A wafer heating device

Abstract

This utility model discloses a wafer heating device, relating to the field of semiconductor equipment technology. The device includes a water-cooled plate, with a support plate, a heating plate, and a pressure ring disposed at its upper end. The support plate is connected to the water-cooled plate, and a groove is formed on the support plate. A stepped portion is formed at the edge of the groove. The heating plate is mounted on the stepped portion, and an annular boss is formed at the edge of the stepped portion. After the pressure ring is connected to the annular boss, it can fix the heating plate between the pressure ring and the stepped portion. A second gap space is formed between the bottom of the heating plate and the bottom of the groove, and a third gap space is formed between the inner peripheral sidewall of the annular boss and the pressure ring and the outer peripheral sidewall of the heating plate. The device provided by this utility model can reduce the contact area between the bottom of the heating plate and the bottom of the groove of the support plate, thereby reducing heat transfer downwards and ensuring sufficient heating efficiency; at the same time, it can avoid damage caused by thermal expansion of the heating plate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and more specifically, to a wafer heating device. Background Technology

[0002] In the semiconductor device manufacturing process, wafer heating is a key step in core processes such as thin film deposition, plasma etching, annealing, and ion implantation.

[0003] In existing wafer heating devices, the core heating component is the heating plate, which contains built-in heating elements. To achieve fixation and heat dissipation control of the heating plate, the commonly used installation structure in the industry is to drill threaded holes in the heating plate and fasten it to a metal water-cooling plate with screws. However, this installation method has a small thermal expansion margin, especially at high temperatures, because the thermal expansion mismatch between the water-cooling plate and the heating plate can easily cause the heating plate to crack. At the same time, the threaded holes can also affect temperature uniformity.

[0004] Therefore, it is necessary to provide a new wafer heating device. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a wafer heating device to solve the problems existing in the prior art.

[0006] To achieve the above objectives, the technical solution of this utility model is as follows: A wafer heating device includes a mounting base, on which a water-cooled plate is disposed, and at the upper end of the water-cooled plate are a support plate, a heating plate, and a pressure ring. The heating plate is equipped with a heating element and a heating electrode connected to the heating element. The heating electrode is connected to an external power source through a connecting component. The support plate is connected to the water-cooling plate, and a first gap space is formed between the two. A groove is formed on the support plate, and a step portion protruding upward from the bottom of the groove is formed on the edge of the groove. The heating plate is installed on the step portion, and a circumferentially extending annular boss is formed on the edge of the step portion. After the pressure ring is connected to the annular boss, the heating plate can be fixed between the pressure ring and the stepped portion, and a second gap space is formed between the bottom of the heating plate and the bottom of the groove, and a third gap space is formed between the inner peripheral sidewall of the annular boss and the pressure ring and the outer peripheral sidewall of the heating plate.

[0007] Furthermore, at least one shielding plate is provided between the support plate and the water-cooling plate.

[0008] Furthermore, the support plate, shielding plate, and water-cooling plate are fixed by screws, and the screw connection positions are set at the annular boss of the support plate and at the edge positions of the shielding plate and the water-cooling plate.

[0009] Furthermore, a locating ring is fitted around the outer periphery of the screw.

[0010] Furthermore, a heat insulation sleeve is provided between the screw and the water-cooling plate, and a second spring is installed between the heat insulation sleeve and the screw.

[0011] Furthermore, a reflective layer is provided at the bottom of the groove.

[0012] Furthermore, the pressure ring includes a pressure ring body and a flange portion formed on the upper end of the pressure ring body and extending inward. The pressure ring body is connected to the annular boss, and the flange portion is pressed against the upper end of the heating plate. A chamfer is provided on the inner circumference of the flange portion.

[0013] Furthermore, a positioning pin is provided at the center of the groove, and a corresponding positioning groove is provided at the center of the bottom of the heating plate.

[0014] Furthermore, a fourth gap space is formed between the upper end of the positioning pin and the bottom of the positioning groove.

[0015] Furthermore, the connection assembly includes a current feeder, a vacuum feeder seal, and a misaligned adapter. The current feeder is connected to the heating electrode, the vacuum feeder seal is disposed inside the mounting base, and the misaligned adapter is disposed in the first gap space. The lower end of the current feeder passes through the support plate and communicates with one end of the misaligned adapter. The other end of the misaligned adapter passes through the water-cooling plate and communicates with the vacuum feeder seal. The other end of the vacuum feeder seal is connected to an external power source.

[0016] Furthermore, the misaligned adapter includes a first vertical part, a second vertical part, and a horizontal part. The horizontal part and the first vertical part are both located in the first gap space. The second vertical part is located inside the water-cooling plate. One end of the horizontal part is connected to the first vertical part, and the other end is connected to the second vertical part. The misaligned adapter is fitted with a first insulating sleeve that conforms to its shape.

[0017] Furthermore, the current feeder includes a T-shaped electrode rod, an insulating heat insulation ring, a first spring, and an elastic connector. The elastic connector is disposed inside the first vertical part. The upper end of the T-shaped electrode rod contacts the heating electrode, the lower part is sequentially fitted with the insulating heat insulation ring and the first spring, and the tail end is inserted into the elastic connector.

[0018] The beneficial effects of this utility model are as follows: The wafer heating device provided by this utility model reduces the contact area between the bottom of the heating plate and the bottom of the support plate groove by installing the heating plate on the stepped part, thereby reducing the downward transfer of heat and ensuring sufficient heating efficiency. At the same time, a gap (third gap space) is reserved in the circumferential direction of the heating plate, which is specifically designed to provide a buffer space for the radial thermal expansion of the heating plate at high temperature. When the heating plate expands radially due to heat, the gap can accommodate its size change, avoid the outer peripheral structure from forming a rigid constraint on the heating plate, and prevent damage to the heating plate. The whole device can be used for wafer heating in semiconductor vacuum equipment. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0021] Figure 2 yes Figure 1 A magnified structural diagram of point A in the middle.

[0022] Figure 3 yes Figure 1 A magnified structural diagram at point B in the middle.

[0023] Figure 4 This is a schematic diagram of the support plate in this utility model.

[0024] Figure 5 This is a schematic diagram of the heating plate in this utility model.

[0025] Figure 6 This is a schematic diagram of the structure of the current feeder and the misaligned adapter in this utility model.

[0026] Explanation of reference numerals in the attached figures: 1. Water-cooled plate; 2. Support plate; 2a. Groove; 2b. Stepped section; 2c. Annular boss; 2d. Locating pin; 3. Heating plate; 3a. Positioning groove; 3b. Heating element; 3c. Heating electrode; 4. Pressure ring; 4a. Pressure ring body; 4b. Flange; 4c. Chamfer; 5. First gap space; 6. Second gap space; 7. Third gap space; 8. Shielding plate; 9. Screw; 10. Positioning ring; 11. Heat insulation sleeve; 12. Second spring; 13. Reflective layer; 14. Fourth gap space; 15. Mounting base; 16. Current feeder; 16a. T-shaped electrode rod; 16b. Insulating heat insulation ring; 16c. First spring; 16d. Elastic connector; 17. Vacuum feedthrough seal; 17a. Long electrode rod; 17b. Second insulating sleeve; 17c. Sealing ring; 18. Misaligned adapter; 18a. First vertical part; 18b. Second vertical part; 18c. Horizontal part; 19. First insulating sleeve; 100. Vacuum cavity. Detailed Implementation

[0027] The structure provided by this utility model will be explained and described in detail below with reference to the accompanying drawings.

[0028] refer to Figures 1 to 5 As shown, this embodiment specifically discloses a wafer heating device. In order to avoid contamination of the wafer surface by impurities such as oxygen, water vapor, and dust in the atmospheric environment and to ensure process purity and device performance, the wafer heating device is generally used in a vacuum chamber 100. Specifically, it can be installed in the vacuum chamber 100 through the mounting base 15. Specifically, the wafer heating device includes a mounting base 15, on which a water-cooled plate 1 is provided, and a support plate 2, a heating plate 3 and a pressure ring 4 are provided at the upper end of the water-cooled plate 1; The water-cooled plate 1 is preferably made of a metal material with good thermal conductivity, and has a cooling water circulation channel (not shown in the figure) inside, which is used to carry away the heat transferred to the water-cooled plate 1 through the circulating cooling water, thereby protecting the vacuum chamber 100 and achieving a sealing effect. Understandably, the heating plate 3 is equipped with a heating element 3b and a heating electrode 3c connected to the heating element 3b. The heating electrode 3c is connected to an external power source through a connecting component. That is, after the heating element 3b is connected to an external power source through the heating electrode 3c and the connecting component, it generates heat to heat up the heating plate 3.

[0029] The structure of the heating plate 3 can be a conventional heating plate structure, such as a structure in which a mica heater is sandwiched between two structural plates, or a structure in which a heating wire is sandwiched between two insulating plates, or a thick film heater, or a structure in which an electrode layer is screen-printed on an insulating substrate and then an insulating layer is sintered with a high-temperature sintering paste, or an HTCC ceramic co-fired heater, etc. No specific limitation is made here, as long as the heating plate 3 can generate heat after being powered on.

[0030] The support plate 2 is connected to the water-cooled plate 1, and a first gap space 5 is formed between the two. A groove 2a is formed on the support plate 2, and a step 2b protruding upward from the bottom of the groove 2a is formed on the edge of the groove 2a. The heating plate 3 is installed on the step 2b, and a circumferentially extending annular boss 2c is formed on the edge of the step 2b. After the pressure ring 4 is connected to the annular boss 2c (specifically, it can be detachably connected and fixed with screws), the heating plate 3 can be fixed between the pressure ring 4 and the step portion 2b. A second gap space 6 is formed between the bottom of the heating plate 3 and the bottom of the groove 2a. A third gap space 7 is formed between the inner peripheral sidewall of the annular boss 2c and the pressure ring 4 and the outer peripheral sidewall of the heating plate 3. That is, a third gap space 7 is formed between the inner peripheral sidewall of the annular boss 2c and the outer peripheral sidewall of the heating plate 3, and between the inner peripheral sidewall of the pressure ring 4 and the outer peripheral sidewall of the heating plate 3.

[0031] The width of the third gap space 7 is slightly larger than the linear expansion of the heating plate 3 at the operating temperature. That is, the linear expansion coefficient of the heating plate 3 is α, the radius of the heating plate 3 is R, the operating temperature is T, the room temperature is 20℃, and the gap width of the third gap space is L≥αR(T-20).

[0032] Optionally, the pressure ring 4 includes a pressure ring body 4a and a flange portion 4b formed on the upper end of the pressure ring body 4a and extending inward; the pressure ring body 4a is connected to the annular boss 2c, and the flange portion 4b is pressed against the upper end of the heating plate 3. In this case, the third gap space 7 is located between the inner sidewall of the pressure ring body 4a and the outer peripheral sidewall of the heating plate 3.

[0033] The diameter of the flange portion 4b of the pressure ring 4 is matched with the wafer size, that is, slightly larger than the wafer diameter, so as to press the wafer tightly; in some embodiments, a chamfer 4c is provided on the inner circumference of the flange portion 4b to facilitate the placement of the wafer on the upper surface of the heating plate 3.

[0034] In some other embodiments, an inner inclined surface can be provided on the inner side of the flange portion 4b of the pressure ring 4, and an outer inclined surface corresponding to the inner inclined surface on the outer side of the heating plate can be provided. The inner inclined surface and the outer inclined surface fit together, which can also achieve the fixation of the heating plate 3 by the pressure ring 4.

[0035] In this embodiment, by mounting the heating plate 3 on the step portion 2b, the contact area between the bottom of the heating plate 3 and the bottom of the groove 2a of the support plate 2 can be reduced, thereby reducing the downward transfer of heat and ensuring that the wafer above the heating plate 3 has sufficient heating efficiency. At the same time, a gap (third gap space 7) is reserved in the circumferential direction of the heating plate 3, which is specifically designed to provide a buffer space for the radial thermal expansion of the heating plate 3 at high temperature. When the heating plate 3 is heated and expands radially, the third gap space 7 can accommodate its size change, avoid the outer peripheral structure from forming a rigid constraint on the heating plate 3, and prevent damage to the heating plate 3.

[0036] Optionally, the support plate 2 may be made of a ceramic material with excellent high-temperature resistance and thermal insulation properties, preferably oxide ceramic or porous oxide ceramic, which offers superior thermal insulation performance and lower cost. To further improve the thermal insulation capability of the support plate 2 in a vacuum, a reflective layer 13 may be provided on the upper surface of the support plate 2, i.e., the bottom of the groove 2a. This reflective layer 13 may be a dense and glossy glaze layer formed by firing or a glossy coating of deposited oxide, which can improve the heat reflection capability and reduce heat transfer downwards and to the chamber and atmospheric side.

[0037] In some preferred embodiments, if the temperature of the heating plate 3 is high, at least one shielding plate 8 can be provided between the support plate 2 and the water-cooled plate 1. The shielding plate 8 can be a high-temperature resistant bright metal shielding plate, or a heat-insulating ceramic with a smooth surface. Alternatively, a glaze layer can be added to the ceramic plate, or a bright oxide coating can be deposited to improve the heat reflection capability. In a vacuum, one shielding plate 8 can reduce the downward temperature transfer by approximately 150°C-200°C. In actual use, the number of shielding plates 8 can be calculated based on the operating temperature and the cooling capacity of the water-cooled plate 1.

[0038] Continue to refer to Figure 1 and Figure 3 As shown, the support plate 2, shielding plate 8, and water-cooling plate 1 are fixed by screws 9. The screws 9 are connected at the annular boss 2c of the support plate 2 and at the edge of the shielding plate 8 and the water-cooling plate 1. The screw holes on the water-cooling plate 1 are slightly larger to match the different thermal expansion of each part. A positioning ring 10 is fitted around the outer periphery of the screws 9. The positioning ring 10 can ensure the installation height and parallelism of the heating plate 3.

[0039] In some embodiments, a heat insulation sleeve 11 is provided between the screw 9 and the water-cooled plate 1. The heat insulation sleeve 11 can reduce the transfer of heat to the water-cooled plate 1 through the screw 9. A second spring 12 is installed between the heat insulation sleeve 11 and the locking nut of the screw 9. The second spring 12 is specifically a wave spring, which is used to buffer thermal shock or motion shock.

[0040] Continue to refer to Figure 1 , Figure 4 and Figure 5 As shown, a positioning pin 2d is provided at the center of the groove 2a, and a corresponding positioning groove 3a is provided at the center of the bottom of the heating plate 3. By setting the positioning groove 3a and the positioning pin 2d, the center of the heating plate 3 can be fixed and limited. When each part expands due to heat, it expands in the diametrical direction with the central positioning pin 2d as the base point. A fourth gap space 14 is formed between the upper end of the positioning pin 2d and the bottom of the positioning groove 3a. The setting of the fourth gap space 14 also provides a buffer space when they expand due to heat, so as to avoid damage to the heating plate 3 or the support plate 2.

[0041] Continue to refer to Figures 1 to 6In this embodiment, the connection assembly includes a current feeder 16, a vacuum feeder seal 17, and a misaligned adapter 18. The current feeder 16 is connected to the heating electrode 3c. The vacuum feeder seal 17 is disposed inside the mounting base 15. The misaligned adapter 18 is disposed in the first gap space 5. The lower end of the current feeder 16 passes through the support plate 2 and communicates with one end of the misaligned adapter 18. The other end of the misaligned adapter 18 passes through the water-cooling plate 1 and communicates with the vacuum feeder seal 17. The other end of the vacuum feeder seal 17 is connected to an external power source.

[0042] The vacuum feedthrough seal 17 is used to ensure the airtightness of the vacuum chamber 100 while introducing external power into the vacuum chamber 100. The vacuum feedthrough seal 17 includes a long electrode rod 17a connected to the external power source. A second insulating sleeve 17b is sleeved on the outer periphery of the long electrode rod 17a to achieve insulation and heat insulation effect. In some embodiments, an outer flange is formed on the outer periphery of the second insulating sleeve 17b, and a sealing ring 17c is sleeved on the outer flange to further improve the airtightness.

[0043] Optionally, in some embodiments, a straight connector can be used to replace the misaligned adapter 18. However, connecting the current feeder 16 and the vacuum feeder seal 17 through a straight connector can easily lead to more heat being dissipated through the straight connector, affecting temperature uniformity.

[0044] Therefore, in this embodiment, the misaligned adapter 18 is preferred.

[0045] The current feeder 16 and the vacuum feeder seal 17 are connected by the misaligned adapter 18, which reduces the transfer of heat to the vacuum sealing position, protects the vacuum feeder seal 17 from high temperature baking, and ensures the vacuum sealing of the vacuum chamber 100.

[0046] Furthermore, the misaligned adapter 18 includes a first vertical part 18a, a second vertical part 18b, and a horizontal part 18c. The horizontal part 18c and the first vertical part 18a are both located in the first gap space 5. The second vertical part 18b is located inside the water-cooled plate 1. One end of the horizontal part 18c is connected to the first vertical part 18a, and the other end is connected to the second vertical part 18b. The misaligned adapter 18 is fitted with a first insulating sleeve 19 that conforms to its shape.

[0047] Understandably, the misaligned adapter 18 is a conductive element used to connect the vacuum feed seal 17 and the current feed seal 16. The first vertical part 18a, the second vertical part 18b, and the horizontal part 18c of the misaligned adapter 18 form a cross-sectional shape that is roughly Z-shaped. Combined with the reflective layer 13 and the shielding plate 8, the second vertical part 18b and the horizontal part 18c are both located below the shielding plate 8, thereby significantly reducing the flow of heat from the upper heating plate 3 to the connection between the second vertical part 18b and the vacuum feed seal 17.

[0048] In addition, the first insulating sleeve 19 also provides insulation and heat insulation, ensuring operational safety.

[0049] Continue to refer to Figure 1 , Figure 2 and Figure 6 As shown, the current feeder 16 includes a T-shaped electrode rod 16a, an insulating heat-insulating ring 16b, a first spring 16c, and an elastic connector 16d. The elastic connector 16d is assembled and installed inside the first vertical part 18a. The upper end of the T-shaped electrode rod 16a contacts the heating electrode 3c, the lower part is sequentially fitted with the insulating heat-insulating ring 16b and the first spring 16c, and the tail is inserted into the elastic connector 16d.

[0050] The T-shaped electrode rod 16a increases the contact area with the heating electrode 3c. Preferably, the upper surface of the T-shaped electrode rod 16a can also be provided with some toothed protrusions, which can be inserted into the contact points of the heating electrode 3c, making the contact effect better. The first spring 16c ensures good contact between the T-shaped electrode rod 16a and the heating electrode 3c. The elastic connector 16d can be specifically selected as a crown spring, which ensures good electrical conductivity between the lower part of the T-shaped electrode rod 16a and the first vertical part 18a of the misaligned adapter 18. The insulating heat-insulating ring 16b can reduce the high-temperature baking of the first spring 16c and improve its service life.

[0051] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0052] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0053] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any at least one embodiment or example. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0054] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0055] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and simple improvements made on the substantive content of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer heating device, characterized by comprising: Includes a mounting base (15), on which a water-cooled plate (1) is provided, and at the upper end of the water-cooled plate (1) are a support plate (2), a heating plate (3) and a pressure ring (4); The heating plate (3) is provided with a heating element (3b) and a heating electrode (3c) connected to the heating element (3b). The heating electrode (3c) is connected to an external power source through a connecting assembly. The support plate (2) is connected to the water-cooled plate (1), and a first gap space (5) is formed between the two. A groove (2a) is formed on the support plate (2), and a step (2b) protruding upward from the bottom of the groove (2a) is formed on the edge of the groove (2a). The heating plate (3) is installed on the step (2b), and a circumferentially extending annular boss (2c) is formed on the edge of the step (2b). After the pressure ring (4) is connected to the annular boss (2c), the heating plate (3) can be fixed between the pressure ring (4) and the step portion (2b), and a second gap space (6) is formed between the bottom of the heating plate (3) and the bottom of the groove (2a), and a third gap space (7) is formed between the inner peripheral sidewall of the annular boss (2c) and the pressure ring (4) and the outer peripheral sidewall of the heating plate (3).

2. The wafer heating apparatus according to claim 1, wherein At least one shielding plate (8) is also provided between the support plate (2) and the water-cooled plate (1).

3. The wafer heating apparatus according to claim 2, characterized in that, The support plate (2), shielding plate (8), and water-cooling plate (1) are fixed by screws (9), and the screws (9) are connected at the annular boss (2c) of the support plate (2) and at the edge of the shielding plate (8) and water-cooling plate (1).

4. The wafer heating apparatus according to claim 3, characterized in that, The screw (9) is fitted with a positioning ring (10) on its outer periphery.

5. The wafer heating apparatus according to claim 3, characterized in that, A heat insulation sleeve (11) is provided between the screw (9) and the water-cooled plate (1), and a second spring (12) is installed between the heat insulation sleeve (11) and the screw (9).

6. The wafer heating apparatus according to claim 1, characterized in that, A reflective layer (13) is provided at the bottom of the groove (2a).

7. The wafer heating apparatus according to claim 1, characterized in that, The pressure ring (4) includes a pressure ring body (4a) and a flange portion (4b) formed on the upper end of the pressure ring body (4a) and extending inward. The pressure ring body (4a) is connected to the annular boss (2c), and the flange portion (4b) is pressed onto the upper end of the heating plate (3). A chamfer (4c) is provided on the inner circumference of the flange portion (4b).

8. The wafer heating apparatus according to claim 1, characterized in that, A positioning pin (2d) is provided at the center of the groove (2a), and a positioning groove (3a) is provided at the center of the bottom of the heating plate (3).

9. The wafer heating apparatus according to claim 8, characterized in that, A fourth gap space (14) is formed between the upper end of the positioning pin (2d) and the bottom of the positioning groove (3a).

10. The wafer heating apparatus according to any one of claims 1-9, characterized in that, The connection assembly includes a current feeder (16), a vacuum feeder seal (17), and a misaligned adapter (18). The current feeder (16) is connected to the heating electrode (3c). The vacuum feeder seal (17) is disposed inside the mounting base (15). The misaligned adapter (18) is disposed in the first gap space (5). The lower end of the current feeder (16) passes through the support plate (2) and communicates with one end of the misaligned adapter (18). The other end of the misaligned adapter (18) passes through the water-cooling plate (1) and communicates with the vacuum feeder seal (17). The other end of the vacuum feeder seal (17) is connected to an external power source.

11. The wafer heating apparatus according to claim 10, characterized in that, The misaligned adapter (18) includes a first vertical part (18a), a second vertical part (18b), and a horizontal part (18c). The horizontal part (18c) and the first vertical part (18a) are both located in the first gap space (5). The second vertical part (18b) is located inside the water-cooled plate (1). One end of the horizontal part (18c) is connected to the first vertical part (18a), and the other end is connected to the second vertical part (18b). The misaligned adapter (18) is fitted with a first insulating sleeve (19) that is adapted to its shape.

12. The wafer heating apparatus according to claim 11, characterized in that, The current feeder (16) includes a T-shaped electrode rod (16a), an insulating heat-insulating ring (16b), a first spring (16c), and an elastic connector (16d). The elastic connector (16d) is disposed inside the first vertical part (18a). The upper end of the T-shaped electrode rod (16a) contacts the heating electrode (3c), the lower part is sequentially fitted with the insulating heat-insulating ring (16b) and the first spring (16c), and the tail end is inserted into the elastic connector (16d).

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