A mega-sound cleaning device
By designing a mega-sound cleaning device that combines mega-sound cleaning, chemical liquid cleaning, and infrared drying components, the problems of insufficient cleaning coverage and inaccurate pressure control in existing wafer brushing machines have been solved, achieving efficient and non-destructive multi-wafer cleaning.
Patent Information
- Application Number
- CN202522433495.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-17
- Publication Date
- 2026-11-06
- Estimated Expiration
- 2035-11-17
AI Technical Summary
Existing wafer cleaning machines suffer from insufficient coverage and depth of cleaning modules, and the brush head pressure cannot be precisely controlled, resulting in residual particles on the wafer surface after cleaning, which are easily damaged. Furthermore, their applicability and processing efficiency are poor, and they cannot meet the needs of cleaning wafers of different sizes or multiple wafers at the same time.
A mega-sound cleaning device was designed, comprising a brush head assembly, a nozzle cleaning assembly, an infrared drying assembly, and a lifting baffle assembly. It utilizes components such as a mega-sound cleaning nozzle, a chemical liquid cleaning nozzle, a nitrogen purging nozzle, and an infrared drying lamp, combined with a pressure sensor, to achieve real-time adjustment of the brush head pressure, adapting to the cleaning needs of different contaminants, and uses a lifting baffle to prevent liquid splashing.
It improves cleaning performance, avoids particle residue and wafer damage, enhances adaptability and processing efficiency, and is suitable for cleaning single or multiple wafers.
Smart Images
Figure CN224947987U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of wafer cleaning equipment, and in particular to a mega-sound cleaning device. Background Technology
[0002] In semiconductor manufacturing processes, liquid handling equipment is typically required to process wafers, such as in development, etching, and cleaning processes. For example, cleaning processes are used to remove particles and contaminants adhering to the wafer. Currently, typical liquid handling equipment usually uses a rotating tray to fix the wafer and rotate it, spraying the processing liquid (cleaning liquid, rinsing liquid, etc.) onto the surface or back of the wafer. At the same time, the processing liquid sprayed onto the wafer is flung out by the rotating wafer and dispersed in a mist around the wafer tray.
[0003] Currently, existing wafer cleaning machines mainly include a stage, a cavity mechanism with an opening on the stage, a cleaning unit mounted on the stage and located on the outer periphery of the cavity mechanism, a wafer rotation mechanism that passes through the stage and extends axially into the cavity mechanism, and a lifting mechanism for driving the upper and lower guide shrouds within the cavity mechanism to move vertically up and down. The cleaning unit includes several swing arms with nozzles, a brushing device with cleaning brush heads, and several air inlet pipes that are axially located on the outer side of the wafer rotation mechanism and extend longitudinally into the cavity mechanism, which can realize the integration of multiple processes such as wafer cleaning, brushing, nitrogen drying, and cleaning fluid separation and recovery. However, existing wafer cleaning machines suffer from several drawbacks. First, the cleaning nozzles in the cleaning module have a simple structure, resulting in insufficient cleaning coverage and depth for the wafers, which can easily lead to particle residue on the wafer surface after cleaning. Second, the brush head pressure of the cleaning module cannot be precisely controlled, which can easily cause physical damage to the wafers during the cleaning process. Furthermore, existing wafer cleaning machines are only suitable for processing single wafers and cannot meet the production scenarios of cleaning wafers of different sizes or multiple wafers at the same time. Their applicability and processing efficiency are poor. Therefore, it is necessary to improve existing wafer cleaning machines to solve the above problems. Utility Model Content
[0004] The purpose of this invention is to provide a mega-sound cleaning device, which has the advantages of good cleaning effect, controllable brush head pressure, and improved adaptability and processing efficiency.
[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a mega-sound cleaning device, including a base; a wafer positioning seat for placing wafers is provided on the base; a lifting baffle assembly for surrounding the wafer positioning seat during the cleaning process to prevent cleaning fluid from scattering is fixedly connected to the base; a brush head assembly for brushing the wafer surface, a nozzle cleaning assembly for spraying deionized water or cleaning fluid onto the wafer surface to achieve spray cleaning and drying the wafer surface, and an infrared evaporation drying assembly for rapidly evaporating moisture from the wafer surface to avoid water stains remaining.
[0006] The present invention is further configured such that: the brush head assembly includes a brushing lifting arm fixedly connected to the base and a brush head motor fixedly connected to the swing end of the brushing lifting arm in a vertical direction; a PVA brush head for brushing the wafer surface is coaxially fixedly connected to the rotating shaft of the brush head motor; a pressure sensor for real-time detection of the brushing pressure is fixedly provided between the PVA brush head and the brush head motor; the pressure sensor is coupled to the brushing lifting arm; and water spray pipes for spraying deionized water onto the wafer surface to improve the brushing effect are fixedly connected to both ends of the wafer positioning seat on the base.
[0007] The present invention is further configured such that: a soaking pool for soaking the PVA brush head is fixedly connected to the base, a replenishment pipe for replenishing deionized water is provided on the side wall of the soaking pool, and a drain pipe is provided at the bottom of the soaking pool, thereby realizing the circulation of deionized water in the soaking pool based on the replenishment pipe and the drain pipe.
[0008] The present invention is further configured such that: the nozzle cleaning assembly includes a nozzle lifting arm fixedly connected to the base and a nozzle fixing block that is adjustable and fixedly connected to the swing end of the nozzle lifting arm; the nozzle fixing block is respectively fixedly connected to a megasonic cleaning nozzle for spraying deionized water and at least one chemical cleaning nozzle for spraying chemical cleaning liquid; and the nozzle fixing block is also fixedly connected to a nitrogen purging nozzle for blowing dry residual droplets on the wafer surface.
[0009] The present invention is further configured such that the chemical liquid cleaning nozzle is provided in two sets.
[0010] The present invention is further configured such that: the infrared drying assembly includes an infrared lifting arm fixedly connected to the base and an infrared drying lamp fixedly connected to the swing end of the infrared lifting arm, and a lamp cover for generating heat is fixedly connected to the infrared drying lamp.
[0011] The present invention is further configured such that: the lifting retaining ring assembly includes a fixed base fixedly connected to the base and a lifting screw slide fixedly connected to the fixed base in a vertical direction, wherein the sliding end of the lifting screw slide is fixedly connected to a lifting retaining ring, and in the initial state the upper surface of the lifting retaining ring is flush with the base.
[0012] In summary, this utility model has the following beneficial effects: 1. The nozzle cleaning assembly utilizes separate mega-sound cleaning nozzles to powerfully remove minute particulate contaminants adhering to the wafer surface by spraying deionized water carrying mega-sound energy onto the wafer surface. A chemical cleaning nozzle then sprays a chemical cleaning solution onto the wafer surface to address the cleaning needs of different contaminants, thus preventing particle residue. After cleaning, a nitrogen purging nozzle purges the wafer surface with nitrogen to quickly remove any residual droplets. Simultaneously, the brush head assembly incorporates a pressure sensor coupled to the brush lifting arm to achieve real-time control of the downward pressure exerted by the PVA brush head on the wafer surface, preventing damage to the wafer during the brushing process. The positioning base is equipped with water spray pipes at both ends for spraying deionized water onto the wafer surface to improve the cleaning effect. At the same time, an immersion tank is set on the base. When not cleaning, the PVA brush head is immersed in the immersion tank to ensure the cleanliness of the PVA brush head. Meanwhile, the deionized water in the immersion tank is circulated through the replenishment pipe and the drain pipe to further ensure the cleanliness of the PVA brush head and ensure the stability of the cleaning process. After cleaning or brushing, the infrared evaporation component emits infrared light to the wafer surface to quickly evaporate the moisture on the wafer surface and avoid water stains. The lifting baffle assembly raises the lifting baffle ring through the lifting screw slide during the brushing or spraying process to surround the wafer and prevent the cleaning solution from splashing. 2. By setting a wafer positioning seat on the base, the fixture carrying several wafers can be positioned on the wafer positioning seat to carry a single wafer or multiple small-sized wafers, thereby improving the adaptability of wafer cleaning and the processing efficiency of small-sized wafers. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the overall structure of this embodiment; Figure 2 This is a schematic diagram of the brush head assembly in this embodiment; Figure 3 This is a schematic diagram of the nozzle cleaning assembly in this embodiment; Figure 4 This is a schematic diagram of the infrared drying assembly in this embodiment; Figure 5 This is a schematic diagram of the lifting retaining ring assembly in this embodiment; Figure 6 This is a schematic diagram of the overall structure of this embodiment in the brushing state.
[0014] Reference numerals: 1. Base; 2. Wafer positioning base; 3. Lifting retaining ring assembly; 31. Fixing base; 32. Lifting screw slide; 33. Lifting retaining ring; 4. Brush head assembly; 41. Brush lifting swing arm; 42. Brush head motor; 43. PVA brush head; 44. Pressure sensor; 45. Water spray pipe; 46. Immersion tank; 47. Replenishment pipe; 48. Drain pipe; 5. Nozzle cleaning assembly; 51. Nozzle lifting swing arm; 52. Nozzle fixing block; 53. Megasonic cleaning nozzle; 54. Chemical liquid cleaning nozzle; 55. Nitrogen purging nozzle; 6. Infrared drying assembly; 61. Infrared lifting swing arm; 62. Infrared drying lamp; 63. Lamp cover. Detailed Implementation
[0015] The present invention will be further described in detail below with reference to the accompanying drawings.
[0016] Example: refer to Figures 1 to 6 A mega-sound cleaning device includes a base 1, on which a wafer positioning seat 2 is provided for placing wafers. A fixture carrying several wafers is positioned on the wafer positioning seat 2 to accommodate a single surface-size wafer or multiple small-size wafers, improving the adaptability of wafer cleaning. A lifting baffle assembly 3 is fixedly connected to the base 1 to surround the wafer positioning seat 2 during cleaning to prevent cleaning fluid from splashing. A brush head assembly 4 for brushing the wafer surface, a nozzle cleaning assembly 5 for spraying deionized water or cleaning fluid onto the wafer surface for spray cleaning and drying, and an infrared drying assembly 6 for rapidly evaporating moisture from the wafer surface to prevent water stains. In this embodiment, the wafer positioning seat 2 is compatible with the positioning requirements of 4-inch, 6-inch, or 8-inch fixtures.
[0017] refer to Figure 2 and Figure 6Specifically, the brush head assembly 4 includes a brush lifting arm 41 fixedly connected to the base 1 and a brush head motor 42 fixedly connected to the swing end of the brush lifting arm 41 in the vertical direction. A PVA brush head 43 for brushing the wafer surface is fixedly connected coaxially to the rotation shaft of the brush head motor 42. The PVA brush head 43 is made of polyvinyl alcohol (PVA) material. A pressure sensor 44 for real-time detection of the brushing pressure is fixed between the PVA brush head 43 and the brush head motor 42. The pressure sensor 44 is coupled to the brush lifting arm 41 to realize real-time control of the downward pressure of the PVA brush head 43 on the wafer surface, thereby avoiding damage to the wafer during the brushing process. Water spray pipes 45 for spraying deionized water onto the wafer surface to improve the brushing effect are fixedly connected to both ends of the wafer positioning seat 2 on the base 1. A soaking tank 46 for soaking PVA brush head 43 is also fixedly connected to the base 1. A replenishment pipe 47 for replenishing deionized water is provided on the side wall of the soaking tank 46, and a drain pipe is provided at the bottom of the soaking tank 46. The replenishment pipe 47 and the drain pipe realize the circulation of deionized water in the soaking tank 46. When not being brushed, the PVA brush head 43 is soaked in the soaking tank 46 to ensure that the PVA brush head 43 is clean. At the same time, the circulation of deionized water in the soaking tank 46 through the replenishment pipe 47 and the drain pipe further ensures the cleanliness of the PVA brush head 43 and ensures the stability of the brushing process.
[0018] refer to Figure 3 Specifically, the nozzle cleaning assembly 5 includes a nozzle lifting arm 51 fixedly connected to the base 1 and a nozzle fixing block 52 adjustable and fixedly connected to the swing end of the nozzle lifting arm 51. A megasonic cleaning nozzle 53 for spraying deionized water and at least one chemical cleaning nozzle 54 for spraying chemical cleaning fluid are fixedly connected to the nozzle fixing block 52. A nitrogen purging nozzle 55 for drying residual droplets on the wafer surface is also fixedly connected to the nozzle fixing block 52. The nozzle cleaning assembly 5, by using the megasonic cleaning nozzles 53 to spray deionized water carrying megasonic energy onto the wafer surface, powerfully removes tiny particulate contaminants adhering to the wafer surface. The chemical cleaning nozzles 54 spray chemical cleaning fluid onto the wafer surface to meet the cleaning needs of different contaminants, thereby avoiding particle residue. After cleaning, the nitrogen purging nozzles 55 purge the wafer surface with nitrogen to quickly remove residual droplets. In this embodiment, two sets of chemical cleaning nozzles 54 are provided.
[0019] refer to Figure 4Specifically, the infrared drying assembly 6 includes an infrared lifting arm 61 fixedly connected to the base 1 and an infrared drying lamp 62 fixedly connected to the swing end of the infrared lifting arm 61. A lamp cover 63 for emitting heat is fixedly connected to the infrared drying lamp 62. After cleaning or brushing, the infrared drying assembly 6 emits infrared light to the wafer surface to quickly evaporate the moisture on the wafer surface and avoid water stains.
[0020] refer to Figure 5 Specifically, the lifting retaining ring assembly 3 includes a fixed base 31 fixedly connected to the base 1 and a lifting screw slide 32 fixedly connected to the fixed base 31 in the vertical direction. A lifting retaining ring 33 is fixedly connected to the sliding end of the lifting screw slide 32. In the initial state, the upper surface of the lifting retaining ring 33 is flush with the base 1. The lifting retaining ring assembly 3 raises the lifting retaining ring 33 through the lifting screw slide 32 during brushing or spraying to surround the wafer, thereby preventing the cleaning fluid from splashing. When not in use, the lifting screw slide 32 lowers the lifting retaining ring 33 to avoid affecting the wafer feeding.
[0021] Brief description of operating principle: The nozzle cleaning assembly 5 is equipped with mega-sound cleaning nozzles 53, which spray deionized water carrying mega-sound energy onto the wafer surface to powerfully remove tiny particulate contaminants. A chemical cleaning nozzle 54 sprays chemical cleaning solution onto the wafer surface to meet the cleaning needs of different contaminants, thus avoiding particle residue. After cleaning, a nitrogen purging nozzle 55 purges the wafer surface with nitrogen to quickly remove residual droplets. Simultaneously, the brush head assembly 4, equipped with a pressure sensor 44 coupled to the brush lifting arm 41, can real-time control the downward pressure of the PVA brush head 43 on the wafer surface, thus preventing damage to the wafer during brushing and positioning. The base 2 is equipped with water spray pipes 45 at both ends for spraying deionized water onto the wafer surface to improve the cleaning effect. At the same time, an immersion tank 46 is set on the base 1. When not cleaning, the PVA brush head 43 is immersed in the immersion tank 46 to ensure that the PVA brush head 43 is clean. Meanwhile, the deionized water in the immersion tank 46 is circulated through the replenishment pipe 47 and the drain pipe to further ensure the cleanliness of the PVA brush head 43 and ensure the stability of the cleaning process. After cleaning or brushing, the infrared evaporation component 6 emits infrared light to the wafer surface to quickly evaporate the moisture on the wafer surface and avoid water stains. The lifting baffle assembly 3 raises the lifting baffle 33 through the lifting screw slide 32 during the brushing or spraying process to surround the wafer and prevent the cleaning fluid from splashing.
[0022] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment that make creative contributions as needed, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.
Claims
1. A mega-sound cleaning device, comprising a base (1); characterized in that, The base (1) is provided with a wafer positioning seat (2) for placing the wafer. The base (1) is fixedly connected with a lifting baffle assembly (3) for surrounding the wafer positioning seat (2) during the cleaning process to prevent the cleaning fluid from scattering. The base (1) is also fixedly connected with a brush head assembly (4) for brushing the wafer surface, a nozzle cleaning assembly (5) for spraying deionized water or cleaning fluid onto the wafer surface to achieve spray cleaning and drying the wafer surface, and an infrared drying assembly (6) for rapidly evaporating moisture from the wafer surface to avoid water stains.
2. The mega-sound cleaning device according to claim 1, characterized in that, The brush head assembly (4) includes a brush lifting arm (41) fixedly connected to the base (1) and a brush head motor (42) fixedly connected to the swing end of the brush lifting arm (41) in the vertical direction. A PVA brush head (43) for brushing the wafer surface is fixedly connected coaxially to the rotation shaft of the brush head motor (42). A pressure sensor (44) for real-time detection of the brushing pressure is fixed between the PVA brush head (43) and the brush head motor (42). The pressure sensor (44) is coupled to the brush lifting arm (41). The base (1) has water spray pipes (45) fixedly connected to both ends of the wafer positioning seat (2) for spraying deionized water onto the wafer surface to improve the brushing effect.
3. The mega-sound cleaning device according to claim 2, characterized in that, The base (1) is also fixedly connected to a soaking pool (46) for soaking the PVA brush head (43). The side wall of the soaking pool (46) is provided with a replenishment pipe (47) for replenishing deionized water. The bottom of the soaking pool (46) is provided with a drain pipe. Based on the replenishment pipe (47) and the drain pipe, the deionized water in the soaking pool (46) is circulated.
4. The mega-sound cleaning device according to claim 1, characterized in that, The nozzle cleaning assembly (5) includes a nozzle lifting arm (51) fixedly connected to the base (1) and a nozzle fixing block (52) that can be adjusted and fixedly connected to the swing end of the nozzle lifting arm (51). The nozzle fixing block (52) is fixedly connected to a megasonic cleaning nozzle (53) for spraying deionized water and at least one chemical cleaning nozzle (54) for spraying chemical cleaning liquid. The nozzle fixing block (52) is also fixedly connected to a nitrogen purging nozzle (55) for blowing dry residual droplets on the wafer surface.
5. The mega-sound cleaning device according to claim 4, characterized in that, The chemical cleaning nozzle (54) is provided in two sets.
6. The mega-sound cleaning device according to claim 1, characterized in that, The infrared drying assembly (6) includes an infrared lifting arm (61) fixedly connected to the base (1) and an infrared drying lamp (62) fixedly connected to the swing end of the infrared lifting arm (61). A lamp cover (63) for generating heat is fixedly connected to the infrared drying lamp (62).
7. The mega-sound cleaning device according to claim 1, characterized in that, The lifting retaining ring assembly (3) includes a fixed seat (31) fixedly connected to the base (1) and a lifting screw slide (32) fixedly connected to the fixed seat (31) in the vertical direction. The sliding end of the lifting screw slide (32) is fixedly connected to a lifting retaining ring (33). In the initial state, the upper surface of the lifting retaining ring (33) is flush with the base (1).