An automatic die-setting machine with adjustable spacing for semiconductor component packages.

Abstract

This utility model discloses an automatic wafer stacking machine with adjustable spacing for semiconductor component packaging, belonging to the field of semiconductor packaging technology. It includes: a housing; a fixed support plate is horizontally fixed within the inner cavity of the housing; multiple sets of support plates for supporting semiconductor components are movably arranged above the fixed support plate; multiple sets of connecting plates connected to the support plates are arranged on one side of the support plates above the fixed support plate; and equidistant telescopic adjustment components are provided on the connecting plates. This utility model moves one set of connecting plates using a pushing component, and then multiple sets of connecting plates, with the cooperation of the equidistant telescopic adjustment components, telescopically extend and retract equidistantly from the center position to both sides, allowing multiple sets of support plates to telescopically adjust simultaneously. This achieves rapid control of the distance between the support plates, and precise control of the distance between the support plates can be achieved simply by precisely controlling the displacement of the pushing component, making it both fast and precise.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically to an automatic chip stacking machine with adjustable spacing for semiconductor component packaging. Background Technology

[0002] Automatic die-layout machines are core automated equipment in the semiconductor packaging process that automatically and accurately arrange semiconductor components (such as chips and dies) to be packaged onto carriers (such as lead frames and substrates) according to preset spacing and orientation.

[0003] When using a wafer setter to set up semiconductor components, the orientation and spacing of the semiconductor components need to be arranged according to their size. Since different sizes of semiconductor components require different spaces, the carrier needs to be changed when setting up semiconductor components of different sizes to adjust the spacing after wafer setting. However, changing the carrier takes time, and the installed carrier also needs to be debugged. This results in a lot of time being spent on debugging when setting up semiconductor components of different sizes, which reduces the operating efficiency of the equipment. Utility Model Content

[0004] The purpose of this invention is to provide an automatic wafer stacking machine with adjustable spacing for semiconductor component packaging. By using an equidistant telescopic adjustment component to perform equidistant telescopic adjustment on multiple sets of connecting plates, it can easily accommodate carrier plates of different sizes and achieve rapid adjustment of the spacing between multiple sets of carrier plates, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an automatic die-laying machine with adjustable spacing for semiconductor device packaging, comprising: Equipment casing; The inner cavity of the device housing is horizontally fixed with a fixed support plate. Above the fixed support plate, multiple sets of support plates for supporting semiconductor components are movably arranged. Above the fixed support plate, on one side of the support plate, multiple sets of connecting plates connected to the support plate are arranged. The connecting plates are equipped with equidistant telescopic adjustment components. A horizontal pushing component for moving the connecting plate is provided below the fixed support plate. The inner cavity of the device housing is also provided with a conveyor line for transporting semiconductor components and a mechanical gripper for transferring semiconductor components.

[0006] Preferably, the equidistant telescopic adjustment assembly includes a first slide rail fixed to the top of the fixed support plate. Multiple sets of first slide blocks and a set of connecting seats are slidably arranged on the first slide rail. The connecting seats are fixedly connected to the bottom of the connecting plate in the middle position. Multiple sets of first slide blocks are evenly distributed on both sides of the connecting seats and are fixedly connected to the bottom of other connecting plates respectively. Two sets of connecting rods are hinged to the top of the connecting plate, and the connecting rods on the top of adjacent connecting plates are hinged to each other.

[0007] Preferably, the pushing assembly includes a mounting base fixed to the bottom of a set of connecting plates. The bottom of the mounting base extends through to the bottom of a fixed support plate and is fixed with a connecting frame. A hydraulic cylinder is installed at the bottom of the fixed support plate, and the piston rod of the hydraulic cylinder is fixedly connected to the center of one side of the connecting frame.

[0008] Preferably, an extension seat is installed on the top side of the connecting plate near the support plate, a mounting groove is provided at one end of the support plate, the end of the extension seat away from the connecting plate extends into the mounting groove, and a mounting bolt is provided at the bottom of the support plate, one end of the mounting bolt passing through the mounting groove and threadedly connected to the extension plate.

[0009] Preferably, a second slide rail is also installed on the top of the fixed support plate, and multiple sets of second slide blocks are slidably arranged on the top of the second slide rail. The second slide blocks are fixed to the bottom of the support plate, and the first slide rail and the second slide rail are kept parallel.

[0010] Preferably, the connecting frame has a through hole, and a sliding rod is slidably disposed in the through hole, the sliding rod being fixed to the bottom of the fixed support plate.

[0011] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model moves a set of connecting plates by a flat-push component, and then multiple sets of connecting plates, with the cooperation of the equidistant telescopic adjustment component, telescopically extend and retract at equal intervals from the middle position to both sides, so that multiple sets of bearing plates telescopically extend and retract at equal intervals, thereby achieving rapid control of the distance between the bearing plates. At the same time, only the displacement of the flat-push component needs to be precisely controlled to precisely control the distance between the bearing plates, which is both fast and accurate.

[0012] 2. The present invention, through the setting of the first slide rail and the second slide rail, facilitates the limiting of the connecting plate and the bearing plate respectively, ensuring smooth movement when adjusting the distance and avoiding shaking that could lead to directional deviation. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a bottom-view three-dimensional structural diagram of the fixed support plate of this utility model; Figure 3 This is a partial three-dimensional structural diagram of the present invention; Figure 4 This is a three-dimensional structural diagram of the connecting plate and the supporting plate of this utility model; Figure 5 This is a three-dimensional structural diagram showing the disassembled connection plate and the bearing plate of this utility model.

[0014] The following are the labeling elements in the diagram: 1. Equipment casing; 2. Fixed support plate; 3. Bearing plate; 4. Connecting plate; 5. Equidistant telescopic adjustment assembly; 51. First slide rail; 52. First slide block; 53. Connecting seat; 54. Connecting rod; 6. Flat push assembly; 61. Mounting seat; 62. Connecting frame; 63. Hydraulic cylinder; 7. Conveyor line; 8. Mechanical claw; 9. Extension seat; 10. Mounting groove; 11. Mounting bolt; 12. Second slide rail; 13. Second slide block; 14. Slide rod. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] This utility model provides, for example Figures 1-5 An automatic die-layout machine with adjustable spacing for semiconductor device packages, as shown, includes: Equipment casing 1; A fixed support plate 2 is horizontally fixed in the inner cavity of the equipment housing 1. Multiple sets of support plates 3 for supporting semiconductor components are movably arranged above the fixed support plate 2. Multiple sets of connecting plates 4 connected to the support plates 3 are arranged on one side of the support plates 3 above the fixed support plate 2. Equidistant telescopic adjustment components 5 are arranged on the connecting plates 4. A horizontal pushing component 6 for moving the connecting plate 4 is provided below the fixed support plate 2; The inner cavity of the equipment housing 1 is also provided with a conveyor line 7 for conveying semiconductor components and a mechanical gripper 8 for transferring semiconductor components; The horizontal push component 6 moves a set of connecting plates 4, and then multiple sets of connecting plates 4, with the cooperation of the equidistant telescopic adjustment component 5, telescopically extend and retract at equal intervals from the middle position to both sides, so that multiple sets of bearing plates 3 telescopically extend and retract at equal intervals together, thereby quickly adjusting the distance between the bearing plates 3. At the same time, only the displacement of the horizontal push component 6 needs to be precisely controlled to precisely adjust the distance between the bearing plates 3, which is both fast and precise.

[0017] Among them, such as Figure 3-4 As shown: The equidistant telescopic adjustment assembly 5 includes a first slide rail 51 fixed to the top of the fixed support plate 2. Multiple sets of first slide blocks 52 are slidably arranged on the first slide rail 51 and a set of connecting seats 53 are fixedly arranged on it. The connecting seats 53 are fixedly connected to the bottom of the connecting plate 4 in the middle position. The multiple sets of first slide blocks 52 are evenly distributed on both sides of the connecting seats 53 and are fixedly connected to the bottom of other connecting plates 4 respectively. Two sets of connecting rods 54 are hinged to the top of the connecting plate 4. The connecting rods 54 on the top of adjacent connecting plates 4 are hinged to each other. Through the hinge of the connecting rods 54, a parallelogram structure is formed. When the connecting rods 54 are rotated, the distance between the two sets of connecting plates 4 can be adjusted to achieve equidistant synchronous adjustment.

[0018] Furthermore, such as Figure 2 As shown: The horizontal pushing assembly 6 includes a mounting base 61 fixed to the bottom of a set of connecting plates 4. The bottom of the mounting base 61 extends through to the bottom of the fixed support plate 2 and a connecting frame 62 is fixed thereon. A hydraulic cylinder 63 is installed at the bottom of the fixed support plate 2. The piston rod of the hydraulic cylinder 63 is fixedly connected to the center of one side of the connecting frame 62. The connecting frame 62 is pushed horizontally by the hydraulic cylinder 63. Then the connecting frame 62 drives the two sets of mounting bases 61 to move the connecting plates 4 on both sides synchronously, so as to realize the synchronous movement and adjustment of the two sets of connecting plates 4 on both sides. The hydraulic cylinder 63 is used in conjunction with the grating ruler.

[0019] Preferred, such as Figure 5 As shown: An extension seat 9 is installed on the top side of the connecting plate 4 near the support plate 3. One end of the support plate 3 has a mounting groove 10. The end of the extension seat 9 away from the connecting plate 4 extends into the mounting groove 10. A mounting bolt 11 is provided at the bottom of the support plate 3. One end of the mounting bolt 11 passes through the mounting groove 10 and is threaded to the extension plate. The extension seat 9 is inserted into the mounting groove 10, and then the mounting bolt 11 is used for stable connection. The extension seat 9 connects the connecting plate 4 and the support plate 3 to achieve linkage.

[0020] Adjusting the extension angle of the extension plate can also reduce the distance of the bearing plate 3 inward.

[0021] It is worth noting that, such as Figure 3-4 As shown: The top of the fixed support plate 2 is also equipped with a second slide rail 12. Multiple sets of second slide blocks 13 are slidably arranged on the top of the second slide rail 12. The second slide blocks 13 are fixed to the bottom of the bearing plate 3. The first slide rail 51 is parallel to the second slide rail 12. The arrangement of the first slide rail 51 and the second slide rail 12 makes it convenient to limit the connection plate 4 and the bearing plate 3 respectively, ensuring smooth movement when adjusting the distance and avoiding shaking that could cause directional deviation.

[0022] In a further preferred embodiment, such as Figure 2 As shown: The connecting frame 62 has a through hole, and a slide rod 14 is slidably installed in the through hole. The slide rod 14 is fixed to the bottom of the fixed support plate 2. The slide rod 14 is used to limit the connecting frame 62 and prevent the two ends from not moving synchronously when the connecting frame 62 moves.

[0023] In practical use, when it is necessary to adjust the distance between the bearing plates 3 at equal intervals, the hydraulic cylinder 63 is activated. The hydraulic cylinder 63 drives the connecting frame 62 to move to one side. Then, the connecting frame 62 drives a set of connecting plates 4 to move through the mounting base 61. Subsequently, the connecting plates 4 on both sides extend and retract along the connecting plate 4 in the middle position under the action of the connecting rod 54, adjusting the distance between multiple sets of connecting plates 4 at equal intervals. Then, the connecting plates 4 drive the bearing plates 3 to move synchronously through the extension base 9, so that multiple sets of bearing plates 3 on one side can be synchronously extended and retracted at equal intervals. The bearing plates 3 on both sides move synchronously at equal intervals under the synchronous action of the connecting frame 62, quickly realizing the adjustment of the distance between the bearing plates 3. The moving distance of the connecting frame 62 is accurately determined by the grating ruler.

[0024] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic die-laying machine with adjustable spacing for semiconductor device packages, characterized in that, include: Equipment casing (1); The inner cavity of the device housing (1) is horizontally fixed with a fixed support plate (2). Above the fixed support plate (2), multiple sets of support plates (3) for supporting semiconductor components are movably arranged. Above the fixed support plate (2), on one side of the support plate (3), multiple sets of connecting plates (4) connected to the support plate (3) are arranged. The connecting plate (4) is provided with an equidistant telescopic adjustment component (5). A horizontal pushing component (6) for moving the connecting plate (4) is provided below the fixed support plate (2). The inner cavity of the device housing (1) is also provided with a conveyor line (7) for conveying semiconductor components and a mechanical gripper (8) for transferring semiconductor components.

2. The automatic die-laying machine with adjustable spacing for semiconductor component packaging according to claim 1, characterized in that: The equidistant telescopic adjustment component (5) includes a first slide rail (51) fixed on the top of the fixed support plate (2). Multiple sets of first slide blocks (52) and a set of connecting seats (53) are slidably arranged on the first slide rail (51). The connecting seats (53) are fixedly connected to the bottom of the connecting plate (4) in the middle position. Multiple sets of first slide blocks (52) are evenly distributed on both sides of the connecting seat (53) and fixedly connected to the bottom of other connecting plates (4). Two sets of connecting rods (54) are hinged to the top of the connecting plate (4). The connecting rods (54) on the top of adjacent connecting plates (4) are hinged to each other.

3. The automatic die-laying machine with adjustable spacing for semiconductor component packaging according to claim 1, characterized in that: The push assembly (6) includes a mounting base (61) fixed to the bottom of a set of connecting plates (4). The bottom of the mounting base (61) extends through to the bottom of the fixed support plate (2) and is fixed with a connecting frame (62). A hydraulic cylinder (63) is installed at the bottom of the fixed support plate (2). The piston rod of the hydraulic cylinder (63) is fixedly connected to the center of one side of the connecting frame (62).

4. An automatic die-laying machine with adjustable spacing for semiconductor component packaging according to claim 1, characterized in that: An extension seat (9) is installed on the top side of the connecting plate (4) near the support plate (3). An installation groove (10) is provided at one end of the support plate (3). The end of the extension seat (9) away from the connecting plate (4) extends into the installation groove (10). An installation bolt (11) is provided at the bottom of the support plate (3). One end of the installation bolt (11) passes through the installation groove (10) and is threadedly connected to the extension plate.

5. An automatic die-laying machine with adjustable spacing for semiconductor component packaging according to claim 2, characterized in that: The top of the fixed support plate (2) is also equipped with a second slide rail (12), and multiple sets of second slide blocks (13) are slidably arranged on the top of the second slide rail (12). The second slide blocks (13) are fixed to the bottom of the bearing plate (3), and the first slide rail (51) and the second slide rail (12) remain parallel.

6. An automatic die-laying machine with adjustable spacing for semiconductor component packaging according to claim 3, characterized in that: The connecting frame (62) has a through hole, and a slide rod (14) is slidably installed in the through hole. The slide rod (14) is fixed to the bottom of the fixed support plate (2).

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