Die bonding equipment and die bonding production line

Abstract

This utility model relates to the field of semiconductor technology, providing a die bonding device and a die bonding production line. The die bonding device includes a worktable, a die ring support mechanism, a clamping mechanism, a die bonding mechanism, and a connecting mechanism. The die bonding production line includes the aforementioned die bonding device. After the die ring and the product are transported to the designated position, the die bonding mechanism can transport and install the chip on the die ring located at the die picking position onto the product located at the die bonding position to complete the die bonding operation. Simultaneously, after the product has completed the die bonding operation, the clamping mechanism and the connecting mechanism can work together to return the die-bonded product to the production line for subsequent processing. Compared with existing die bonding devices, by providing a connecting mechanism on the worktable and connecting other equipment (such as transport equipment in the production line) to the first working end of the connecting mechanism, the die bonding device can be connected to the production line, avoiding the problem of the die bonding device only being able to operate as a standalone machine, thus improving production efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor technology, and in particular relates to a die bonding device and a die bonding production line. Background Technology

[0002] A die bonder is a piece of equipment used in semiconductor device manufacturing, its function being to connect semiconductor chips to other components. Currently, to improve production efficiency, die bonding production mostly adopts assembly line operations. During the die bonder's operation, products are received from the previous process, the chips are picked up from the die ring, transported, and installed onto the product. However, most existing die bonders suffer from inconvenient interfacing with other equipment, leading to inefficient product flow between multiple devices on the production line and impacting production efficiency. Utility Model Content

[0003] The purpose of this utility model is to provide a die bonding device and a die bonding production line, which aims to solve the technical problem of inconvenient docking with other equipment when the existing die bonding device is in operation.

[0004] This utility model is implemented as follows: Firstly, it provides a die bonding device, which includes a worktable, a crystal ring support mechanism, a clamping mechanism, a die bonding mechanism, and a connecting mechanism. The crystal ring support mechanism is disposed on the worktable and is used to support the crystal ring and transport it to the die pick-up position. The connecting mechanism is disposed on the worktable and is used to drive the product to reciprocate along a first direction. The connecting mechanism has a first working end and a second working end. The first working end is used to connect with other equipment so that the product can be transported from other equipment to the connecting mechanism. The clamping mechanism is disposed on the worktable and is used to support the product and transport it from the second working end to the die bonding position. The die bonding mechanism is disposed on the worktable and is used to transport and install the chip on the crystal ring located at the die pick-up position onto the product located at the die bonding position.

[0005] In an optional embodiment, the connecting mechanism includes two first side stops, both of which are arranged along the first direction, and the two first side stops are spaced apart from each other along the second direction to form a first channel for the product to slide. The first direction and the second direction are arranged at an angle. A first transmission component is also provided between the two first side stops. The first transmission component is used to support the product and push the product to move along the first channel.

[0006] In an optional embodiment, the connecting mechanism further includes a first blocking component and a second blocking component, which are spaced apart along the first direction. When the first transmission component drives the product to move forward along the first channel to a first preset position, the first blocking component blocks the product. When the first transmission component drives the product to move in the opposite direction along the first channel to a second preset position, the second blocking component blocks the product.

[0007] In an optional embodiment, both the first and second blocking components include a mounting bracket, a blocking block, and a lifting drive unit. The mounting bracket is slidably disposed on the first side stop, and the blocking block is disposed on the mounting bracket. The blocking block is used to abut against the product to block the product. The lifting drive unit is disposed on the first side stop and is used to drive the mounting bracket to reciprocate in the vertical direction.

[0008] In an optional embodiment, the clamping mechanism includes a clamping base, a first clamping slider, a second clamping slider, a positioning structure, and two second side stops. The clamping base is disposed on the worktable. The first clamping slider is slidably disposed on the clamping base along the first direction. The second clamping slider is slidably disposed on the first clamping slider along the second direction. The two second side stops are both disposed on the second clamping slider along the first direction and are spaced apart along the second direction to form a second channel for the product to slide. A second transmission assembly is also disposed between the two second side stops. The second transmission assembly is used to support the product and push the product to move along the second channel. The positioning structure is disposed on the second clamping slider and / or the second side stops for positioning the product.

[0009] In one optional embodiment, the crystal ring support mechanism includes a crystal ring base, a first crystal ring slider, a second crystal ring slider, and a crystal ring support member. The crystal ring base is disposed on the worktable, the first crystal ring slider is slidably disposed on the crystal ring base along the first direction, the second crystal ring slider is slidably disposed on the first crystal ring slider along the second direction, and the crystal ring support member is disposed on the second crystal ring slider. The crystal ring support member has a plurality of placement positions for placing and fixing crystal rings.

[0010] In an optional embodiment, the die bonding apparatus further includes a pusher mechanism disposed on a worktable and located below the crystal ring support. The pusher mechanism is used to apply a pushing force to the chip on the crystal ring to detach the chip from the blue film.

[0011] In one optional embodiment, the die bonding mechanism includes a die bonding support, a die bonding power unit, and two swing arm assemblies. The die bonding support is disposed on the worktable, the die bonding power unit is disposed on the die bonding support, and the two swing arm assemblies are connected to the drive end of the die bonding power unit and are disposed opposite to each other.

[0012] In one optional embodiment, the crystal ring support mechanism, the clamping mechanism, the die bonding mechanism, and the connecting mechanism constitute a die bonding working group, and there are two die bonding working groups, both of which are disposed on the worktable.

[0013] In a second aspect, a die bonding production line is provided, comprising the die bonding equipment described in any of the above claims.

[0014] The first aspect of this invention provides the following technical advantages: A ring support mechanism, a clamping mechanism, a die-bonding mechanism, and a connecting mechanism are used on the worktable. The first working end of the connecting mechanism connects with other equipment. During ring transport, the ring can be placed on the ring support mechanism, and its position can be adjusted to move it to the die-taking position. During product transport, the product can be transported from other equipment to the connecting mechanism via the first working end, and then the connecting mechanism transports the product to the second working end. Finally, the clamping mechanism transports the product from the second working end to the die-bonding position and supports the product during transport. After both the ring and the product are transported to their designated positions, the die-bonding mechanism can transport and install the chip on the ring at the die-taking position onto the product at the die-bonding position to complete the die-bonding operation. Furthermore, after the die-bonding operation is completed, the clamping mechanism and the connecting mechanism can work together to return the die-bonded product to the production line for subsequent processing. Compared with existing die bonding equipment, by setting up a connecting mechanism on the worktable and connecting other equipment (such as transport equipment in the production line) at the first working end of the connecting mechanism, the die bonding equipment can be connected to the production line, avoiding the problem that the die bonding equipment can only operate as a standalone machine, and improving production efficiency.

[0015] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the die bonding device provided in this embodiment of the utility model; Figure 2 This is a schematic diagram of the connection mechanism used in the embodiment of this utility model; Figure 3 This is a schematic diagram of the clamping mechanism used in the embodiment of this utility model; Figure 4 This is a schematic diagram of the crystal ring support mechanism used in this embodiment of the utility model; Figure 5 This is a schematic diagram of the die-bonding mechanism used in the embodiment of this utility model.

[0018] Explanation of reference numerals in the attached figures: 1. Workbench; 2. Connecting mechanism; 21. First side stop; 22. First channel; 23. First material stop assembly; 231. Material stop block; 232. Mounting bracket; 233. Lifting drive unit; 234. Pressure detection unit; 24. Second material stop assembly; 25. First transmission assembly; 3. Fixture mechanism; 31. Fixture base; 32. First fixture slider; 33. Second fixture slider; 34. Second side stop; 35. Second transmission assembly; 36. Positioning structure; 361. Front blocking component; 362. Side positioning assembly; 4. Crystal ring support mechanism; 41. Crystal ring base; 42. First crystal ring slider; 43. Second crystal ring slider; 44. Crystal ring support component; 45. Placement position; 5. Die-bonding mechanism; 51. Die-bonding support seat; 52. Die-bonding power unit; 53. Swing arm assembly; 6. Ejector pin mechanism; 7. Bottom fly plate. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In this embodiment, according to Figure 1The XYZ Cartesian coordinate system established in the diagram is defined as follows: the X-axis can be the first direction, the Y-axis can be the second direction, and the Z-axis can be the third direction. Specifically, the side located in the positive X-axis direction is defined as front, and the side located in the negative X-axis direction is defined as back; the side located in the positive Y-axis direction is defined as left, and the side located in the negative Y-axis direction is defined as right; the side located in the positive Z-axis direction is defined as up, and the side located in the negative Z-axis direction is defined as down.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0022] Please refer to Figures 1 to 5 As shown in this embodiment of the utility model, a die bonding device is provided. The die bonding device includes a worktable 1, a crystal ring support mechanism 4, a clamping mechanism 3, a die bonding mechanism 5, and a connecting mechanism 2. The crystal ring support mechanism 4 is disposed on the worktable 1 and is used to support the crystal ring and transport the crystal ring to the die pick-up position. The connecting mechanism 2 is disposed on the worktable 1 and is used to drive the product to reciprocate along a first direction. The connecting mechanism 2 has a first working end and a second working end. The first working end is used to connect with other equipment so that the product can be transported from other equipment to the connecting mechanism 2. The clamping mechanism 3 is disposed on the worktable 1 and is used to support the product and transport the product from the second working end to the die bonding position. The die bonding mechanism 5 is disposed on the worktable 1 and is used to transport and install the chip on the crystal ring located at the die pick-up position onto the product located at the die bonding position.

[0023] Specifically, workbench 1 refers to a support component with a certain height, and its top may have a mounting surface for installing other components. Crystal ring support mechanism 4 refers to a mechanism that supports the crystal ring and adjusts its position. Clamping mechanism 3 refers to a mechanism that fixes the product and adjusts its position. Die-bonding mechanism 5 refers to a mechanism that picks up the chip from the crystal ring and mounts it onto the product. Both the pick-up position and the die-bonding position refer to virtual positions that can be freely set according to production needs.

[0024] The connecting mechanism 2 refers to a mechanism that can transport products along a preset direction. The connecting mechanism 2 can drive the product to move forward in a certain direction or to move it in the opposite direction. The connecting mechanism 2 can be a conveyor belt mechanism or a robotic arm mechanism, etc. The first working end is used to connect with other equipment, which can refer to transportation equipment in the production line, such as a conveyor belt.

[0025] The die bonding equipment provided in this embodiment of the invention comprises a crystal ring support mechanism 4, a clamping mechanism 3, a die bonding mechanism 5, and a connecting mechanism 2 on a workbench 1. The first working end of the connecting mechanism 2 connects with other equipment. During crystal ring transportation, the crystal ring can be placed on the crystal ring support mechanism 4, and its position can be adjusted by the crystal ring support mechanism 4 to move the crystal ring to the die-taking position. During product transportation, the product can be transported from other equipment to the connecting mechanism 2 via the first working end, and then the connecting mechanism 2 transports the product to the second working end. Finally, the clamping mechanism 3 can transport the product from the second working end to the die bonding position and support the product during transportation. After both the crystal ring and the product are transported to the designated positions, the die bonding mechanism 5 can transport and install the chip on the crystal ring located at the die-taking position onto the product located at the die bonding position to complete the die bonding operation. Simultaneously, after the product has completed the die bonding operation, the clamping mechanism 3 and the connecting mechanism 2 can cooperate to return the die-bonded product to the production line for subsequent processing. Compared with existing die bonding equipment, by setting a connecting mechanism 2 on the workbench 1 and connecting the first working end of the connecting mechanism 2 to other equipment (such as the transport equipment in the production line), the die bonding equipment can be connected to the production line, avoiding the problem that the die bonding equipment can only operate as a standalone machine, and improving production efficiency.

[0026] It should be noted that the control unit on the die bonding equipment can be connected to the control units of other equipment, enabling real-time communication and strong continuity between each process on the production line, thus achieving automated assembly line operation.

[0027] In one embodiment, see Figure 1 and Figure 2The connecting mechanism 2 includes two first side stops 21, both arranged along a first direction, and the two first side stops 21 are spaced apart from each other along a second direction to form a first channel 22 for product sliding. The first direction and the second direction are arranged at an angle. A first transmission component 25 is also provided between the two first side stops 21. The first transmission component 25 is used to support the product and push the product to move along the first channel 22.

[0028] Specifically, the first side stop 21 refers to a component with a certain length, which can be plate-shaped, column-shaped, or strip-shaped, etc. The first transmission assembly 25 refers to a component that can drive an object to move in a preset direction, and the first transmission assembly 25 can adopt belt transportation, robotic arm push, or other arbitrary driving methods.

[0029] In this embodiment, by arranging two first side stops 21 along a first direction and spaced apart from each other along a second direction, a first channel 22 for product sliding is formed by the two first side stops 21. A first transmission assembly 25 is arranged between the two first side stops 21, which drives the product to move forward or backward along the first channel 22 when the product enters it. This makes product transportation more convenient, stable, and precise.

[0030] In an optional embodiment, please refer to Figure 2 The number of first transmission components 25 can be two, and the two first transmission components 25 are respectively disposed on the inner side walls of the two first side stops 21. By setting two first transmission components 25 and respectively disposed on the inner side walls of the two first side stops 21, the two first transmission components 25 support the two edges of the product, which not only supports and drives the movement of the product, but also reduces the overall weight of the entire connecting mechanism 2, making the overall structure of the connecting mechanism 2 lighter.

[0031] Please refer to Figure 2 The first transmission assembly 25 may include a driving pulley, a driven pulley, a transmission belt, and a motor. Both the driving and driven pulleys are rotatably mounted on the first side stop 21. The transmission belt is fitted over both the driving and driven pulleys. The motor's drive end is connected to the driving pulley. During operation, the product can be placed on top of the transmission belt, which supports the product. The motor drives the driving pulley to rotate, which in turn moves the transmission belt and the product. This facilitates product transportation. Furthermore, the rotation direction of the driving pulley can be adjusted by controlling the direction of the motor's output torque, thus allowing for adjustment of the product's transport direction.

[0032] In one embodiment, see Figure 2 The connecting mechanism 2 also includes a first blocking component 23 and a second blocking component 24. The first blocking component 23 and the second blocking component 24 are spaced apart along a first direction. When the first transmission component 25 drives the product to move forward along the first channel 22 to a first preset position, the first blocking component 23 is used to block the product to prevent the product from continuing to move. When the first transmission component 25 drives the product to move in the opposite direction along the first channel 22 to a second preset position, the second blocking component 24 is used to block the product to prevent the product from continuing to move.

[0033] Specifically, both the first stop assembly 23 and the second stop assembly 24 have a working state and an avoidance state. In the working state, at least a portion of the first stop assembly 23 or the second stop assembly 24 blocks the movement path of the product. In the avoidance state, at least a portion of the first stop assembly 23 or the second stop assembly 24 avoids the movement path of the product. For example, the first stop assembly 23 can consist of a driving part and a moving part, and the driving part can drive the moving part to reciprocate, thereby switching the first stop assembly 23 between the working state and the avoidance state. The second stop assembly 24 can also consist of a driving part and a moving part, and the driving part can drive the moving part to reciprocate, thereby switching the second stop assembly 24 between the working state and the avoidance state. The structures of the first stop assembly 23 and the second stop assembly 24 can be the same or different, and can be freely set according to production needs.

[0034] In this embodiment, both the first stop assembly 23 and the second stop assembly 24 can be installed on one of the two first side stops 21, and the first stop assembly 23 and the second stop assembly 24 are spaced apart along the first direction. Normally, the first stop assembly 23 and the second stop assembly 24 are in a clearance state. When the transmission assembly drives the product to move forward along the first channel 22 to the first preset position, the first stop assembly 23 switches to a working state to block the product's movement in the forward direction. For example, when the first transmission assembly 25 transports the product towards the second working end, but the clamping mechanism 3 has not yet moved into place, the first stop assembly 23 can block the product. Similarly, when the first transmission assembly 25 drives the product to move in the reverse direction along the first channel 22 to the second preset position, the second stop assembly 24 switches to a working state to block the product's movement in the forward direction, at which time the first stop assembly 23 is in a clearance state. For example, when the first transmission component 25 transports the product towards the first working end, when the product reaches the second preset position, the second stop component 24 switches to a working state to block the product's movement in the forward direction, that is, the second stop component 24 falls down. At this time, the first stop component 23 can be in a clearance state, that is, the first stop component 23 is raised. Through the cooperation of the first stop component 23 and the second stop component 24, the transport of the product from the first or second working end of the connecting mechanism 2 can be controlled, making the cycle time of the entire die bonding equipment and the production line more matched, thereby improving the efficiency of product production.

[0035] In one embodiment, see Figure 2 Both the first baffle assembly 23 and the second baffle assembly 24 include a mounting bracket 232, a baffle block 231, and a lifting drive unit 233. The mounting bracket 232 is slidably disposed on the first side baffle 21, and the baffle block 231 is disposed on the mounting bracket 232. The baffle block 231 is used to abut against the product to block the product. The lifting drive unit 233 is disposed on the first side baffle 21 and is used to drive the mounting bracket 232 to reciprocate in the vertical direction.

[0036] Specifically, the mounting bracket 232 refers to a component of a certain length, which can be plate-shaped, block-shaped, or a combination of various shapes. One end of the mounting bracket 232 can be slidably connected to one of the two first side stops 21 via a sliding structure (such as a slide rail slider structure). The other end of the mounting bracket 232 can extend above the first channel 22. The stop block 231 refers to a component of a certain volume, which can be installed on the mounting bracket 232 by snap-fit, plug-in, or fastener connection. The lifting drive unit 233 refers to a component that can drive an object to move in a straight line, which can be a cylinder, an electric push rod, or a hydraulic cylinder, etc.

[0037] In this embodiment, one end of the mounting bracket 232 is slidably connected to the first side stop 21, and the stop block 231 is disposed at the other end of the mounting bracket 232. The shape of the mounting bracket 232 can be set according to production needs. The mounting bracket 232 can be driven to rise or fall by the lifting drive unit 233, thereby driving the stop block 231 to block or avoid the movement path of the product. For example, when the mounting bracket 232 falls, the stop block 231 extends from the opening of the first channel 22 into the first channel 22 and blocks the movement path of the product. When the mounting bracket 232 rises, the stop block 231 also rises with the mounting bracket 232 and avoids the movement path of the product. While ensuring the simplicity of the structure of the first stop assembly 23 and the second stop assembly 24, the use of both is made simpler and more convenient.

[0038] In an optional embodiment, please refer to Figure 2 A pressure detection unit 234 can also be provided between the stop block 231 and the mounting bracket 232. The pressure detection unit 234 can be electrically connected to the control unit, which is also connected to the control terminal of the motor on the first transmission assembly 25. When the stop block 231 comes into contact with the product and is subjected to pressure, the pressure detection unit 234 can quickly detect this and transmit the signal to the control unit. After receiving the signal, the control unit can control the motor to stop moving, thereby stopping the product as well.

[0039] In one embodiment, see Figure 1 and Figure 3 The clamping mechanism 3 includes a clamping base 31, a first clamping slider 32, a second clamping slider 33, a positioning structure 36, and two second side stops 34. The clamping base 31 is disposed on the worktable 1. The first clamping slider 32 is slidably disposed on the clamping base 31 along a first direction. The second clamping slider 33 is slidably disposed on the first clamping slider 32 along a second direction. The two second side stops 34 are both disposed on the second clamping slider 33 along the first direction, and the two second side stops 34 are spaced apart along the second direction to form a second channel for product sliding. A second transmission assembly 35 is also disposed between the two second side stops 34. The second transmission assembly 35 is used to support the product and push the product to move along the second channel. The positioning structure 36 is disposed on the second clamping slider 33 and / or the second side stops 34 to position the product, thereby preventing the product from moving during chip installation.

[0040] Specifically, the clamp base 31, the first clamp slider 32, and the second clamp slider 33 are all block-shaped components with a certain volume, and their shapes can be block-shaped, plate-shaped, or a combination of various shapes. The first clamp slider 32 can be slidably connected to the clamp base 31 via a slide rail slider structure, etc. A first driving unit is provided between the first clamp slider 32 and the clamp base 31, which drives the first clamp slider 32 to slide back and forth in a first direction. The first driving unit can be a linear motor or an electric actuator, etc. Similarly, the second clamp slider 33 can also be slidably connected to the first clamp slider 32 via a slide rail slider structure, etc., and a second driving unit is provided between the first clamp slider 32 and the second clamp slider 33, which drives the second clamp slider 33 to slide back and forth in a second direction. The second driving unit can be a linear motor or an electric actuator, etc.

[0041] The second side stop 34 refers to a component with a certain length, which can be plate-shaped, strip-shaped, or column-shaped, etc. The second transmission assembly 35 refers to an assembly that can drive an object to move along a preset direction; the second transmission assembly 35 can employ belt conveyor, robotic arm push, or other arbitrary driving methods. The positioning structure 36 refers to an assembly structure that can fix an object in a preset position, and it can be fixed from multiple directions.

[0042] In this embodiment, the second channel formed by the two second side stops 34 is first moved to the position where the first channel 22 on the connecting mechanism 2 is connected by the first clamp slider 32 and the second clamp slider 33. The product can then move into the second channel under the action of the first transmission component 25. Then, the product is transported to a preset position by the cooperation of the first clamp slider 32, the second clamp slider 33, and the second transmission component 35. Finally, the product is fixed in the preset position by the positioning structure 36. After the product has completed die bonding, the above steps are reversed to transport the product back from the clamp mechanism 3 to the connecting mechanism 2, making the clamp mechanism 3 more convenient to use. In one embodiment, see Figure 3The positioning structure 36 may include a side positioning component 362 and a front blocking member 361. The front blocking member 361 is disposed between two second side blocking members 34, and at least a portion of the front blocking member 361 is located on the product's movement path. The side positioning component 362 includes a positioning abutment and a positioning drive unit. The positioning abutment is movably disposed on the second side blocking member 34, and the positioning drive unit drives the positioning abutment to move away from or towards the product in a second direction. When the product moves to abut against the front blocking member 361 under the action of the second transmission component 35, the product stops moving in a first direction. At this time, the positioning drive unit drives the positioning abutment to move towards the product in a second direction until the product is pressed between the positioning abutment and another second side blocking member 34. The positioning structure 36 can position the product on multiple sides, making the product positioning more secure and accurate.

[0043] It should be noted that the specific structure of the second transmission component 35 can be the same as that of the first transmission component 25. Please refer to the description of the first transmission component 25 above, which will not be repeated here.

[0044] In one embodiment, see Figure 1 and Figure 4 The crystal ring support mechanism 4 includes a crystal ring base 41, a first crystal ring slider 42, a second crystal ring slider 43, and a crystal ring support member 44. The crystal ring base 41 is disposed on the worktable 1. The first crystal ring slider 42 is slidably disposed on the crystal ring base 41 along a first direction. The second crystal ring slider 43 is slidably disposed on the first crystal ring slider 42 along a second direction. The crystal ring support member 44 is disposed on the second crystal ring slider 43. The crystal ring support member 44 has a plurality of placement positions 45 for placing and fixing crystal rings. The plurality of placement positions 45 are arranged sequentially at intervals along the second direction.

[0045] Specifically, the crystal ring base 41, the first crystal ring slider 42, and the second crystal ring slider 43 are all block-shaped components with a certain volume, and their shapes can be block-shaped, plate-shaped, or a combination of various shapes. The first crystal ring slider 42 can be slidably connected to the crystal ring base 41 via a slide rail slider structure, etc. A third driving unit is provided between the first crystal ring slider 42 and the crystal ring base 41, which drives the first crystal ring slider 42 to slide back and forth along a first direction. The third driving unit can be a linear motor or an electric push rod, etc. Similarly, the second crystal ring slider 43 can also be slidably connected to the first crystal ring slider 42 via a slide rail slider structure, etc., and a fourth driving unit is provided between the first crystal ring slider 42 and the second crystal ring slider 43, which drives the second crystal ring slider 43 to slide back and forth along a second direction. The fourth driving unit can be a linear motor or an electric push rod, etc.

[0046] The crystal ring support 44 refers to a component with a certain volume. The crystal ring support 44 can be a plate-like structure, giving it a larger supporting area. The placement position 45 refers to a mechanism for positioning the crystal ring. The placement position 45 can be a circular groove structure that matches the shape of the crystal ring. Alternatively, the placement position 45 can be a support member provided on the crystal ring support 44, with the support member enclosing a circular space that matches the shape of the crystal ring.

[0047] In this embodiment, the crystal ring can be placed at the placement position 45 on the crystal ring support 44, and its position can be adjusted in the first and second directions by the cooperation of the first crystal ring slider 42 and the second crystal ring slider 43. Since there are multiple placement positions 45 on the crystal ring support 44, crystal rings carrying different types of chips can be placed at each placement position 45. By moving the position of the crystal ring support 44, automatic switching between various chips can be achieved, enabling diversified production and improving the functionality of the equipment.

[0048] In one embodiment, see Figure 1 The die bonding equipment also includes a pusher mechanism 6, which is mounted on the worktable 1 and located below the crystal ring support 44. The pusher mechanism 6 applies a pushing force to the chip on the crystal ring to detach the chip from the blue film. The pusher mechanism 6 is a component that can detach the chip from the blue film. The pusher mechanism 6 may include a pusher assembly, a pusher support, a pusher translation module, and a pusher lifting module. The pusher translation module is located between the adjustment platform and the pusher support and is used to adjust the horizontal position of the pusher support. The pusher lifting module is mounted on the pusher support, and the pusher assembly is located at the drive end of the pusher lifting module and can reciprocate vertically under the action of the pusher lifting module.

[0049] Specifically, a ejector pin assembly refers to a component that can separate the wafer from the thin film of the crystal ring. The ejector pin assembly can include structures such as ejector pins, ejector pin seats, and ejector pin caps. An ejector pin support is a block-shaped component of a certain volume, whose function is to mount the ejector pin lifting module. The ejector pin lifting module is a component used to drive the entire ejector pin assembly to move vertically; the ejector pin lifting module can be a cylinder, a hydraulic cylinder, or a combination of a motor and a crankshaft. The ejector pin translation module is a component that can adjust the horizontal position of the ejector pin support, the ejector pin lifting module, and the ejector pin assembly.

[0050] During operation, the ejector pin assembly can be adjusted horizontally by the ejector pin translation module, positioning it below the die ring. Then, the ejector pin assembly can be vertically lifted by the ejector pin lifting module to separate the wafer from the blue film, making it easier for the die bonding device to pick up the chip.

[0051] In one embodiment, see Figure 1 and Figure 5 The die bonding mechanism 5 includes a die bonding support 51, a die bonding power unit 52, and two swing arm assemblies 53. The die bonding support 51 is mounted on the worktable 1, and the die bonding power unit 52 is mounted on the die bonding support 51. Both swing arm assemblies 53 are connected to the drive end of the die bonding power unit 52 and are arranged opposite to each other. Specifically, the die bonding support 51 is a support component with a certain height, which can be columnar, block-shaped, or a combination of various shapes. The die bonding power unit 52 is a component capable of outputting torque, typically a die bonding motor. To ensure the die bonding motor can operate normally for extended periods, a die bonding heat dissipation component is also provided externally. The swing arm assembly 53 is a structure with a certain length, which may include a swing arm portion and a suction nozzle assembly. The suction nozzle assembly is located at the end of the swing arm portion, and the horizontal movement of the suction nozzle assembly is achieved through the swinging of the swing arm portion, thereby realizing the transportation and installation of the chip.

[0052] In this embodiment, during die bonding, the die bonding power unit 52 drives the swing arm assembly 53 to swing, and after the chip is picked up by the suction nozzle assembly, the swing arm assembly 53 swings to the die bonding position to mount and solder the chip onto the product. Two opposing swing arm assemblies 53 are also provided. While one swing arm assembly 53 picks up a chip, the other swing arm assembly 53 can mount a chip. Then, the positions of the two swing arm assemblies 53 are switched to mount and solder the next chip, thereby greatly improving the efficiency of die bonding.

[0053] In an optional embodiment, please refer to Figure 5 The nozzle assembly also has a degree of freedom to rotate around its own axis relative to the swing arm, allowing for rotational adjustment of the chip's offset angle after the nozzle assembly picks up the chip. Furthermore, multiple bottom flaps 7 can be installed on the worktable 1 to acquire images of the chip. These images can then be sent to the control unit, which controls the rotation of the nozzle assembly to correct the chip's offset angle, thus improving the die bonding accuracy.

[0054] In one embodiment, see Figure 1 The crystal ring support mechanism 4, the clamping mechanism 3, the die bonding mechanism 5, and the connecting mechanism 2 form a die bonding working group. There are two die bonding working groups, both of which are mounted on the worktable 1. In this embodiment, by assembling the crystal ring support mechanism 4, the clamping mechanism 3, the die bonding mechanism 5, and the connecting mechanism 2 into a single die bonding working group, and by setting two of these die bonding working groups on the worktable 1, the die bonding equipment can simultaneously connect to two die bonding production lines, thus improving production efficiency.

[0055] Secondly, a die-bonding production line is provided, including the die-bonding equipment described above. Specifically, the die-bonding production line may include multiple production devices, and these devices are connected by transport equipment to facilitate the flow of products between the multiple production devices. This die-bonding equipment can be connected to the transport equipment or other production devices in the die-bonding production line via the connecting mechanism 2. It is understood that the beneficial effects of the second aspect described above can be found in the relevant descriptions in the first aspect described above, and will not be repeated here.

[0056] The above description is merely a preferred embodiment of the present utility model, and only specifically describes the technical principles of the present utility model. These descriptions are only for explaining the principles of the present utility model and should not be construed as limiting the scope of protection of the present utility model in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model, as well as other specific embodiments of the present utility model that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present utility model.

Claims

1. A die bonding device, characterized in that, The device includes a worktable, a crystal ring support mechanism, a clamping mechanism, a die bonding mechanism, and a connecting mechanism. The crystal ring support mechanism is disposed on the worktable and is used to support the crystal ring and transport it to the die pick-up position. The connecting mechanism is disposed on the worktable and is used to drive the product to reciprocate along a first direction. The connecting mechanism has a first working end and a second working end. The first working end is used to connect with other equipment so that the product can be transported from other equipment to the connecting mechanism. The clamping mechanism is disposed on the worktable and is used to support the product and transport it from the second working end to the die bonding position. The die bonding mechanism is disposed on the worktable and is used to transport and install the chip on the crystal ring located at the die pick-up position onto the product located at the die bonding position.

2. The die bonding equipment as described in claim 1, characterized in that, The connecting mechanism includes two first side stops, both of which are arranged along the first direction, and the two first side stops are spaced apart from each other along the second direction to form a first channel for the product to slide. The first direction and the second direction are arranged at an angle. A first transmission component is also provided between the two first side stops. The first transmission component is used to support the product and push the product to move along the first channel.

3. The die bonding equipment as described in claim 2, characterized in that, The connecting mechanism further includes a first blocking component and a second blocking component, which are spaced apart along the first direction. When the first transmission component drives the product to move forward along the first channel to a first preset position, the first blocking component blocks the product. When the first transmission component drives the product to move in the opposite direction along the first channel to a second preset position, the second blocking component blocks the product.

4. The die bonding apparatus as described in claim 3, characterized in that, Both the first and second blocking components include a mounting bracket, a blocking block, and a lifting drive unit. The mounting bracket is slidably disposed on the first side blocking member, and the blocking block is disposed on the mounting bracket. The blocking block is used to abut against the product to block the product. The lifting drive unit is disposed on the first side blocking member and is used to drive the mounting bracket to reciprocate in the vertical direction.

5. The die bonding apparatus as described in claim 2, characterized in that, The clamping mechanism includes a clamping base, a first clamping slider, a second clamping slider, a positioning structure, and two second side stops. The clamping base is disposed on the worktable. The first clamping slider is slidably disposed on the clamping base along the first direction. The second clamping slider is slidably disposed on the first clamping slider along the second direction. The two second side stops are both disposed on the second clamping slider along the first direction and are spaced apart along the second direction to form a second channel for the product to slide. A second transmission assembly is also disposed between the two second side stops. The second transmission assembly is used to support the product and push the product to move along the second channel. The positioning structure is disposed on the second clamping slider and / or the second side stops for positioning the product.

6. The die bonding apparatus according to any one of claims 1 to 5, characterized in that, The crystal ring support mechanism includes a crystal ring base, a first crystal ring slider, a second crystal ring slider, and a crystal ring support member. The crystal ring base is disposed on the worktable. The first crystal ring slider is slidably disposed on the crystal ring base along the first direction. The second crystal ring slider is slidably disposed on the first crystal ring slider along the second direction. The crystal ring support member is disposed on the second crystal ring slider. The crystal ring support member has multiple placement positions for placing and fixing crystal rings.

7. The die bonding apparatus of claim 6, wherein the die bonding apparatus further comprises a die bonding head. The die bonding equipment also includes a pusher mechanism, which is disposed on the worktable and located below the crystal ring support. The pusher mechanism is used to apply a pushing force to the chip on the crystal ring to detach the chip from the blue film.

8. The die bonding apparatus according to any one of claims 1 to 5, characterized in that, The die bonding mechanism includes a die bonding support, a die bonding power unit, and two swing arm assemblies. The die bonding support is disposed on the worktable, the die bonding power unit is disposed on the die bonding support, and the two swing arm assemblies are connected to the drive end of the die bonding power unit and are disposed opposite to each other.

9. The die bonding apparatus according to any one of claims 1 to 5, characterized in that, The crystal ring support mechanism, the clamping mechanism, the die bonding mechanism and the connecting mechanism constitute a die bonding working group. There are two die bonding working groups, and both die bonding working groups are set on the worktable.

10. A die bonding production line, characterized in that, Includes the die bonding apparatus as described in any one of claims 1 to 9.

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