. The camera module 101 can function as a front-facing camera module or a rear-facing camera module. For example, electronic device 100 may include two camera modules 101, with one camera module 101 serving as a front-facing camera module. Figure 1 The camera module 101 in the field of view is the front camera module of the electronic device 100, and the other camera module 101 is the rear camera module (the rear camera module is exposed on the side where the rear shell 12 is located). Figure 1 The shape, size, and installation position of the front-facing camera module shown are merely illustrative and are not strictly limited in this application. For example, in some other embodiments, the front-facing camera module 101 may also be installed in other locations on the electronic device 100, such as the upper right corner. In other embodiments, the electronic device 100 may also include one camera module 101 or three camera modules 101, etc., and this application does not limit this. The camera module 101 can be used for selfies or for the photographer to photograph other objects.

[0033] Figure 1 The electronic device 100 in this application is only schematic; its size, shape, structure, etc., can be customized as needed. This application does not limit the specific structure of the electronic device 100.

[0034] like Figure 3 , Figure 4A and Figure 4B As shown, Figure 3 yes Figure 2 The diagram shows a partial structural representation of the display panel 30. Figure 4A yes Figure 2 The diagram shows the structure of the display panel 30. Figure 4B yes Figure 2 The diagram shows the structure of the functional layer 32 of the display panel 30. The display panel 30 may include a substrate 31, a functional layer 32, and a touch metal layer 33.

[0035] Exemplarily, substrate 31 can be a thin film encapsulation substrate (TFE substrate), also known as a TFE substrate. Substrate 31 can be an inorganic-organic-inorganic overlapping thin film encapsulation structure formed through processes such as chemical vapor deposition, inkjet printing, exposure, development, etching, and resist stripping. This application embodiment does not limit the structure or manufacturing process of substrate 31 and can be configured as needed. Below the TFE substrate, there is also a thin film transistor array substrate (TFT array substrate) and an organic light-emitting diode (OLED) device. The thin film transistor array substrate is also called a TFT array substrate. The OLED device is closer to substrate 31 than the TFT array substrate.

[0036] The functional layer 32 and the touch metal layer 33 are sequentially stacked on the substrate 31. Exemplarily, when fabricating the display panel 30, the functional layer 32 can be deposited on the substrate 31 first, and then the touch metal layer 33 can be deposited after the functional layer 32 is deposited. It is understood that other film layers can also be disposed between the substrate 31 and the functional layer 32, between the functional layer 32 and the touch metal layer 33, and between the touch metal layer 33 and the connecting layer 21. This application embodiment does not limit the specific structure of the display panel 30 and can be configured as needed.

[0037] The functional layer 32 may include a first region 321 and a second region 322, with the second region 322 surrounding the first region 321. For example, the first region 321 may be the central region of the functional layer 32, and the second region 322 may be an edge region of the functional layer 32, surrounding the central region. The second region 322 may have first step structures 323, the number of which is greater than or equal to N, where N is an integer greater than or equal to 2. For example, the value of N may be 2, 3, 4, 5, 6, 7, or 8, etc. Figure 3 Taking a value of N of 2 as an example. The first step structure 323 can be located on the left, right and lower sides of the first region 321, or the first step structure 323 can be located on the left, right, upper and lower sides of the first region 321, or the first step structure 323 can also be located on other sides of the first region 321. The specific configuration can be set as needed, and this application embodiment does not limit this.

[0038] N first-step structures 323 are arranged along the direction from the first region 321 to the second region 322. Taking the second region 322 on the left side of the first region 321 as an example, the N first-step structures 323 are arranged from right to left, that is, along... Figure 4BThe dashed arrows pointing to the left are arranged in a central direction. The first step structure 323 on the right, upper, and lower sides respectively follows... Figure 4B The dashed arrows pointing to the right, top, and bottom are arranged in a central direction. In other words, Figure 4B The four dashed arrows in the diagram indicate the arrangement direction of the first step structure 323 on the left, right, top, and bottom sides.

[0039] The touch panel trace layer 33, also known as the TP metal trace, can extend from the first region 321 to the first step structure 323. Exemplarily, the touch panel trace layer 33 can be a mesh-like metal trace formed on the functional layer 32 through processes such as film formation, exposure, development, etching, and resist stripping. The material of the touch panel trace layer 33 can be metals, metal oxides, or alloys such as titanium, aluminum, silver, and indium tin oxide. This application embodiment does not limit the structure, material, or manufacturing process of the touch panel trace layer 33; it can be set as needed.

[0040] See Figure 4A and Figure 4B The display panel 30 may include a display area 302 and a non-display area 303. The display area 302 can display images, and the non-display area 303 surrounds the display area 302. The non-display area 303 may include a setting area 304. The setting area 304 can be used to set N first step structures 323. The traces of the touch metal layer 33 extend from the display area 302 across the first step structures to the non-display area 303, and finally converge on the lower side of the non-display area 303 and connect to the circuit on the TFT array substrate through the wire exchange hole. It can be understood that both the display area 302 and the non-display area 303 include a multi-layer structure arranged in the third direction Z. The first region 321 is the region where the functional layer 32 is located in the display area 302, and the second region 322 is the region where the functional layer 32 is located in the non-display area 303.

[0041] like Figure 5 and Figure 6 As shown, Figure 5 yes Figure 2 The diagram shows another structural representation of a partial area of ​​the display panel 30. Figure 6 yes Figure 5 The diagram shows a structural schematic of a portion of the display panel 30 during its fabrication process. Figure 5 and Figure 6 The display panel 30 shown is Figure 3 The main difference in the display panel 30 shown is the number of first step structures 323. Figure 6 The photoresist 34 needs to be removed during subsequent manufacturing processes, meaning that photoresist 34 will not be present in the final product. The structure of the product after removing photoresist 34 can be found in [reference needed]. Figure 5.

[0042] Figure 5 and Figure 6 The first step structure 323 of the display panel 30 has three parts, that is, the value of N is 3. With the thickness of the functional layer 32 remaining unchanged, increasing the number of first step structures 323 helps to solve the problem of etching residue in the touch metal layer 33 caused by the large step difference of the functional layer 32. As the number of first step structures 323 increases, the etching residue problem in the touch metal layer 33 becomes less. Figure 6 The dashed arrows in the diagram represent light. During the fabrication of the display panel 30, a photoresist 34 (PR) is provided on the top of the touch metal layer 33, and light shines on the photoresist 34.

[0043] like Figure 7 As shown, Figure 7 This is a structural schematic diagram of the display panel 30 from another perspective. Figure 7 The views shown in (a) and (b) are top-down and slightly tilted structural diagrams of the display panel 30, illustrating its structure in the planes containing the first direction X and the second direction Y, as well as its structure in the third direction Z (thickness direction). To clearly show the structure of the functional layer 32 and the touch metal layer 33, Figure 7 Not shown in (b) Figure 5 and Figure 6 The touch buffer layer and insulating layer 35 are described later. Figure 5 It can be Figure 7 The cross-sectional view shown in (b) is at BB. Figure 6 It can be Figure 7 The cross-sectional view shown in (a) at AA is intended to clearly show the touch metal layer 33. Figure 7 (a) is not shown Figure 6 The photoresist 34 in the middle.

[0044] Understandably, in the actual production process, Figure 7 As shown in (a), after the touch metal layer 33 is deposited, there is no boundary line in the touch metal layer 33, and the touch metal layer 33 is a continuous film layer. Figure 7 As shown in (a), the four dividing lines divide the touch metal layer 33 into five parts along the second direction Y, simply to distinguish it from other parts. Figure 7 The comparison shown in (b) illustrates the portion of the touch metal layer 33 that has been etched away.

[0045] Figure 7As shown in (a), this is the display panel 30 after the deposition of the touch metal layer 33. After the deposition of the touch metal layer 33, the touch metal layer 33 completely covers the functional layer below. After the touch metal layer 33 is deposited, it needs to be patterned. After the touch metal layer 33 is patterned, the desired result can be obtained. Figure 7 The display panel 30 shown in (b). During the patterning process of the touch metal layer 33, a portion of the touch metal layer 33 is etched away, while the other portion of the touch metal layer 33 is retained. After the partial removal of the touch metal layer 33, the underlying functional layer 32 is exposed.

[0046] See also Figure 5 , Figure 6 and Figure 7 During the patterning process of the touch metal layer 33, if the step difference of the functional layer 32 is large, the photoresist 34 at the step difference will be insufficiently exposed. The photoresist 34 is likely to remain on the sidewall of the functional layer 32 (the sidewall is the position where the step difference of the functional layer 32 is large). The touch metal layer 33 on the sidewall of the functional layer 32 is protected by the residual photoresist 34 and cannot be completely removed. The touch metal layer 33 remains at the step difference, which overlaps the two adjacent parts of the originally independent touch metal layer 33, causing the touch metal layer 33 to short circuit and the function of the touch metal layer 33 to fail.

[0047] This application embodiment, by providing at least two first-step structures 323 in the second region 322, i.e., a multi-level stepped structure design, helps to solve the problem of etching residue in the touch metal layer 33 caused by large step differences in the functional layer 32. The step difference of each first-step structure 323 is relatively small, allowing for more sufficient exposure of the photoresist 34. This prevents etching residue in the touch metal layer 33 at high step differences from causing short circuits in the touch metal layer 33, ensuring the stability and reliability of the touch metal layer 33 and the display panel 30. The process of this application is simple and easy to implement.

[0048] See Figure 3 and Figure 5 The substrate 31 may include an upper surface 311 and a lower surface 312 arranged at intervals along the third direction Z, and the functional layer 32 is deposited on the upper surface 311.

[0049] The functional layer 32 may include a first sub-functional layer 324 and a second sub-functional layer 325, which are sequentially stacked on the substrate 31. For example, when manufacturing the display panel 30, the second sub-functional layer 325 may be deposited on the substrate 31 first, and the first sub-functional layer 324 may be deposited after the second sub-functional layer 325 is deposited.

[0050] In some embodiments, the projection of the first sub-functional layer 324 onto the upper surface 311 of the substrate 31 is smaller than the projection of the second sub-functional layer 325 onto the upper surface 311 of the substrate 31. In other words, a portion of the second sub-functional layer 325 exposes the edge of the first sub-functional layer 324, and the portion of the second sub-functional layer 325 exposing the edge of the first sub-functional layer 324 can form at least one first step structure 323. When the functional layer 32 has N first step structures 323, it is difficult to form N first step structures 323 on a film layer deposited in one step. Moreover, the more first step structures 323 there are, the greater the process difficulty in forming multiple first step structures 323. In this embodiment, the functional layer 32 includes a first sub-functional layer 324 and a second sub-functional layer 325. The projection of the first sub-functional layer 324 onto the upper surface 311 of the substrate 31 is smaller than the projection of the second sub-functional layer 325 onto the upper surface 311 of the substrate 31. Both the second sub-functional layer 325 and the first sub-functional layer 324 form a first step structure 323. When manufacturing the display panel 30, the second sub-functional layer 325 is deposited on the substrate 31 first, and then the first sub-functional layer 324 is deposited. Both the second sub-functional layer 325 and the first sub-functional layer 324, deposited in two separate steps, can form the first step structure 323. That is, the first step structure 323 is formed on both of the two deposited film layers. The two film layers deposited in two steps together form N first step structures 323, avoiding the formation of N first step structures 323 on a single film layer. This effectively reduces the process difficulty of forming N first step structures 323, which is beneficial to reducing the manufacturing difficulty of the display panel 30 and improving the product yield.

[0051] In some embodiments, the first sub-functional layer 324 can be an overcoat (OC), and the second sub-functional layer 325 can be a light-shielding layer, which can also be a black matrix (BM). The main function of the overcoat is to protect the underlying light-shielding layer and provide a flat surface for subsequent processes. Furthermore, in the privacy display module architecture, by changing the thickness of the overcoat, the light emission angle and optical path distance between different light-shielding layers can be adjusted, thereby ensuring the privacy effect. After the photolithography process, the overcoat has a very large edge step difference. The black matrix can block some of the light emitted by the pixels of the display panel 30, giving the display panel 30 privacy characteristics. For example, small-angle light emitted by the pixels of the display panel 30 is not blocked by the black matrix and can exit the display panel 30, while large-angle light emitted by the pixels of the display panel 30 is blocked by the black matrix and cannot exit the display panel 30. Thus, when a user uses the electronic device from a frontal viewpoint, the user's eyes can receive the small-angle light emitted by the pixels of the display panel 30, allowing the user to clearly see the content of the display panel 30. Personnel viewed from the side will not receive the wide-angle light emitted by the pixels of the display panel 30, and therefore will not be able to see the content of the display panel 30, thus achieving the privacy function of the display panel 30.

[0052] The planarization layer can be formed on a black matrix through processes such as film formation, exposure, development, or inkjet printing. The material of the planarization layer can be organic polymers such as polyimide, siloxane, polyamide, and acrylic. This application does not limit the structure, material, or manufacturing process of the planarization layer; it can be configured as needed.

[0053] The black matrix can be formed on the substrate 31 through processes such as film formation, exposure, and development. The material of the black matrix can be organic polymers such as polyimide, siloxane, polyamide, and acrylic. The embodiments of this application do not limit the structure, material, or manufacturing process of the black matrix, and can be set as needed.

[0054] In other embodiments, the first sub-functional layer 324 may not be a planarization layer, and the second sub-functional layer 325 may not be a light-shielding layer. The embodiments of this application do not limit the type of the first sub-functional layer 324 and the second sub-functional layer 325. Some film layers with large step differences in the display panel 30 can adopt the multi-level stepped structure design of this application.

[0055] See Figure 5The first sub-functional layer 324 may include at least two first step structures 323. The second sub-functional layer 325 may include at least one first step structure 323. For example, the first sub-functional layer 324 includes two first step structures 323, and the second sub-functional layer 325 includes one first step structure 323. By setting the first sub-functional layer 324 to include at least two first step structures 323, it is beneficial to increase the number of first step structures 323. With an increased number of first step structures 323, the step difference of each first step structure 323 is smaller, the photoresist 34 is exposed more fully, and etching residues in the touch metal layer 33 at high step differences are prevented from causing short circuits in the touch metal layer 33, thus ensuring the stability and reliability of the touch metal layer 33 and the display panel 30.

[0056] See again Figure 3 In other embodiments, the first sub-functional layer 324 may include a first step structure 323, and the second sub-functional layer 325 may include a first step structure 323. This application embodiment does not limit the number of first step structures 323 in the first sub-functional layer 324, nor does it limit the number of first step structures 323 in the second sub-functional layer 325; these can be set as needed.

[0057] See Figure 3 and Figure 5 The first thickness H1 of the second sub-functional layer 325 is less than or equal to 3 μm. The first thickness H1 of the second sub-functional layer 325 refers to the dimension of the second sub-functional layer 325 in the third direction Z. For example, the first thickness H1 of the second sub-functional layer 325 can be 0.5 μm, 1 μm, 1.5 μm, 1.8 μm, 2 μm, or 2.5 μm, etc.

[0058] By setting the first thickness H1 of the second sub-functional layer 325 to be less than or equal to 3μm, the step difference of each first step structure 323 on the second sub-functional layer 325 is relatively small, the photoresist 34 is exposed more fully, and the etching residue of the touch metal layer 33 at high step differences is prevented from causing short circuits in the touch metal layer 33, thus ensuring the stability and reliability of the touch metal layer 33 and the display panel 30.

[0059] In other embodiments, the first thickness H1 of the second sub-functional layer 325 can be greater than 3 μm. For example, the first thickness H1 of the second sub-functional layer 325 can be 3.5 μm, 4 μm, 4.3 μm, 4.5 μm, 4.8 μm, or 5 μm, etc. This application embodiment does not limit this and can set it as needed.

[0060] See Figure 3 and Figure 5The second thickness H2 of the first step structure 323 of the first sub-functional layer 324 is less than or equal to 5 μm. The second thickness H2 of the first step structure 323 of the first sub-functional layer 324 refers to the dimension of the first step structure 323 in the third direction Z of the first sub-functional layer 324. Furthermore, the second thickness H2 of the first step structure 323 of the first sub-functional layer 324 refers to the thickness of one first step structure 323 of the first sub-functional layer 324. When there are two or more first step structures 323 in the first sub-functional layer 324, the thickness of each first step structure 323 of the first sub-functional layer 324 is H2. For example, the second thickness H2 of the first step structure 323 of the first sub-functional layer 324 can be 0.5 μm, 1 μm, 1.5 μm, 1.8 μm, 2 μm, 2.5 μm, 2.7 μm, 3 μm, 3.5 μm, 4 μm, or 4.5 μm, etc.

[0061] By setting the second thickness H2 of the first step structure 323 of the first sub-functional layer 324 to be less than or equal to 5μm, the step difference of each first step structure 323 on the first sub-functional layer 324 is relatively small, the photoresist 34 is exposed more fully, and the etching residue of the touch metal layer 33 at high step differences is prevented from causing short circuits in the touch metal layer 33, thus ensuring the stability and reliability of the touch metal layer 33 and the display panel 30.

[0062] Understandably, the second thickness H2 of the different first step structures 323 in the first sub-functional layer 324 can be the same or different, for example, Figure 5 The diagram shows two first step structures 323 of the first sub-functional layer 324, namely... Figure 5 The diagram shows two H2 values, which can be the same or different.

[0063] In other embodiments, the second thickness H2 of the first step structure 323 of the first sub-functional layer 324 can be greater than 5 μm. For example, the second thickness H2 of the first step structure 323 of the first sub-functional layer 324 can be 5.5 μm, 6 μm, 6.2 μm, 6.5 μm, 6.8 μm, or 7 μm, etc. This application embodiment does not limit this and can set it as needed.

[0064] See Figure 3 and Figure 5The third thickness H3 of functional layer 32 is less than or equal to 10 μm. The third thickness H3 of functional layer 32 refers to the dimension of functional layer 32 in the third direction Z. For example, the third thickness H3 of functional layer 32 can be 0.5 μm, 1 μm, 1.5 μm, 1.7 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 6.6 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, or 9.5 μm, etc. It can be understood that... Figure 3 In the equation H3 = H1 + H2, Figure 5 In the equation, H3 = H1 + H2 + H2.

[0065] By setting the third thickness H3 of the functional layer 32 to be less than or equal to 10μm, the step difference of each first step structure 323 on the functional layer 32 is relatively small, the photoresist 34 is exposed more fully, and the etching residue of the touch metal layer 33 at high step differences is prevented from causing short circuits in the touch metal layer 33, thus ensuring the stability and reliability of the touch metal layer 33 and the display panel 30.

[0066] In other embodiments, the third thickness H3 of the functional layer 32 can be greater than 10 μm. For example, the third thickness H3 of the functional layer 32 can be 10.5 μm, 11 μm, 11.5 μm, 11.8 μm, or 12 μm, etc. This application embodiment does not limit this and can set it as needed.

[0067] See Figure 3 and Figure 5 In the arrangement direction from the first region to the second region, the width W of the first step structure 323 is greater than or equal to 0.5 μm. The width W of the first step structure 323 refers to the width W of one first step structure 323. When there are two or more first step structures 323, the width of each first step structure 323 is W. Exemplarily, the width W of the first step structure 323 may be 1 μm, 1.5 μm, 2 μm, 2.3 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 7.8 μm, 8 μm, 8.5 μm, 9 μm. m, 9.5μm, 10, 13μm, 18μm, 18.9μm, 20μm, 23μm, 25μm, 30μm, 35μm, 42μm, 50μm, 60μm, 65μm, 70μm, 75μm, 80μm, 88μm, 90μm, 95μm, 100μm or 118μm, etc.

[0068] By setting the width W of the first step structure 323 to be greater than or equal to 0.5μm, the photoresist 34 is exposed more fully, preventing etching residues in the touch metal layer 33 at high step differences from causing short circuits in the touch metal layer 33, thus ensuring the stability and reliability of the touch metal layer 33 and the display panel 30.

[0069] Understandably, the width W of different first-step structures 323 can be the same or different, for example, Figure 3 The diagram shows two first-step structures 323, namely Figure 5 The diagram shows two W values, which can be the same or different. Figure 5 The diagram shows three first-step structures 323, namely Figure 5 The diagram shows three W values, which can be the same or different.

[0070] In other embodiments, the width W of the first step structure 323 may be less than 0.5 μm. For example, the width W of the first step structure 323 may be 0.35 μm, 0.39 μm, 0.43 μm, 0.45 μm or 0.48 μm, etc.

[0071] See Figure 3 and Figure 5 The slope angle of the first step structure 323 can be greater than or equal to 5° and less than or equal to 90°. Preferably, the slope angle of the first step structure 323 is less than or equal to 60°. Exemplarily, the slope angle of the first step structure 323 can be 8°, 10°, 15°, 20°, 23°, 30°, 36°, 42°, 45°, 50°, 55°, 57°, 60°, 66°, 70°, 75°, 77°, or 83°, etc.

[0072] Figure 3 The diagram shows two first-step structures 323, with slope angles α and β, respectively. Both α and β are greater than or equal to 5° and less than or equal to 90°, and the values ​​of α and β can be the same or different. Figure 3 The display panel 30 shown in the figure has α and β both less than 90°. For display panels 30 with α and β both equal to 90°, please refer to the following section. Figure 10 .

[0073] Figure 5 The diagram shows three first-step structures 323, with slope angles of α, β, and γ, respectively. α, β, and γ are all greater than or equal to 5° and less than or equal to 90°, and the values ​​of α, β, and γ can be the same or different. Figure 5 The display panel 30 shown in the figure has α, β, and γ all less than 90°. For a display panel 30 where α, β, and γ are all equal to 90°, please refer to the subsequent sections. Figure 10 .

[0074] By setting the slope angle of the first step structure 323 to be greater than or equal to 5° and less than or equal to 90°, it is beneficial to ensure more sufficient exposure of the photoresist 34, prevent etching residues in the touch metal layer 33 at high-step areas that could cause short circuits in the touch metal layer 33, and ensure the stability and reliability of the touch metal layer 33 and the display panel 30. It also helps to reduce the manufacturing difficulty of the first step structure 323. When the slope angle of the first step structure 323 is less than 5°, the number of first step structures 323 required increases, and the more first step structures 323 there are, the greater the manufacturing difficulty.

[0075] In other embodiments, with the advancement of technology, the slope angle of the first step structure 323 can also be set to be less than 5°. For example, the slope angle of the first step structure 323 can be 3°, 3.3°, 4°, 4.2° or 4.8°, etc. This application embodiment does not limit this.

[0076] See Figure 3 and Figure 5 The first step structure 323 may include a step surface 3231, which may be arc-shaped. The chamfer angle of the step surface 3231 is less than 90°. Preferably, the chamfer angle of the step surface 3231 is less than or equal to 60°. Exemplarily, the slope angle of the step surface 3231 may be 8°, 10°, 15°, 20°, 23°, 30°, 36°, 42°, 45°, 50°, 55°, 57°, 60°, 66°, 70°, 75°, 77°, or 83°, etc.

[0077] Figure 3 The diagram shows two first step structures 323, each with a step surface 3231. The chamfer angles of the two step surfaces 3231 are α and β, respectively. Both α and β are less than 90°, and the values ​​of α and β can be the same or different.

[0078] Figure 5 The diagram shows three first step structures 323, each with a step surface 3231. The chamfer angles of the three step surfaces 3231 are α, β, and γ, respectively. α, β, and γ are all less than 90°, and the values ​​of α, β, and γ can be the same or different.

[0079] By setting the step surface 3231 to be arc-shaped and the chamfer of the step surface 3231 to be less than 90°, it is beneficial to make the photoresist 34 more fully exposed, prevent the touch metal layer 33 from having etching residue at high step difference and causing short circuit of the touch metal layer 33, ensure the stability and reliability of the touch metal layer 33 and the display panel 30, and also help to reduce the manufacturing difficulty of the first step structure 323.

[0080] The touch metal layer 33 may include a second step structure 331, the slope angle of which is the same as that of the first step structure 323, or the chamfer angle of the step surface of the second step structure 331 is the same as that of the step surface of the first step structure 323. For distinction, the step surface of the second step structure 331 may be a second step surface, and the step surface of the first step structure 323 may be a first step surface. The second step structure 331 may be deposited on the first step structure 323, and the second step structure 331 may be attached to the first step structure 323. In other embodiments, the touch metal layer 33 may not be a step structure.

[0081] See Figure 3 and Figure 5 The display panel 30 may further include a buffer layer and a touch panel insulating layer 35 (buffer layer & Touch panel ins layer, buffer layer & TP ins layer), i.e., a buffer layer and a TP insulating layer. The buffer layer and touch panel insulating layer 35 are two-layer film structures, one layer being the buffer layer and the other the touch insulating layer. The buffer layer serves to connect the functional layer 32 and the touch metal layer 33. Direct contact between the touch metal layer 33 and the planarization layer can easily lead to metal etching residue, affecting the display effect. The touch insulating layer is disposed between the two metal layers to achieve insulation between them. The touch insulating layer may be located on top of the buffer layer. In some embodiments, the buffer layer may not be provided.

[0082] The buffer layer and touch insulating layer 35 can be formed on the functional layer 32 through processes such as film formation, exposure, development, etching, and resist stripping. The buffer layer and touch insulating layer 35 can be organic polymers such as polyimide, siloxane, polyamide, and acrylic, or inorganic materials such as SiNx, SiOx, and SiON. This application does not limit the structure, material, or manufacturing process of the buffer layer and touch insulating layer 35; they can be configured as needed.

[0083] Figure 5 The two first step structures 323 of the first sub-functional layer 324 can be formed by depositing the first sub-functional layer 324 in one step, and etching two first step structures 323 at the edge of the first sub-functional layer 324. For example, halftone, gray-tone and other processes can be used to form two first step structures 323, so that the step difference of each first step structure 323 is relatively small and it helps to reduce the slope angle of the first step structure 323.

[0084] like Figure 8 As shown, Figure 8 yes Figure 5The diagram shows a fabrication process for a partial area of ​​the display panel 30. A second sub-functional layer 325, a first sub-functional layer 324, a touch buffer layer & insulating layer 35, and a touch metal layer 33 are sequentially deposited on a substrate 31 to form the display panel 30. This application does not limit the specific structure of the display panel 30; it can be configured as needed. The display panel 30 may also include other film layers besides the second sub-functional layer 325, the first sub-functional layer 324, the touch buffer layer & insulating layer 35, and the touch metal layer 33.

[0085] like Figure 9 As shown, Figure 9 yes Figure 2 The diagram shows another structural schematic of a partial area of ​​the display panel 30. Figure 9 The display panel 30 shown is Figure 5 The main difference of the display panel 30 shown is that Figure 9 The two first step structures 323 of the first sub-functional layer 324 of the display panel 30 shown can be achieved by depositing the first sub-functional layer 324 twice. For example, with... Figure 9 The solid line in the first sub-functional layer 324 serves as the boundary. The portion of the first sub-functional layer 324 below the solid line is deposited once, and then the other portion of the first sub-functional layer 324 above the solid line is deposited. The first sub-functional layer 324 is deposited in two stages to form two first step structures 323 of the first sub-functional layer 324, which helps to reduce the manufacturing difficulty of at least two first step structures 323 of the first sub-functional layer 324. Figure 9 The fabrication method of the first sub-functional layer 324 shown can also be used in other embodiments.

[0086] Understandably, the second sub-functional layer 325 may be deposited once to form a first step structure 323, or the second sub-functional layer 325 may be deposited at least twice to form at least two first step structures 323.

[0087] like Figure 10 As shown, Figure 10 yes Figure 2 The diagram shows another structural schematic of a partial area of ​​the display panel 30. Figure 10 The display panel 30 shown is Figure 5 The main difference of the display panel 30 shown is that Figure 10 The slope angles α, β and γ of the three first step structures 323 of the display panel 30 shown are all equal to 90°.

[0088] In other embodiments, some of the slope angles α, β and γ of the three first step structures 323 may be less than 90° and some may be equal to 90°. This application embodiment does not limit this and can set it as needed.

[0089] like Figure 11As shown, Figure 11 yes Figure 2 The diagram shows another structural schematic of a partial area of ​​the display panel 30. Figure 11 The display panel 30 shown is Figure 5 The main difference in the display panel 30 shown is that... Figure 5 The step surface 3231 of the three first step structures 323 of the display panel 30 shown is an arc-shaped surface. Figure 11 The step surface 3231 of the three first step structures 323 of the display panel 30 shown is two planes. The specific structure, size, etc. of the first step structure 323 are not limited in this embodiment, and can be set as needed.

[0090] like Figure 12 As shown, Figure 12 yes Figure 2 The diagram shows another structural schematic of a partial area of ​​the display panel 30. Figure 12 The display panel 30 shown is Figure 5 The main difference of the display panel 30 shown is that Figure 12 The second sub-functional layer 325 of the display panel 30 shown includes two first step structures 323.

[0091] In some embodiments, the second sub-functional layer 325 may include at least two first step structures 323. By including at least two first step structures 323 in the second sub-functional layer 325, it is beneficial to increase the number of first step structures 323. With an increased number of first step structures 323, the step difference of each first step structure 323 is smaller, the photoresist 34 is exposed more fully, and etching residues in the touch metal layer 33 at high step differences are prevented from causing short circuits in the touch metal layer 33, thus ensuring the stability and reliability of the touch metal layer 33 and the display panel 30.

[0092] Understandably, the first sub-functional layer 324 may be configured to include at least two first step structures 323, and / or the second sub-functional layer 325 may include at least two first step structures 323.

[0093] like Figure 13 As shown, Figure 13 yes Figure 2 The diagram shows another structural schematic of a partial area of ​​the display panel 30. Figure 13 The display panel 30 shown is Figure 3 The main difference in the display panel 30 shown is that... Figure 3 The two first-step structures 323 are formed in the second sub-functional layer 325 and the other in the first sub-functional layer 324. Figure 13 The two first step structures 323 of the display panel 30 shown are both formed on the first sub-functional layer 324.

[0094] For example, the projection of the first sub-functional layer 324 onto the upper surface 311 of the substrate 31 is greater than the projection of the second sub-functional layer 325 onto the upper surface 311 of the substrate 31. In other words, the first sub-functional layer 324 covers the second sub-functional layer 325. By setting the projection of the first sub-functional layer 324 onto the upper surface 311 of the substrate 31 to be greater than the projection of the second sub-functional layer 325 onto the upper surface 311 of the substrate 31, the dimensions and relative relationship between the first sub-functional layer 324 and the second sub-functional layer 325 are flexible and can be set as needed.

[0095] In some embodiments, the distance L between the edge of the first sub-functional layer 324 and the edge of the second sub-functional layer 325 is greater than or equal to 1 μm. Figure 13 In the view shown, the distance L between the edge of the first sub-functional layer 324 and the edge of the second sub-functional layer 325 can be the distance between the point where the first sub-functional layer 324 falls on the substrate 31 and the point where the second sub-functional layer 325 falls on the substrate 31.

[0096] For example, the distance L between the edge of the first sub-functional layer 324 and the edge of the second sub-functional layer 325 can be 1.5μm, 2μm, 2.5μm, 3μm, 3.5μm, 4μm, 4.5μm, 5μm, 5.5μm, 6μm, 6.5μm, 7μm, 7.5μm, 7.8μm, 8μm, 8.5μm, 9μm, 9.5μm, 1 0. 13μm, 18μm, 18.9μm, 20μm, 23μm, 25μm, 30μm, 35μm, 42μm, 50μm, 60μm, 65μm, 7 0μm, 75μm, 80μm, 88μm, 90μm, 95μm, 100μm, 118μm, 130μm, 135μm, 140μm or 150μm, etc.

[0097] By setting the distance L between the edge of the first sub-functional layer 324 and the edge of the second sub-functional layer 325 to be greater than or equal to 1μm, more first step structures 323 can be set on the first sub-functional layer 324, so that the photoresist 34 is exposed more fully, preventing etching residues in the touch metal layer 33 at high step differences from causing short circuits in the touch metal layer 33, and ensuring the stability and reliability of the touch metal layer 33 and the display panel 30.

[0098] In other embodiments, the distance L between the edge of the first sub-functional layer 324 and the edge of the second sub-functional layer 325 can be less than 1 μm. For example, the distance L between the edge of the first sub-functional layer 324 and the edge of the second sub-functional layer 325 can be 0.8 μm, 0.83 μm, 0.89 μm, 0.94 μm or 0.98 μm, etc. The embodiments of this application do not limit this.

[0099] like Figure 14As shown, Figure 14 yes Figure 2 The diagram shows another structural schematic of a partial area of ​​the display panel 30. Figure 14 The display panel 30 shown is Figure 13 The main difference of the display panel 30 shown is that Figure 14 The number of first-step structures 323 in the shown display panel 30 is greater. For example, Figure 14 The first step structure 323 of the first sub-functional layer 324 can be three. As the number of first step structures 323 increases, the step difference of each first step structure 323 becomes smaller, the photoresist 34 is exposed more fully, and the etching residue of the touch metal layer 33 at high step differences is prevented from causing short circuits in the touch metal layer 33, thus ensuring the stability and reliability of the touch metal layer 33 and the display panel 30.

[0100] like Figure 15 As shown, Figure 15 yes Figure 2 The diagram shows another structural schematic of a partial area of ​​the display panel 30. Figure 15 The display panel 30 shown is Figure 14 The main difference of the display panel 30 shown is that Figure 15 The display panel 30 shown may not have a second sub-functional layer 325. The specific structure of the display panel 30 is not limited in this embodiment and can be set as needed.

[0101] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display panel (30), characterized in that, It includes a substrate (31), a functional layer (32) and a touch metal layer (33); The functional layer (32) and the touch metal layer (33) are sequentially stacked on the substrate (31). The functional layer (32) includes a first region (321) and a second region (322). The second region (322) surrounds the first region (321). The second region (322) is provided with a first step structure (323). The number of the first step structures (323) is greater than or equal to N, where N is an integer greater than or equal to 2. The N first step structures (323) are arranged along the direction from the first region (321) to the second region (322). The touch metal layer (33) extends from the first region (321) to the first step structure (323).

2. The display panel (30) as described in claim 1, characterized in that, The functional layer (32) includes a first sub-functional layer (324) and a second sub-functional layer (325). The second sub-functional layer (325) and the first sub-functional layer (324) are stacked sequentially on the substrate (31). The projection of the first sub-functional layer (324) on the upper surface (311) of the substrate (31) is smaller than the projection of the second sub-functional layer (325) on the upper surface (311) of the substrate (31).

3. The display panel (30) as described in claim 2, characterized in that, The first sub-functional layer (324) includes at least two first step structures (323), and / or the second sub-functional layer (325) includes at least two first step structures (323).

4. The display panel (30) as described in claim 1, characterized in that, The functional layer (32) includes a first sub-functional layer (324) and a second sub-functional layer (325). The second sub-functional layer (325) and the first sub-functional layer (324) are stacked sequentially on the substrate (31). The projection of the first sub-functional layer (324) on the upper surface (311) of the substrate (31) is greater than the projection of the second sub-functional layer (325) on the upper surface (311) of the substrate (31).

5. The display panel (30) as described in claim 4, characterized in that, The distance (L) between the edge of the first sub-functional layer (324) and the edge of the second sub-functional layer (325) is greater than or equal to 1 μm.

6. The display panel (30) as described in any one of claims 2-5, characterized in that, The first sub-functional layer (324) is a planarization layer, and the second sub-functional layer (325) is a light-shielding layer.

7. The display panel (30) as described in claim 6, characterized in that, The first thickness (H1) of the second sub-functional layer (325) is less than or equal to 3 μm.

8. The display panel (30) as described in any one of claims 2-7, characterized in that, The second thickness (H2) of the first step structure (323) of the first sub-functional layer (324) is less than or equal to 5 μm.

9. The display panel (30) as described in any one of claims 1-8, characterized in that, In the arrangement direction from the first region (321) to the second region (322), the width (W) of the first step structure (323) is greater than or equal to 0.5 μm.

10. The display panel (30) as described in any one of claims 1-9, characterized in that, The slope angle of the first step structure (323) is greater than or equal to 5° and less than or equal to 90°.

11. The display panel (30) as claimed in any one of claims 1-10, characterized in that, The step surface (3231) of the first step structure (323) is arc-shaped, and the chamfer of the step surface (3231) is less than 90°.

12. The display panel (30) as described in any one of claims 1-11, characterized in that, The third thickness (H3) of the functional layer (32) is less than or equal to 10 μm.

13. The display panel (30) as described in any one of claims 1-12, characterized in that, The touch metal layer (33) includes a second step structure (331), the slope angle of the second step structure (331) is the same as the slope angle of the first step structure (323), or the chamfer of the step surface of the second step structure (331) is the same as the chamfer of the step surface of the first step structure (323).

14. A display module (20), characterized in that, It includes a cover plate (40) and a display panel (30) as described in any one of claims 1-13, wherein the cover plate (40) is located on the light-emitting side (301) of the display panel (30).

15. An electronic device (100), characterized in that, It includes a housing (10) and a display module (20) as described in claim 14, wherein the display module (20) is disposed on the housing (10).

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