A silicon wafer straightening and feeding device

Abstract

This utility model relates to the technical field of physical vapor deposition, and more particularly to a silicon wafer straightening and feeding device, including a conveying platform, a detection device, a straightening mechanism, and a gripping device; a carrier carrying multiple silicon wafers is disposed on the conveying platform, and the conveying platform can drive the carrier to move in a horizontal direction; the detection device is disposed above the conveying platform and faces the conveying platform to detect whether the silicon wafers on the carrier are misaligned; the straightening mechanism is disposed on one side of the conveying platform, and the straightening mechanism is provided with a straightening position and positioning elements disposed around the straightening position; the gripping device is disposed above the conveying platform, and the gripping device can grip the silicon wafers and transfer the silicon wafers in the carrier to the straightening position or move the silicon wafers in the straightening position to the carrier; firstly, the detection device detects the misaligned silicon wafers on the carrier, then the gripping device grips the misaligned silicon wafers and moves them to the straightening direction on the straightening mechanism, and then the gripping device transports the straightened silicon wafers back to the carrier.

Description

Technical Field

[0001] This utility model relates to the technical field of physical vapor deposition, and in particular to a silicon wafer straightening and feeding device. Background Technology

[0002] Physical vapor deposition (PVD) is a technique that uses physical methods such as evaporation and sputtering to vaporize the coating material and deposit it onto a substrate surface. Due to its advantages such as simple process, uniform and dense film formation, and strong adhesion to the substrate, PVD is widely used in the field of solar cells. With the increasing prevalence of solar cells, reducing costs and increasing production capacity have become key priorities for solar cell companies. The PVD process uses AR atoms as a medium and incorporates magnetron sputtering technology to perform physical vapor deposition on silicon wafers.

[0003] Double-sided microcrystalline silicon wafers are stored in baskets and cannot directly enter the vacuum chamber for thin film deposition. They can only be placed onto a carrier plate by an automated feeding system. The automated feeding system consists of a basket transport track, a wafer buffer mechanism, a wafer transport track, a wafer positioning platform, a feeding gantry, and a carrier plate to transport the wafers to the main unit.

[0004] However, uneven ground or vibration of the docking platform during docking, wear and tear on the silicon wafer conveyor belt, synchronous pulley and motor due to long-term use can cause the silicon wafer to shift in position, which in turn causes the silicon wafer to fall into the chamber after entering the main unit, resulting in wasted production capacity and increasing the risk of inefficient wafer production. Utility Model Content

[0005] The purpose of this utility model is to provide a silicon wafer straightening and feeding device to solve the technical problems in the prior art, such as uneven ground or shaking of the docking platform during docking, wear and tear of silicon wafer conveyor belts, synchronous pulleys and motors due to long-term use, which can cause silicon wafers to shift in position, and thus cause them to fall into the chamber after entering the main unit, resulting in wasted production capacity and increased risk of inefficient wafer production.

[0006] In a first aspect, the present invention provides a silicon wafer straightening and feeding device, comprising:

[0007] A conveying platform, on which a carrier carrying multiple silicon wafers is disposed, the conveying platform being capable of driving the carrier to move along a first horizontal direction;

[0008] A detection device is disposed above the conveying platform and facing the conveying platform to detect whether the silicon wafer on the carrier is misaligned.

[0009] A correction mechanism is provided on one side of the conveying platform, and the correction mechanism is provided with a correction position and positioning components provided around the correction position;

[0010] A gripping device is disposed above the conveying platform. The gripping device is capable of gripping the silicon wafer and transferring the silicon wafer in the carrier to the correction position or moving the silicon wafer in the correction position to the carrier.

[0011] Furthermore, the gripping device includes a horizontal transfer platform and gripping components;

[0012] The horizontal transfer platform is disposed above the conveying platform, and the gripping component is movably disposed on the horizontal transfer platform along a second horizontal direction perpendicular to the first horizontal direction. The bottom of the gripping component is provided with an adsorption element for adsorbing the silicon wafer.

[0013] Furthermore, the gripping component also includes a fixing plate disposed along the first horizontal direction;

[0014] Several of the adsorption elements are arranged at intervals along the first horizontal direction at the bottom of the fixing plate.

[0015] Furthermore, the gripping assembly also includes a lifting mechanism, which is slidably disposed on the horizontal transfer platform along a second horizontal direction. The lifting mechanism has a lifting part that moves in a vertical direction, and the fixing plate is disposed on the lifting part.

[0016] Furthermore, the gripping device also includes pneumatic components;

[0017] The pneumatic assembly includes a transverse cylinder that drives the lifting mechanism to slide along a second horizontal direction, a lifting cylinder that drives the lifting part to move along a vertical direction, an air pump, and a regulating valve.

[0018] The transverse cylinder, the lifting cylinder, and the adsorption element are each connected to one end of the regulating valve, and the other end of the regulating valve is connected to the air pump.

[0019] Furthermore, the detection device includes a detection bracket and a detection camera;

[0020] The detection bracket is fixed to the conveying platform, and a suspension beam is provided on the detection bracket. The suspension beam is located above the conveying platform, and the detection camera is fixed to the suspension beam and faces the conveying platform.

[0021] Furthermore, multiple detection cameras are evenly spaced on the suspension beam.

[0022] Furthermore, the plurality of the correction mechanisms are uniformly arranged along the first horizontal direction;

[0023] The correction mechanism has two correction plates that are parallel and spaced apart along a first horizontal direction, and two positioning elements are spaced apart along the first horizontal direction on each correction plate; the four positioning elements are arranged in a rectangle to enclose a rectangular correction position.

[0024] Furthermore, the correction mechanism is provided with side positioning rollers, and a plurality of the side positioning rollers are positioned relative to both sides of the correction position along a first horizontal direction, and the side positioning rollers are rotatably disposed on the correction plate around a second horizontal direction.

[0025] Furthermore, the correction plate is also provided with a plurality of support balls, which are disposed within the correction position and rotatably disposed on the correction plate.

[0026] Compared with the prior art, the silicon wafer straightening and feeding equipment provided by this utility model includes a conveying platform, a detection device, a straightening mechanism, and a gripping device; a carrier carrying multiple silicon wafers is set on the conveying platform, and the conveying platform can drive the carrier to move in the horizontal direction; the detection device is set above the conveying platform and faces the conveying platform to detect whether the silicon wafers on the carrier are misaligned; the straightening mechanism is set on one side of the conveying platform, and the straightening mechanism is provided with a straightening position and positioning elements set around the straightening position; the gripping device is set above the conveying platform, and the gripping device can grip the silicon wafers and transfer the silicon wafers in the carrier to the straightening position or straighten the wafers in the carrier. The silicon wafer in the correct position is moved to the carrier. First, the detection device detects the offset silicon wafer on the carrier. Then, the gripping device grabs the offset silicon wafer and moves it to the correction mechanism to correct its direction. Finally, the gripping device transports the corrected silicon wafer back to the carrier. This solves the technical problems in the prior art where uneven ground or shaking of the docking platform during docking, as well as wear and tear on the silicon wafer conveyor belt, synchronous pulley, and motor over long-term use, can cause the silicon wafer to shift position, resulting in the silicon wafer falling into the chamber after entering the main unit, leading to wasted production capacity and increased risk of inefficient wafer production. This allows for the normal use of abnormally offset silicon wafers, increases production line output, and reduces operating costs. Attached Figure Description

[0027] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1This is a schematic diagram of the overall structure of a silicon wafer straightening and feeding device provided in an embodiment of the present utility model;

[0029] Figure 2 This is a schematic diagram of the main body of a silicon wafer straightening and feeding device provided in an embodiment of the present utility model;

[0030] Figure 3 This utility model provides a schematic diagram of the gripping device in a silicon wafer straightening and feeding equipment.

[0031] Figure 4 This is a schematic diagram of the structure of a silicon wafer straightening and feeding device provided in an embodiment of the present invention, showing the straightening mechanism carrying a silicon wafer.

[0032] Figure 5 This is a schematic diagram of the structure of a silicon wafer straightening and feeding device provided in an embodiment of the present invention when the straightening mechanism is not carrying a silicon wafer.

[0033] Figure label:

[0034] 100. Conveying platform;

[0035] 200. Detection device; 210. Suspension beam; 220. Detection camera;

[0036] 300. Correction mechanism; 310. Correction position; 320. Positioning component; 330. Correction plate; 340. Side positioning roller; 350. Support ball;

[0037] 400. Gripping device; 410. Horizontal transfer platform; 420. Gripping assembly; 421. Adsorption element; 422. Fixing plate; 423. Lifting mechanism; 430. Adjusting valve;

[0038] 500. Silicon wafers. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. The apparatus of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0040] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0041] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0042] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0043] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0044] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0045] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0046] like Figures 1 to 5As shown, this utility model embodiment provides a silicon wafer straightening and feeding device, including a conveying platform 100, a detection device 200, a straightening mechanism 300, and a gripping device 400; a carrier carrying multiple silicon wafers 500 is disposed on the conveying platform 100, and the conveying platform 100 can drive the carrier to move along a first horizontal direction; the detection device 200 is disposed above the conveying platform 100 and faces the conveying platform 100 to detect whether the silicon wafers 500 on the carrier are offset; the straightening mechanism 300 is disposed on one side of the conveying platform 100, and the straightening mechanism 300 is provided with a straightening position 310 and positioning members 320 disposed around the straightening position 310; the gripping device 400 is disposed above the conveying platform 100, and the gripping device 400 can grip the silicon wafers 500 and transfer the silicon wafers 500 in the carrier to the straightening position 310 or move the silicon wafers 500 in the straightening position 310 to the carrier.

[0047] That is, the silicon wafer straightening and feeding equipment provided in this embodiment of the present invention first detects the offset silicon wafer 500 on the carrier through the detection device 200, then the gripping device 400 grips the offset silicon wafer 500 and moves it to the straightening mechanism 300 in the straightening direction, and then the gripping device 400 transports the straightened silicon wafer 500 back to the carrier. This solves the technical problem in the prior art that uneven ground or shaking of the docking platform during docking, wear and tear of the silicon wafer 500 conveyor belt, synchronous wheel and motor due to long-term use can cause the silicon wafer 500 to shift position, which in turn causes the silicon wafer 500 to fall into the chamber after entering the main machine, resulting in wasted production capacity and increased risk of inefficient wafer production. This equipment enables the normal use of abnormally offset silicon wafers 500, increases production line output and reduces operating costs.

[0048] Specifically, in the silicon wafer straightening and feeding equipment provided in this embodiment, the conveying platform 100, detection device 200, straightening mechanism 300, and gripping device 400 are all mounted on a frame constructed of metal rods. The conveying platform 100 is configured as a horizontally oriented conveyor belt, and the carrier is mounted on the conveyor belt for horizontal transport. The silicon wafers 500 are laid out in a matrix on the carrier and placed in fixed slots on the carrier, thus moving together with the carrier. The detection device 200 is fixed to the frame by bolts and is positioned above the conveying platform 100, facing downwards, to vertically detect whether the silicon wafers 500 on the carrier have shifted. Multiple straightening mechanisms 300 are arranged along a first horizontal direction on one side of the conveying platform 100, which is the direction in which the conveying platform 100 transports the carrier. The correction mechanism 300 is a horizontally arranged flat plate structure with a rectangular correction position 310 at its center. Positioning elements 320 are arranged around the correction position 310 to limit and correct the silicon wafer 500, adjusting its position within the correction mechanism 300. The gripping device 400 has an approximate gantry structure, straddling the conveyor platform 100 along the second direction. A robotic arm, suction cup, or other gripping components can be installed on the gripping device 400 to grip the silicon wafer 500 and transfer it from the carrier to the correction position 310 or move it from the correction position 310 to the carrier, thereby removing the misaligned silicon wafer 500, adjusting its position, and then transporting it back to the carrier.

[0049] Furthermore, the gripping device 400 includes a horizontal transfer platform 410 and a gripping component 420; the horizontal transfer platform 410 is disposed above the conveying platform 100, and the gripping component 420 is movably disposed on the horizontal transfer platform 410 along a second horizontal direction perpendicular to the first horizontal direction, and the bottom of the gripping component 420 is provided with an adsorption element 421 for adsorbing the silicon wafer 500.

[0050] Specifically, the horizontal transfer platform 410 includes a gantry-shaped horizontal transfer bracket, a transfer track bolted to the horizontal transfer bracket along a second horizontal direction, a horizontal slider slidably disposed on the moving track, and a transverse cylinder for driving the horizontal slider. The gripping assembly 420 is bolted to the bottom of the horizontal slider, and the adsorption member 421 is driven by the cylinder to adsorb the silicon wafer 500. Thus, the horizontal transfer mechanism can move the adsorption member 421 above the offset silicon wafer 500, adsorb the silicon wafer 500 using the adsorption member 421, and then the horizontal transfer platform 410 moves the gripping assembly 420 above the correction mechanism 300 located on one side of the conveying platform 100, delivering the silicon wafer 500 to the correction position 310.

[0051] Furthermore, the gripping component 420 also includes a fixing plate 422 disposed along a first horizontal direction; a plurality of adsorption members 421 are arranged at intervals along the first horizontal direction at the bottom of the fixing plate 422.

[0052] Specifically, the fixing plate 422 is a long rectangular metal plate arranged along the first horizontal direction, and the adsorption element 421 is specifically a suction cup, which is fixed to the bottom of the fixing plate 422 by bolts and connected to the air pump through an air pipe. In this embodiment, multiple adsorption elements 421 are provided, which are arranged at intervals along the first horizontal direction. The interval between the adsorption elements 421 is consistent with the interval between the silicon wafers 500 on the carrier, so that multiple silicon wafers 500 can be adsorbed at the same time, thereby improving the efficiency of silicon wafer 500 correction.

[0053] Preferably, the gripping component 420 further includes a lifting mechanism 423, which is slidably disposed on the horizontal transfer platform 410 along the second horizontal direction. The lifting mechanism 423 has a lifting part that moves in the vertical direction, and a fixing plate 422 is disposed on the lifting part.

[0054] Specifically, the lifting mechanism 423 includes a vertically arranged lifting rail, a lifting slider slidably arranged on the lifting rail, and a lifting cylinder for driving the lifting slider to move. The lifting slider is the lifting part. The lifting rail is fixed to the bottom of the horizontal slider by bolts, and the fixing plate 422 is fixed to the lifting slider by bolts. Thus, the lifting mechanism 423 can drive the fixing plate 422 and the adsorption member 421 to rise and fall, thereby adjusting the distance between the adsorption member 421 and the silicon wafer 500, so that the adsorption member 421 can better adsorb the silicon wafer 500, and adjust the position of the adsorption member 421 to provide space for the horizontal movement of the adsorption member 421.

[0055] Furthermore, the gripping device 400 also includes a pneumatic assembly; the pneumatic assembly includes a lateral cylinder that drives the lifting mechanism 423 to slide in the second horizontal direction, a lifting cylinder that drives the lifting part to move in the vertical direction, an air pump, and a regulating valve 430; the lateral cylinder, the lifting cylinder, and the adsorption component 421 are respectively connected to one end of the regulating valve 430, and the other end of the regulating valve 430 is connected to the air pump.

[0056] Specifically, the transverse cylinder, the lifting cylinder, and the adsorption element 421 are all connected to one end of the regulating valve 430 via air pipes, while the other end of the regulating valve 430 is connected to the air pump via a pipeline. In this embodiment, multiple regulating valves 430 can be configured, each connected to one of the transverse cylinder, the lifting cylinder, and the adsorption element 421. In other embodiments of this application, the regulating valve 430 can be configured as a four-way solenoid valve, with its inlet connected to the air pump and its three outlets connected to the transverse cylinder, the lifting cylinder, and the adsorption element 421, respectively. The regulating valve 430 is fixed to the frame or the horizontal transfer bracket with bolts. Thus, the operation of the transverse cylinder and the lifting cylinder can be adjusted and controlled by the regulating valve 430, and the suction force of the adsorption element 421 can be controlled by the regulating valve 430.

[0057] Furthermore, the detection device 200 includes a detection bracket and a detection camera 220; the detection bracket is fixed to the conveying platform 100, and a suspension beam 210 is provided on the detection bracket, which is located above the conveying platform 100; the detection camera 220 is fixed to the suspension beam 210 and is positioned facing the conveying platform 100.

[0058] Specifically, the inspection bracket is bolted to the frame and fixed above the conveyor platform 100 in a gantry-like shape. The suspension beam 210 is arranged above the conveyor platform 100 in a second horizontal direction. The inspection camera 220 is fixed to the suspension beam 210 by the bracket, and the inspection camera 220 is set downwards towards the conveyor platform 100. Thus, the inspection camera 220 can take pictures of the silicon wafer 500 on the conveyor platform 100, and then the image recognition technology can be used to determine whether the silicon wafer 500 has shifted.

[0059] Preferably, multiple detection cameras 220 are evenly spaced on the suspension beam 210.

[0060] Specifically, in this embodiment, four detection cameras 220 are evenly spaced on the suspension beam 210, and the detection range of the detection cameras 220 is arranged in a triangular shape. The four detection cameras 220 are arranged along the second horizontal direction, which can simultaneously complete the detection of the silicon wafers 500 in the upper row of the carrier.

[0061] Furthermore, a plurality of correction mechanisms 300 are uniformly arranged along the first horizontal direction; each correction mechanism 300 has two correction plates 330 arranged parallel to each other along the first horizontal direction, and each correction plate 330 has two positioning members 320 arranged at intervals along the first horizontal direction, and the four positioning members 320 are arranged in a rectangle to enclose a rectangular correction position 310.

[0062] Specifically, the correction plate 330 is configured as a rectangular strip, and the correction mechanism 300 has two correction plates 330 arranged parallel to each other along a first horizontal direction. The correction plates 330 are fixed to the frame by bolts. Each correction plate 330 has two positioning elements 320 arranged at intervals along the first horizontal direction, and the four positioning elements 320 are arranged in a rectangular shape. In this embodiment, the rectangular positioning elements 320 are configured as block structures with an approximately trapezoidal cross-section, and the inclined surface of the positioning elements 320 faces the correction position 310 located at the center, so as to facilitate the silicon wafer 500 sliding into the correction position 310. In addition, this embodiment also provides four rectangular cuboid positioning blocks arranged in a rectangular shape, distributed in pairs on both sides of the correction position 310, thereby ensuring that the silicon wafer 500 can automatically fall into the correction position 310 after being placed on the correction mechanism 300.

[0063] Preferably, the correction mechanism 300 is provided with side positioning rollers 340, and a plurality of side positioning rollers 340 are positioned relative to both sides of the correction position 310 along the first horizontal direction, and the side positioning rollers 340 are rotatably disposed on the correction plate 330 around the second horizontal direction.

[0064] Specifically, based on the above, the positioning member 320 can position the silicon wafer 500 in the first horizontal direction. In this embodiment, the correction mechanism 300 is provided with side positioning rollers 340, with several side positioning rollers 340 positioned relative to both sides of the correction position 310 along the first horizontal direction. The side positioning rollers 340 are mounted on the correction plate 330 via bases, and the side positioning rollers 340 are rotatably mounted on the bases. Thus, the position of the silicon wafer 500 can be corrected in the second horizontal direction using the side positioning rollers 340.

[0065] Preferably, the straightening plate 330 is further provided with a plurality of support balls 350, which are disposed within the straightening position 310 and are rotatably disposed on the straightening plate 330.

[0066] Specifically, a number of hemispherical grooves are provided on the correction plate 330 in the correction position 310, and the support ball 350 is rotatably disposed in the hemispherical groove, so that the silicon wafer 500 can overlap on the support ball 350, and thus the silicon wafer 500 can move smoothly on the support ball 350. When the silicon wafer 500 is in an offset state and falls on the correction mechanism 300, it will overlap the support ball 350, the side positioning roller 340 and the positioning member 320 at an angle, and slide in the correction position 310 by gravity to correct the position. Then, the gripping device 400 will grab and put it back onto the carrier to complete the correction and loading of the silicon wafer 500.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A silicon wafer straightening and feeding device, characterized in that, include: A conveying platform (100) is provided on which a carrier carrying multiple silicon wafers (500) is disposed, and the conveying platform (100) is capable of driving the carrier to move along a first horizontal direction; A detection device (200) is disposed above the conveying platform (100) and facing the conveying platform (100) to detect whether the silicon wafer (500) on the carrier is offset. A correction mechanism (300) is provided on one side of the conveying platform (100), and the correction mechanism (300) is provided with a correction position (310) and a positioning member (320) provided on the periphery of the correction position (310). A gripping device (400) is disposed above the conveying platform (100). The gripping device (400) is capable of gripping the silicon wafer (500) and transferring the silicon wafer (500) in the carrier to the correction position (310) or moving the silicon wafer (500) in the correction position (310) to the carrier.

2. The silicon wafer correction feeding equipment according to claim 1, wherein, The gripping device (400) includes a horizontal transfer platform (410) and a gripping assembly (420); The horizontal transfer platform (410) is disposed above the conveying platform (100), and the gripping component (420) is movably disposed on the horizontal transfer platform (410) along a second horizontal direction perpendicular to the first horizontal direction. The bottom of the gripping component (420) is provided with an adsorption element (421) for adsorbing the silicon wafer (500).

3. The silicon wafer straightening and feeding equipment according to claim 2, characterized in that, The gripping component (420) further includes a fixing plate (422) disposed along the first horizontal direction; A plurality of the adsorption elements (421) are arranged at intervals along the first horizontal direction at the bottom of the fixing plate (422).

4. The silicon wafer straightening and feeding equipment according to claim 3, characterized in that, The gripping assembly (420) further includes a lifting mechanism (423), which is slidably disposed on the horizontal transfer platform (410) along the second horizontal direction. The lifting mechanism (423) has a lifting part that moves in the vertical direction, and the fixing plate (422) is disposed on the lifting part.

5. The silicon wafer straightening and feeding equipment according to claim 4, characterized in that, The gripping device (400) also includes pneumatic components; The pneumatic assembly includes a transverse cylinder that drives the lifting mechanism (423) to slide in the second horizontal direction, a lifting cylinder that drives the lifting part to move in the vertical direction, an air pump, and a regulating valve (430). The transverse cylinder, the lifting cylinder, and the adsorption element (421) are each connected to one end of the regulating valve (430), and the other end of the regulating valve (430) is connected to the air pump.

6. The silicon wafer straightening and feeding equipment according to any one of claims 2-5, characterized in that, The detection device (200) includes a detection bracket and a detection camera (220); The detection bracket is fixed to the conveying platform (100), and a suspension beam (210) is provided on the detection bracket. The suspension beam (210) is located above the conveying platform (100), and the detection camera (220) is fixed to the suspension beam (210) and is positioned facing the conveying platform (100).

7. The silicon wafer straightening and feeding equipment according to claim 6, characterized in that, Multiple detection cameras (220) are evenly spaced on the suspension beam (210).

8. The silicon wafer straightening and feeding equipment according to any one of claims 2-5, characterized in that, The plurality of the corrective mechanisms (300) are evenly arranged along the first horizontal direction; The correction mechanism (300) has two correction plates (330) arranged parallel to each other along a first horizontal direction. Each correction plate (330) has two positioning members (320) arranged at intervals along the first horizontal direction. The four positioning members (320) are arranged in a rectangle to enclose a rectangular correction position (310).

9. The silicon wafer straightening and feeding equipment according to claim 8, characterized in that, The correction mechanism (300) is provided with side positioning rollers (340), and a plurality of the side positioning rollers (340) are positioned relative to the two sides of the correction position (310) along the first horizontal direction. The side positioning rollers (340) are rotatably disposed on the correction plate (330) around the second horizontal direction.

10. The silicon wafer straightening and feeding equipment according to claim 8, characterized in that, The correction plate (330) is also provided with a plurality of support balls (350), which are disposed within the correction position (310) and are rotatably disposed on the correction plate (330).

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