A tooling for sealing semiconductor ceramic holes

Abstract

This utility model relates to the field of semiconductor manufacturing equipment technology, and discloses a tooling for sealing holes in semiconductor ceramics. It is applied to the pressing and preparation of electrostatic chucks, and includes a sealing gasket body with a forming groove for fitting the workpiece to be pressed. The forming groove has multiple protrusions that fit into the holes of the workpiece. This solves the problem in existing WIP pressing processes where holes are manually sealed one by one with sealing materials, which is time-consuming, labor-intensive, and prone to omissions. Furthermore, if the holes are empty, deformation can easily occur, affecting product quality.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and specifically to a tooling for sealing semiconductor ceramic holes. Background Technology

[0002] Electrostatic chucks (ESCs) or heaters used in semiconductor manufacturing equipment are primarily manufactured through hot pressing sintering or tape casting processes, or a combination of both.

[0003] In the tape casting process, electrode patterns need to be printed on the green ceramic sheets 5, and these green ceramic sheets 5 need to be laminated. During this process, such as... Figure 1 As shown, different electrode patterns are designed on the green ceramic sheet according to different products. Additionally, electrode holes for assembly with the lower body and helium gas holes for cooling are also required. A ceramic plate is prepared by stacking green ceramic sheets 5, and then the ceramic plate 9 is bonded to the chuck body 8. Afterwards, components such as the electrode load 7 are assembled to create an electrostatic chuck (ESC). The preparation process is as follows: Figure 2 As shown.

[0004] However, in the ESC manufacturing process, during the WIP pressing process under warm isostatic pressing after the green ceramic sheet 5 is laminated, in order to prevent the electrode holes and helium gas holes 6 from being damaged during the preparation process, the holes are usually sealed manually with sealing materials one by one. This is time-consuming and labor-intensive, and it is easy to miss sealing. If the hole 6 is in a void state, it is easy to cause deformation and affect the product quality. Utility Model Content

[0005] In view of this, the present invention provides a tooling for sealing holes in semiconductor ceramics, to solve the problem that in the existing WIP pressing process, the holes are sealed one by one by manually using sealing materials, which is time-consuming and labor-intensive, and easy to miss sealing. If the hole is in a void state, it is easy to cause deformation and affect product quality.

[0006] This utility model provides a tooling for sealing holes in semiconductor ceramics, applied to the pressing and preparation of electrostatic chucks. It includes a sealing gasket body, on which a forming groove is provided for fitting and placing the part to be pressed; the forming groove is provided with a plurality of protrusions, which are adapted to pass through the holes of the part to be pressed.

[0007] In one alternative embodiment, the forming groove is interference-fitted with the part to be pressed.

[0008] In one alternative embodiment, the protrusion is interference-fitted with the hole.

[0009] In one alternative embodiment, the sealing gasket body is integrally formed with the protrusion.

[0010] In one alternative embodiment, the Shore A hardness of the protrusion is 10 to 70.

[0011] In one alternative embodiment, the protrusion and the sealing gasket body are made of rubber.

[0012] In one alternative embodiment, the protrusion and the sealing gasket body are made of thermally conductive silicone rubber.

[0013] In one alternative embodiment, the protrusion and the sealing gasket body are made of fluororubber.

[0014] The technical solution of this utility model has at least the following advantages: This invention places the workpiece to be pressed in a forming groove, and seals the holes in the workpiece with protrusions that are fitted one-to-one. This effectively covers the workpiece and its holes, preventing moisture intrusion during pressing and ensuring product quality. It also prevents the holes from becoming hollow, thus avoiding deformation or cracking during filler removal. After assembly, the workpiece is pressed into a ceramic plate using a WIP pressing process. The ceramic plate is then bonded to the chuck body and fitted with electrode loads and other components to form an electrostatic chuck, improving product quality. The protrusions in the forming groove are fitted one-to-one with the holes in the workpiece, eliminating the need for manual sealing of each hole and reducing the chance of missing any holes, thus improving assembly efficiency. After pressing, the sealing gasket can be used to pull all the protrusions out of the holes in the workpiece for easy separation, avoiding contamination or damage during removal, and facilitating the preparation of the next ceramic plate, resulting in a high reusability rate. Attached Figure Description

[0015] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 The first figure is the background diagram; Figure 2 The second figure is for the background art; Figure 3 This is a schematic diagram of the structure of a tooling for sealing semiconductor ceramic holes according to an embodiment of the present invention; Figure 4 This is a cross-sectional view of a tooling for sealing semiconductor ceramic holes according to an embodiment of the present invention during the separation of a ceramic plate.

[0017] Explanation of reference numerals in the attached figures: 1. Part to be pressed; 2. Sealing gasket body; 3. Molding groove; 4. Protrusion; 5. Green ceramic sheet; 6. Hole; 7. Electrode load; 8. Chuck body; 9. Ceramic plate. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0019] The following is combined with Figure 3 and Figure 4 The following describes embodiments of the present invention.

[0020] According to an embodiment of the present invention, a tooling for sealing semiconductor ceramic holes is provided, which is applied to the pressing preparation of electrostatic chucks. It includes a sealing gasket body 2, a forming groove 3 on the sealing gasket body 2, the forming groove 3 being adapted to place the part to be pressed 1; the forming groove 3 is provided with a plurality of protrusions 4, which are adapted to pass through the holes 6 of the part to be pressed 1.

[0021] It should be noted that the part to be pressed 1 is formed by stacking multiple green ceramic sheets 5 with printed electrode patterns.

[0022] WIP refers to Warm Isostatic Press. In the WIP pressing process, a high pressure of 5MPa to 30MPa is usually applied at a temperature of 70℃ to 85℃ to prepare the workpiece 1 to be pressed into an electrostatic chuck.

[0023] In this embodiment, it can be applied to the electrostatic chuck manufacturing process. Before the WIP pressing process, the part to be pressed 1 is first placed in the forming groove 3, and the protrusions 4 are fitted one-to-one into the holes 6 of the part to be pressed 1 to cover the part to be pressed 1 and its holes 6, so as to prevent moisture from entering and affecting product quality during the pressing process. The protrusions 4 seal the holes 6 of the part to be pressed 1 to prevent the holes 6 from being in a void state, thereby preventing deformation during the pressing process or cracking during the removal of filler. After assembly, the part to be pressed 1 is pressed into ceramic by the WIP pressing process. The ceramic plate 9 is then bonded to the chuck body 8 and loaded with components such as the electrode load 7 to form an electrostatic chuck, which improves product quality. The protrusions 4 in the forming groove 3 are matched one by one with the holes 6 of the part to be pressed 1, avoiding the need for manual sealing of each hole 6 of the part to be pressed 1, and reducing the chance of missing any hole 6, thus improving assembly efficiency. After pressing is completed, all the protrusions 4 can be pulled out from the holes 6 of the part to be pressed 1 by the sealing gasket body 2, which facilitates separation and avoids contamination or damage during the removal process, so as to facilitate the preparation of the next ceramic plate 9, resulting in a high reusability rate.

[0024] In one embodiment, the forming groove 3 is interference-fitted with the part to be pressed 1.

[0025] In this embodiment, the molding groove 3 is interference-fitted with the part to be pressed 1, so that the molding groove 3 can cover the part to be pressed 1, improve the sealing performance, prevent moisture intrusion, and ensure product quality.

[0026] In one embodiment, the protrusion 4 is interference-fitted with the hole 6.

[0027] In this embodiment, the protrusion 4 and the hole 6 are interference-fitted to improve the sealing performance of the protrusion 4 when sealing the hole 6, prevent moisture intrusion, and ensure product quality.

[0028] In one embodiment, such as Figure 4 As shown, the sealing gasket body 2 and the protrusion 4 are integrally formed.

[0029] In this embodiment, the sealing gasket body 2 and the protrusion 4 are integrally formed, which improves the structural strength and makes it easier for the sealing gasket body 2 to detach the protrusion 4 together with the hole 6 when detaching.

[0030] In one embodiment, the Shore A hardness of the protrusion 4 is 10 to 70.

[0031] In this embodiment, the Shore A hardness of the protrusion 4 is 10 to 70. This avoids the problem that the hardness is too low and it is difficult to penetrate into the hole 6 to seal the hole 6, and also avoids the problem that the hardness is too high and will cause the hole 6 to break during assembly. This facilitates separation from the part to be pressed 1, avoids residual contamination of the part to be pressed 1, and ensures product quality. The specific selection can be made according to actual needs.

[0032] In one alternative embodiment, the protrusion 4 and the sealing gasket body 2 are made of rubber.

[0033] In this embodiment, the protrusion 4 and the sealing gasket body 2 are made of rubber, which has a certain elasticity, improves the sealing performance of the part to be pressed 1, and is not easy to damage the hole 6, making it easy to separate.

[0034] In one embodiment, the protrusion 4 and the sealing gasket body 2 are made of thermally conductive silicone rubber.

[0035] In this embodiment, the protrusion 4 and the sealing gasket body 2 are made of thermally conductive silicone rubber, which has certain thermal conductivity and high temperature resistance, and also has a certain elasticity. This allows it to cover the part to be pressed 1, improve the sealing performance, and transfer heat to the part to be pressed 1 during the pressing process, ensuring the pressing quality of the product. Furthermore, it is not easily damaged or softened under high temperature and pressure, thus avoiding product contamination or damage when separated from the part to be pressed 1, and ensuring product quality.

[0036] As an alternative implementation, the protrusion 4 and the sealing gasket body 2 may also be made of fluororubber.

[0037] In this embodiment, the protrusion 4 and the sealing gasket body 2 are made of fluororubber, which has certain thermal conductivity and high temperature resistance, and also has a certain elasticity, so that it can cover the part to be pressed 1, improve the sealing performance, and transfer heat to the part to be pressed 1 during the pressing process, ensuring the pressing quality of the product, and is not easily damaged or softened under high temperature and high pressure, avoiding product contamination or damage when separated from the part to be pressed 1, thus ensuring product quality.

[0038] The specific working principle of the tooling for sealing semiconductor ceramic holes provided in this embodiment is as follows: First, the part to be pressed 1 is placed in the forming groove 3, and the protrusion 4 is adapted to pass through the hole 6 of the part to be pressed 1, so as to cover the part to be pressed 1 and its hole 6, and avoid moisture intrusion during the pressing process, which would affect the product quality. The protrusion 4 seals the hole 6 of the part to be pressed 1, preventing the hole 6 from being in a void state, thereby avoiding deformation during the pressing process or cracking during the removal of filler. After assembly, the part to be pressed 1 is pressed into a ceramic plate 9 through the WIP pressing process. After the ceramic plate 9 is bonded to the chuck body 8 and the electrode load 7 and other components are loaded, an electrostatic chuck is formed, which improves the product quality. Moreover, the protrusion 4 in the forming groove 3 is adapted to the hole 6 of the part to be pressed 1, avoiding the need for manual sealing of each hole 6 of the part to be pressed 1, which is not easy. In cases where a hole 6 is missed during sealing, this improves assembly efficiency. After pressing, all protrusions 4 can be pulled out of the hole 6 of the part to be pressed 1 via the sealing gasket body 2, facilitating separation and avoiding contamination or damage during removal. This allows for the preparation of the next electrostatic chuck, resulting in high reusability. Furthermore, the materials of the protrusions 4 and the sealing gasket body 2 can be selected as fluororubber or thermally conductive silicone rubber, which not only protects the hole 6 but also ensures the integrity of the encapsulation and thermal conductivity, thereby improving the reliability of the overall manufacturing process and the yield of finished products. In specific applications, it can also be applied to other technical fields to improve product performance. This solves the problem of manually sealing each hole 6 with sealing materials in the existing WIP pressing process, which is time-consuming, labor-intensive, and prone to omissions. If the hole 6 is in a void state, it is easy to cause deformation, affecting product quality.

[0039] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A tooling for sealing a semiconductor ceramic via, characterized by, The pressing preparation of electrostatic chucks includes a sealing gasket body (2), the sealing gasket body (2) is provided with a forming groove (3), the forming groove (3) is used to fit and place the part to be pressed (1); the forming groove (3) is provided with a plurality of protrusions (4), the protrusions (4) are adapted to pass through the holes (6) of the part to be pressed (1).

2. The tooling for sealing semiconductor ceramic holes according to claim 1, characterized in that, The forming groove (3) is interference-fitted with the part to be pressed (1).

3. The tooling for sealing semiconductor ceramic holes according to claim 1, characterized in that, The protrusion (4) is press-fitted with the hole (6).

4. The tooling for sealing semiconductor ceramic holes according to any one of claims 1 to 3, characterized in that, The sealing gasket body (2) and the protrusion (4) are integrally formed.

5. The tooling for sealing semiconductor ceramic holes according to claim 1, characterized in that, The Shore A hardness of the protrusion (4) is 10 to 70.

6. The tooling for sealing semiconductor ceramic holes according to claim 1, characterized in that, The protrusion (4) and the sealing gasket body (2) are made of rubber.

7. The tooling for sealing semiconductor ceramic holes according to claim 6, characterized in that, The protrusion (4) and the sealing gasket body (2) are made of thermally conductive silicone rubber.

8. The tooling for sealing semiconductor ceramic holes according to claim 6, characterized in that, The protrusion (4) and the sealing gasket body (2) are made of fluororubber.

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