A type of spray head

Abstract

This invention provides a spray head. The spray head includes an air inlet, a spray panel, and an adjusting ring. The air inlet is connected to an air source. The spray panel faces the process chamber. The adjusting ring is located between the air inlet and the spray panel and includes multiple annularly distributed adjusting plates, wherein the multiple adjusting plates are connected to a rotating shaft and rotate under the drive of the rotating shaft to adjust the air inlet diameter relative to the spray panel.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing, and specifically to a spray head. Background Technology

[0002] In the core processes of chip manufacturing, key processes such as etching, chemical vapor deposition (CVD), and atomic layer deposition (ALD) all rely on the precise introduction of process gases of specific compositions into the reaction chamber. The top-inlet configuration commonly used in the industry is designed based on the free diffusion characteristics of gases from top to bottom. By optimizing structural parameters such as the inlet aperture and distribution density, the gas inlet rate in the wafer center and edge regions tends to be consistent, ultimately resulting in a nearly uniform gas distribution on the wafer surface.

[0003] However, as the feature size of devices in chip manufacturing processes continues to shrink, the requirements for process precision and global wafer consistency are increasing exponentially. In practical engineering scenarios, edge effects at the wafer edges, including temperature gradients, plasma sheath distortion, and differences in gas diffusion boundary layer thickness, naturally cause a deviation between the reaction kinetics environment in the edge region and that in the center region. To compensate for this deviation and achieve precise matching or on-demand differentiated control of the reaction rates between the wafer center and edge regions, a special gas intake design is needed to create a controllable gradient distribution of gas on the wafer surface. This allows for targeted adjustments to the reaction intensity in different regions, optimizing the edge profile and reducing device parameter dispersion.

[0004] To overcome the aforementioned deficiencies of the prior art, this utility model provides a spray head that enables control of the air inlet diameter of the spray panel, thereby precisely controlling the deposition in the wafer edge region. Utility Model Content

[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0006] To overcome the aforementioned deficiencies of the prior art, this utility model provides a spray head that controls the air inlet diameter of the spray panel by controlling the rotation of multiple adjusting plates, thereby precisely controlling the deposition rate in the wafer edge region and improving the edge process of thin film deposition.

[0007] Specifically, the first aspect of this utility model provides a spray head. The spray head includes an air inlet, a spray panel, and an adjusting ring. The air inlet is connected to an air source. The spray panel faces the process chamber. The adjusting ring is located between the air inlet and the spray panel and includes multiple annularly distributed adjusting plates, wherein the multiple adjusting plates are connected to a rotating shaft and rotate under the drive of the rotating shaft to adjust the air inlet diameter relative to the spray panel.

[0008] Furthermore, in some embodiments of this invention, the spray head further includes a drive module. This drive module is connected to the rotating shafts of each of the adjusting plates via a transmission mechanism to drive the rotating shafts to rotate.

[0009] Furthermore, in some embodiments of this utility model, the drive module includes a motor and a reduction mechanism, wherein the motor is connected to the rotating shaft via the reduction mechanism and the transmission mechanism.

[0010] Furthermore, in some embodiments of this utility model, the end of the rotating shaft connected to the adjusting plate is provided with a toothed key structure, and the position where the adjusting plate is connected to the rotating shaft is provided with a keyway. The rotating shaft controls the rotation angle of the adjusting plate via the toothed key structure and the keyway.

[0011] Furthermore, in some embodiments of this utility model, the shape of the plurality of adjustment plates is selected from parallelogram or scimitar shape.

[0012] Furthermore, in some embodiments of this utility model, the spray head also includes a baffle located between the adjusting ring and the spray panel, and has at least one hollow structure.

[0013] Furthermore, in some embodiments of this utility model, the spray panel is provided with a plurality of spray holes, wherein the diameter of the spray holes decreases as the distance from the center region of the spray panel increases, and / or the distribution density of the spray holes decreases as the distance from the center region of the spray panel increases.

[0014] Furthermore, in some embodiments of this utility model, the spray head further includes a controller, which is configured to: retract a plurality of the adjusting tabs in response to an instruction to increase the film thickness in the wafer edge region to expand the air inlet diameter of the air inlet to the spray panel; and extend a plurality of the adjusting tabs in response to an instruction to decrease the film thickness in the wafer edge region to reduce the air inlet diameter of the air inlet to the spray panel.

[0015] Furthermore, in some embodiments of this utility model, the controller is further configured to: determine the target rotation angle of a plurality of the adjusting plates according to the target air inlet diameter of the air inlet to the spray panel, and rotate the plurality of adjusting plates accordingly according to the target rotation angle. Attached Figure Description

[0016] The above-described features and advantages of this invention can be better understood after reading the following detailed description of the embodiments of this disclosure in conjunction with the accompanying drawings. In the drawings, the components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0017] Figure 1 A schematic diagram of a spray head according to some embodiments of the present invention is shown.

[0018] Figure 2 A cross-sectional view of a spray head according to some embodiments of the present invention is shown.

[0019] Figure 3 A top view of a spray head illustrated according to some embodiments of the present invention is shown.

[0020] Figure 4 A partial schematic diagram of the rotating shaft in a spray head, according to some embodiments of the present invention, is shown.

[0021] Figure 5 A schematic diagram of a rotating shaft in a spray head, according to some embodiments of the present invention, is shown.

[0022] Figure 6 A schematic diagram of a parallelogram-shaped adjustment piece according to some embodiments of the present invention is shown.

[0023] Figure 7 A schematic diagram of a curved adjusting plate according to some embodiments of the present invention is shown.

[0024] Figure 8 A schematic diagram illustrating the working state of the adjustment plate according to some embodiments of the present invention is shown.

[0025] Figure 9 A process curve diagram of wafer edge deposition, plotted according to existing technology, is shown.

[0026] Figure 10 A process curve diagram of wafer edge deposition according to some embodiments of the present invention is shown.

[0027] Figure label:

[0028] Inlet 1

[0029] Spray panel 2

[0030] Adjusting ring 3

[0031] baffle 4

[0032] Driver Module 5

[0033] Adjustment plate 6

[0034] Spray hole 7 Detailed Implementation

[0035] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Although the description of this utility model will be presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived based on the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description.

[0036] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described device must be manufactured or operated in a specific orientation; therefore, they should not be construed as limiting the scope of this invention.

[0038] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first component, region, layer, and / or part discussed below may be referred to as the second component, region, layer, and / or part without departing from some embodiments of this utility model.

[0039] As mentioned above, in the core processes of chip manufacturing, key processes such as etching, chemical vapor deposition (CVD), and atomic layer deposition (ALD) all rely on the precise introduction of process gases of specific compositions into the reaction chamber. The top-inlet configuration currently widely used in the industry is designed based on the free diffusion characteristics of gases from top to bottom. By optimizing structural parameters such as the inlet aperture and distribution density, the gas inlet rate in the wafer center and edge regions tends to be consistent, ultimately resulting in a nearly uniform gas distribution on the wafer surface.

[0040] However, as the feature size of devices in chip manufacturing processes continues to shrink, the requirements for process precision and global wafer consistency are increasing exponentially. In practical engineering scenarios, edge effects at the wafer edges, including temperature gradients, plasma sheath distortion, and differences in gas diffusion boundary layer thickness, naturally cause a deviation between the reaction kinetics environment in the edge region and that in the center region. To compensate for this deviation and achieve precise matching or on-demand differentiated control of the reaction rates between the wafer center and edge regions, a special gas intake design is needed to create a controllable gradient distribution of gas on the wafer surface. This allows for targeted adjustments to the reaction intensity in different regions, optimizing the edge profile and reducing device parameter dispersion.

[0041] To overcome the aforementioned deficiencies of the prior art, this utility model provides a spray head that controls the air inlet diameter of the spray panel by controlling the rotation of multiple adjusting plates, thereby precisely controlling the deposition rate in the wafer edge region and improving the edge process of thin film deposition.

[0042] Next, we will combine Figures 1-3 The first aspect of this utility model describes the spray head.

[0043] Figure 1 A schematic diagram of a spray head according to some embodiments of the present invention is shown.

[0044] Figure 2 A cross-sectional view of a spray head according to some embodiments of the present invention is shown.

[0045] Figure 3 A top view of a spray head illustrated according to some embodiments of the present invention is shown.

[0046] like Figures 1-3As shown, in some embodiments of this utility model, the spray head provided by the first aspect of this utility model includes an air inlet 1, a spray panel 2, and an adjusting ring 3. The air inlet 1 is connected to an air source. The spray panel 2 faces the process chamber. The adjusting ring 3 is disposed between the air inlet 1 and the spray panel 2, and includes a plurality of annularly distributed adjusting plates 6, wherein the plurality of adjusting plates are connected to a rotating shaft and rotate under the drive of the rotating shaft to adjust the air inlet diameter of the air inlet relative to the spray panel.

[0047] Please continue to refer to this. Figure 3 In some embodiments of this invention, the spray head further includes a drive module 5. The drive module 5 is connected to the rotating shaft of each adjusting plate via a transmission mechanism to drive the rotating shaft to rotate.

[0048] Furthermore, in some embodiments of this utility model, the drive module 5 includes a motor and a reduction mechanism, wherein the motor is connected to the rotating shaft via the reduction mechanism and the transmission mechanism.

[0049] Thus, by setting a speed reduction mechanism, this utility model can control the speed of the motor, thereby improving the control accuracy of the electric drive module for the rotation angle of the rotating shaft.

[0050] Furthermore, in some embodiments of this utility model, the spray head also includes a baffle 6 located between the adjusting ring 3 and the spray panel 2. The baffle has at least one hollow structure (e.g., a grid-like baffle) for mixing the gas before the airflow enters the spray panel, so that the gas is mixed evenly.

[0051] Please refer to the following. Figures 4-5 . Figure 4 A partial schematic diagram of the rotating shaft in a spray head, according to some embodiments of the present invention, is shown. Figure 5 A schematic diagram of a rotating shaft in a spray head, according to some embodiments of the present invention, is shown.

[0052] Furthermore, in some embodiments of this utility model, the end of the rotating shaft connecting the adjusting plate 6 is provided with a toothed key structure, and the position where the adjusting plate connects to the rotating shaft is provided with a keyway. The rotating shaft controls the rotation angle of the adjusting plate via the toothed key structure and the keyway.

[0053] Thus, this utility model can control the rotation angle of the adjusting plate 6 by controlling the rotation of the rotating shaft or the snap-fit ​​fixing of the toothed structure and the keyway, thereby adjusting the air inlet diameter of the spray panel.

[0054] Furthermore, in some embodiments of this utility model, the shapes of the plurality of adjusting pieces 6 are selected from parallelograms or scimitars. Please refer to... Figures 6-7 , Figure 6 A schematic diagram of a parallelogram-shaped adjusting piece according to some embodiments of the present invention is shown. Figure 7A schematic diagram of a curved adjusting vane according to some embodiments of the present invention is shown. Thus, the present invention allows for the selection and setting of adjusting vanes of different shapes according to different process requirements, satisfying the adjustment of the air inlet diameter under various conditions.

[0055] Further, please refer to Figure 8 , Figure 8 A schematic diagram illustrating the working state of the adjustment plate according to some embodiments of the present invention is shown.

[0056] In some embodiments of this utility model, a plurality of spray holes 7 are distributed on the spray panel. The diameter of the plurality of spray holes decreases as the distance from the center area of ​​the spray panel increases; and / or the distribution density of the spray holes decreases as the distance from the center area of ​​the spray panel increases.

[0057] Thus, by setting larger spray hole diameter and spray hole distribution density in the edge area of ​​the spray panel, this utility model further compensates for the deposition rate of wafer edge deposition, while facilitating further control of the adjustment sheet.

[0058] Furthermore, in some embodiments of the present invention, the spray head further includes a controller configured to: retract a plurality of adjusting tabs 6 in response to an instruction to increase the film thickness in the wafer edge region to expand the air inlet diameter of the air inlet to the spray panel; and extend a plurality of adjusting tabs 6 in response to an instruction to decrease the film thickness in the wafer edge region to reduce the air inlet diameter of the air inlet to the spray panel.

[0059] Furthermore, in some embodiments of this utility model, the controller is also configured to: determine the target rotation angle of multiple adjusting plates according to the target air inlet diameter of the air inlet relative to the spray panel, and rotate the multiple adjusting plates 6 accordingly based on the target rotation angle. For example, in some specific embodiments, when the maximum rotation angle of the adjusting plate 6 driven by the rotating shaft is 90 degrees, in response to the spray panel requiring the largest air inlet diameter, the multiple adjusting plates 6 are rotated to retract to the initial position with an angle of 0 degrees; in response to the spray panel requiring the smallest air inlet diameter, the multiple adjusting plates 6 are rotated to the maximum position with an angle of 90 degrees; and in response to the spray panel requiring a moderate air inlet diameter, the multiple adjusting plates 6 are rotated to any value between 0 degrees and 90 degrees.

[0060] Thus, by controlling the rotation angle of multiple adjustment plates, this invention can flexibly control the air inlet diameter of the spray panel as needed, thereby precisely controlling the deposition rate in the wafer edge region and improving the edge process of thin film deposition.

[0061] The working principle of the above-mentioned spray head will be described below with reference to some embodiments of the control methods for the spray head. Those skilled in the art will understand that these embodiments of the control methods indicate some non-limiting implementations provided by this utility model, intended to clearly demonstrate the technical concept of this utility model and provide some specific solutions that are easy for the public to implement, rather than being intended to limit all working methods of the above-mentioned spray head. Similarly, the above-mentioned spray head is also only some non-limiting implementations provided by this utility model, and does not constitute a limitation on the execution order or the object of operation of the steps in the following control methods.

[0062] In some embodiments of the present invention, the method for controlling the spray head includes the following steps: determining the target thickness of the thin film deposition in the wafer edge region, and adjusting the air intake using the spray head provided in the first aspect of the present invention; in response to the actual thin film thickness in the wafer edge region being less than the target thickness, retracting a plurality of adjusting tabs in the spray head to expand the air intake port diameter relative to the spray panel; and in response to the actual thin film thickness in the wafer edge region being greater than the target thickness, extending the plurality of adjusting tabs in the spray head to reduce the air intake port diameter relative to the spray panel.

[0063] Please refer to the following. Figures 9-10 , Figure 9 The diagram shows a process profile for wafer edge deposition based on existing technology. Figure 10 The diagram illustrates a wafer edge deposition process curve according to some embodiments of the present invention. Multiple process curves in the same graph are generated by collecting the normalized thickness of the thin film in the same deposition process under different process conditions. The horizontal axis in the graph represents the distance from the film thickness collection point to the wafer center, and the vertical axis represents the normalized thickness of the thin film at each collection point. Therefore, each process curve in the same graph can reflect the variation in the film edge deposition thickness when process conditions change.

[0064] Please refer to Figure 9 ,like Figure 9 As shown in the figure, the process conditions of the orange process curve are the initial flow rate of the gas at the inlet, the process conditions of the blue process curve are 90% of the initial flow rate of the gas at the inlet, and the process conditions of the gray process curve are 110% of the initial flow rate of the gas at the inlet. It can be seen from this figure that in the prior art, it is difficult to directly adjust the deposition thickness at various locations of the film by changing the flow rate of the gas at the inlet.

[0065] On the contrary Figure 10 The process curve generated according to an embodiment of the present invention is as follows: Figure 10 As shown, the process conditions of the orange process curve are the initial air inlet diameter of the spray panel, the process conditions of the blue process curve are the minimum air inlet diameter of the air inlet, and the process conditions of the yellow process curve are the maximum air inlet diameter of the air inlet.

[0066] Therefore, by rotating the adjusting plate, the air inlet diameter of the air inlet to the spray panel is changed, which significantly adjusts the deposition thickness of the film, especially the deposition thickness in the edge area of ​​the film, and improves the edge process of film deposition.

[0067] In summary, this utility model provides a spray head that controls the air inlet diameter of the spray panel by controlling the rotation of multiple adjusting plates, thereby precisely controlling the deposition rate in the wafer edge region and improving the edge process of thin film deposition.

[0068] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0069] Those skilled in the art will understand that information, signals, and data can be represented using any of a variety of different techniques and skills. For example, the data, instructions, commands, information, signals, bits, symbols, and chips described throughout the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof.

[0070] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, circuits, and algorithm steps described in conjunction with the embodiments disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this hardware-software interchangeability, the various illustrative components, blocks, modules, circuits, and steps are described above in a generalized manner in their functional form. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in different ways for each specific application, but such implementation decisions should not be construed as departing from the scope of this invention.

[0071] Although the controller described in the above embodiments can be implemented through a combination of software and hardware, it is understood that the controller can also be implemented in software or hardware. For hardware implementation, the controller can be implemented using one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection of combinations of the above devices. For software implementation, the controller can be implemented using independent software modules such as procedures and functions running on a general-purpose chip, each module performing one or more functions and operations described herein.

[0072] The various illustrative logic modules and circuits described in conjunction with the embodiments disclosed herein may be implemented or performed using a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. The general-purpose processor may be a microprocessor, but in alternatives, it may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors cooperating with a DSP core, or any other such configuration.

[0073] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of both. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor such that the processor can read and write information to / from the storage medium. In an alternative, the storage medium may be integrated into the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and storage medium may reside as discrete components in the user terminal.

[0074] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functionality may be stored or transmitted as one or more instructions or code on or through a computer-readable medium. A computer-readable medium includes both computer storage media and communication media, encompassing any medium that facilitates the transfer of a computer program from one location to another. A storage medium may be any available medium accessible to a computer. By way of example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and is accessible to a computer. Any connection is also legitimately referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of a medium. As used in this article, disk and disc include compact discs (CDs), laser discs, optical discs, digital multi-purpose discs (DVDs), floppy disks, and Blu-ray discs. Disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of these should also be included within the scope of computer-readable media.

[0075] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A spray head, characterized in that, include: Air inlet, connected to the air source; The spray panel faces the process chamber; as well as An adjusting ring is disposed between the air inlet and the spray panel, and includes a plurality of annularly distributed adjusting plates, wherein the plurality of adjusting plates are connected to a rotating shaft and rotate under the drive of the rotating shaft to adjust the air inlet diameter of the air inlet relative to the spray panel.

2. The spray head as described in claim 1, characterized in that, Also includes: The drive module is connected to the rotating shaft of each of the adjustment plates via a transmission mechanism to drive the rotating shaft to rotate.

3. The spray head as described in claim 2, characterized in that, The drive module includes a motor and a reduction mechanism, wherein the motor is connected to the rotating shaft via the reduction mechanism and the transmission mechanism.

4. The spray head as described in claim 1, characterized in that, The rotating shaft is provided with a toothed key structure at the end where it connects to the adjusting plate, and a keyway is provided at the position where the adjusting plate connects to the rotating shaft. The rotating shaft controls the rotation angle of the adjusting plate via the toothed key structure and the keyway.

5. The spray head as described in claim 1, characterized in that, The shape of the plurality of adjustment plates is selected from parallelogram or scimitar.

6. The spray head as described in claim 1, characterized in that, Also includes: A baffle is located between the adjusting ring and the spray panel, and has at least one hollow structure.

7. The spray head as described in claim 1, characterized in that, The spray panel has multiple spray holes, among which, The diameter of the spray nozzle decreases as its distance from the center area of ​​the spray panel increases.

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