A feeding device and silicon wafer processing equipment
By designing the storage and receiving spaces of the feeding device, the problems of processing interruption and overflow caused by untimely silicon wafer feeding were solved, and the continuity of silicon wafer feeding and stable operation of the equipment were achieved.
Patent Information
- Application Number
- CN202522498617.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-25
- Publication Date
- 2026-11-06
- Estimated Expiration
- 2035-11-25
AI Technical Summary
In the silicon wafer processing process, existing technologies suffer from problems such as untimely material feeding leading to processing interruptions and silicon wafer accumulation or overflow, affecting equipment continuity and safety.
Design a feeding device including a feeding module, a feeding auxiliary module, and a feeding transfer module. The feeding auxiliary module has a storage space and a receiving space for storing and receiving silicon wafers. The feeding transfer module is used to transfer spare silicon wafers when feeding is not timely. The receiving space is used to receive overflowing silicon wafers, ensuring the continuity of feeding and preventing silicon wafer overflow.
This ensures continuous silicon wafer feeding, prevents wafer overflow, and improves the operational stability and efficiency of the equipment.
Smart Images
Figure CN224948008U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of silicon wafer processing technology, specifically to a feeding device and silicon wafer processing equipment. Background Technology
[0002] In silicon wafer processing, a feeding device typically feeds the silicon wafers to a preset feeding position. The processing device then processes the wafers. After processing, a unloading device unloads the wafers to a preset unloading position. To improve efficiency, the feeding device continuously feeds multiple wafers sequentially, ensuring continuous processing. However, in practice, untimely feeding can occur, causing the processing device to finish processing one wafer before the feeding device has finished feeding the next, thus interrupting the processing.
[0003] In existing technologies, a certain amount of spare silicon wafers are usually stored in advance. When there is a delay in feeding, the spare silicon wafers can be used to ensure that the processing continuity is not interrupted. However, in cases where processing is delayed, such as when the processing device has not finished processing the previous silicon wafer but the feeding device has already finished feeding the next silicon wafer, the silicon wafers will accumulate and overflow at the preset feeding position, or even cause the equipment to stop due to overload. Utility Model Content
[0004] This application mainly provides a feeding device and silicon wafer processing equipment, which can ensure the continuity of feeding and avoid the overflow of silicon wafers to be conveyed.
[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: providing a feeding device, the feeding device comprising: a feeding module for receiving silicon wafers to be conveyed and performing feeding operations on the silicon wafers to be conveyed; a feeding auxiliary module forming a storage space and a receiving space, the storage space for storing spare silicon wafers for feeding, and the receiving space for receiving silicon wafers overflowing from the feeding process; and a feeding transfer module for transferring the spare silicon wafers to the feeding module so that the spare silicon wafers are used as the silicon wafers to be conveyed, or the feeding transfer module for transferring the silicon wafers to be conveyed to the receiving space so that the silicon wafers to be conveyed are used as the silicon wafers overflowing from the feeding process.
[0006] In one specific embodiment, the feeding device further includes a feeding correction module, which includes a correction drive mechanism and a correction component. The correction drive mechanism is connected to the correction component to drive the correction component to correct the posture of the silicon wafer to be fed.
[0007] In one specific embodiment, the feeding and straightening module further includes a transmission assembly, which includes a driving wheel, a driven wheel, and a transmission belt. The driving wheel is connected to the straightening drive mechanism. The transmission belt is wound around the driving wheel and the driven wheel to form a first transmission part and a second transmission part that are arranged oppositely and move in opposite directions. There are two straightening members. One of the two straightening members is connected to the first transmission part, and the other of the two straightening members is connected to the second transmission part.
[0008] In one specific embodiment, the feeding module is used to feed the silicon wafer to be transported in a first direction, and the receiving space and the storage space are arranged sequentially along a second direction, with the first direction and the second direction being intersected.
[0009] In one specific embodiment, there are multiple feeding auxiliary modules, and the multiple feeding auxiliary modules are arranged sequentially along the first direction.
[0010] In one specific embodiment, the feeding and transfer module includes a transfer drive mechanism and a transfer unit. The transfer unit is used to adsorb the feed spare silicon wafer or the silicon wafer to be transported. The transfer drive mechanism is connected to the transfer unit to drive the transfer unit to reciprocate in the second direction.
[0011] In one specific embodiment, the feeding module includes multiple sub-modules, which are arranged sequentially along the first direction.
[0012] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a silicon wafer processing equipment, the silicon wafer processing equipment including a silicon wafer processing device and the feeding device; the feeding module is used to feed the unprocessed silicon wafer to be transported to a preset loading position, so that the silicon wafer processing device can process the silicon wafer to be transported; and / or the feeding module is used to feed the processed silicon wafer to be transported to a preset unloading position.
[0013] In one specific embodiment, the feeding device includes a feeding unit and a discharging unit, wherein the feeding unit and the discharging unit respectively include the feeding module, the feeding auxiliary module and the feeding transfer module.
[0014] In one specific embodiment, the loading unit and the unloading unit are respectively disposed on opposite sides of the silicon wafer processing device.
[0015] The beneficial effects of this application are as follows: Unlike existing technologies, the feeding device provided in this application includes: a feeding module for receiving and feeding silicon wafers; a feeding auxiliary module having a storage space and a receiving space, wherein the storage space stores spare silicon wafers and the receiving space receives overflowing silicon wafers; and a feeding transfer module for transferring the spare silicon wafers to the feeding module so that they serve as the silicon wafers to be fed, or for transferring the silicon wafers to the receiving space so that they serve as overflowing silicon wafers. With this configuration, in cases of untimely feeding, the spare silicon wafers stored in the storage space can be used for feeding; and in cases of overflowing, the overflowing silicon wafers can be received through the receiving space. This ensures continuous feeding and prevents overflowing silicon wafers. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0017] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of the silicon wafer processing equipment provided in this application; Figure 2 yes Figure 1 A schematic diagram of the three-dimensional structure of a silicon wafer processing equipment after the casing has been removed; Figure 3 yes Figure 2 A three-dimensional structural diagram of the feeding unit; Figure 4 yes Figure 3 A three-dimensional structural diagram of the feeding auxiliary module; Figure 5 yes Figure 4 A three-dimensional structural diagram of the central storage silo and its base plate; Figure 6 yes Figure 4 A three-dimensional structural diagram of the central storage drive unit; Figure 7 yes Figure 5 A schematic diagram of the front structure of the receiving component; Figure 8 yes Figure 3 A three-dimensional structural diagram of the central feeding module; Figure 9 yes Figure 3 A three-dimensional structural diagram of the central feeding and transfer module; Figure 10 yes Figure 9 A three-dimensional structural diagram of the feeding and straightening module. Detailed Implementation
[0018] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.
[0019] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indication will change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. A process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.
[0020] In this document, the term "implementation" means that a specific feature, structure, or characteristic described in connection with an implementation may be included in at least one implementation of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same implementation, nor is it a separate or alternative implementation mutually exclusive with other implementations. It will be explicitly and implicitly understood by those skilled in the art that the implementations described herein can be combined with other implementations.
[0021] Please refer to the following: Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of the silicon wafer processing equipment 100 provided in this application. Figure 2 yes Figure 1 A three-dimensional structural diagram of the silicon wafer processing equipment 100 after removing the casing. Figure 3yes Figure 2 A three-dimensional structural diagram of the feeding unit 10a. The silicon wafer processing equipment 100 in this embodiment includes a feeding device 10 and a silicon wafer processing device 20.
[0022] The feeding device 10 includes a feeding module 11, a feeding auxiliary module 12, and a feeding transfer module 13.
[0023] The feeding module 11 is used to receive the silicon wafer 110 to be transported and to perform feeding operations on the silicon wafer 110 to be transported. Specifically, the feeding module 11 is used to feed the unprocessed silicon wafer 110 to the preset loading position so that the silicon wafer processing device 20 can process the silicon wafer 110 to be transported; and / or the feeding module 11 is used to feed the processed silicon wafer 110 to the preset unloading position, that is, the feeding module 11 is used to perform loading operations on the unprocessed silicon wafer 110 to be transported and / or to perform unloading operations on the processed silicon wafer 110 to be transported. In this embodiment, the feeding module 11 can perform both loading operations on the unprocessed silicon wafer 110 to be transported and unloading operations on the processed silicon wafer 110 to be transported.
[0024] Specifically, the feeding device 10 in this embodiment includes a loading unit 10a and a unloading unit 10b. The loading unit 10a and the unloading unit 10b respectively include the aforementioned feeding module 11, feeding auxiliary module 12, and feeding transfer module 13. That is, in this embodiment, the loading unit 10a and the unloading unit 10b have the same structure, but the difference lies in their positions. For example, the loading unit 10a and the unloading unit 10b are respectively arranged on opposite sides of the silicon wafer processing device 20. The loading unit 10a is used to load the unprocessed silicon wafer 110 to be transported, and the unloading unit 10b is used to unload the processed silicon wafer 110 to be transported. The structure of the loading unit 10a is used as an example in the illustration of this embodiment.
[0025] The feeding auxiliary module 12 has a storage space 101 and a receiving space 102. The storage space 101 is used to store spare silicon wafers for feeding, and the receiving space 102 is used to receive overflowing silicon wafers. This allows for the use of spare silicon wafers stored in the storage space 101 for feeding in case of feeding delays, and the receiving space 102 to receive overflowing silicon wafers in case of feeding overflows. This ensures continuous feeding and prevents overflow of the silicon wafers 110 to be fed. For example, when feeding... When the feeding module 11 is used to feed unprocessed silicon wafers 110, it can use spare feeding wafers to ensure the continuity of feeding. It can also receive unprocessed silicon wafers that overflow during feeding through the receiving space 102. Similarly, when the feeding module 11 is used to unload processed silicon wafers 110, it can use spare feeding wafers to ensure the continuity of unloading. It can also receive processed silicon wafers that overflow during unloading through the receiving space 102.
[0026] The feeding and transfer module 13 is used to transfer the spare silicon wafer to the feeding module 11 so that the spare silicon wafer can be used as the silicon wafer to be transported. That is, when the feeding is not timely, the feeding and transfer module 13 transfers the spare silicon wafer to the feeding module 11 so that the feeding module 11 can continuously feed and ensure the continuity of feeding. Alternatively, the feeding and transfer module 13 is used to transfer the silicon wafer to be transported to the receiving space 102 so that the silicon wafer to be transported can be used as the silicon wafer to be overflowed. That is, when the feeding overflow occurs, the feeding and transfer module 13 transfers the overflowed silicon wafer to be transported to the receiving space 102.
[0027] Please refer to the following: Figure 4 , Figure 5 and Figure 6 , Figure 4 yes Figure 3 A three-dimensional structural diagram of the feeding auxiliary module 12. Figure 5 yes Figure 4 A three-dimensional structural diagram of the central storage silo 1221 and the substrate 121. Figure 6 yes Figure 4 A three-dimensional structural diagram of the material storage drive unit 1222 is shown. The feeding auxiliary module 12 includes a base 121, a material storage component 122 and a material receiving component 123. The material storage component 122 is installed on the base 121 and forms the aforementioned material storage space 101. The material receiving component 123 is installed on the base 121 and forms the aforementioned material receiving space 102.
[0028] The storage component 122 includes a storage bin 1221 and a storage drive unit 1222. The storage bin 1221 forms a storage space 101. The storage drive unit 1222 is used to drive the feed spare silicon wafer to a preset discharge position. In this embodiment, that is, after the feed spare silicon wafer is driven to the preset discharge position, the feed transfer module 13 can transfer the feed spare silicon wafer to the feed module 11.
[0029] Furthermore, the storage drive unit 1222 includes a storage drive mechanism 122a and a pusher 122b. The storage drive mechanism 122a is connected to the pusher 122b to drive the pusher 122b in such a way as... Figure 5 and Figure 6 The Z-axis shown pushes the feed spare silicon wafer to the preset discharge position.
[0030] Optionally, in this embodiment, the storage assembly 122 further includes a carrier 1223, which is used to carry the feed spare silicon wafer and is movably disposed in the storage space 101. The pusher 122b is used to push the carrier 1223 to push the spare silicon wafer to the preset discharge position. That is, when the storage drive mechanism 122a drives the pusher 122b to move in the Z direction, the pusher 122b pushes the carrier 1223, thereby pushing the feed spare silicon wafer carried on the carrier 1223 to the preset discharge position. Since the feed spare silicon wafer is thin and fragile, the pusher 122b will not directly contact the feed spare silicon wafer through this arrangement, thereby avoiding the situation where the pusher 122b generates thrust that damages the feed spare silicon wafer.
[0031] Optionally, the base 121 is provided with a through hole 103 communicating with the storage space 101. The storage bin 1221 and the storage drive mechanism 122a are respectively disposed on opposite sides of the base 121, so that the pusher 122b passes through the through hole 103 to push the feed spare silicon wafer to the preset discharge position. For example, in this embodiment, the storage drive mechanism 122a is disposed on the lower side of the base 121, and the storage bin 1221 is disposed on the upper side of the base 121. This arrangement makes the layout of the entire storage assembly 122 more reasonable.
[0032] Please see Figure 7 , Figure 7 yes Figure 5The front view of the receiving assembly 123 is shown. The receiving assembly 123 includes a receiving component 1231 and an adjusting seat 1232. The adjusting seat 1232 is mounted on the base 121. The receiving component 1231 forms a receiving space 102 and is movably connected to the adjusting seat 1232 to adjust the receiving position and / or receiving angle of the receiving space 102. For example, in this embodiment, the receiving component 1231 is rotatably connected to the adjusting seat 1232 to adjust the receiving angle of the receiving space 102. In practical applications, after the adjustment is completed, bolts or other fasteners are used to fix the two together.
[0033] Further reading Figure 1 and Figure 5 The feeding auxiliary module 12 in this embodiment also includes a cleaning mechanism 124. The cleaning mechanism 124 is used to clean the feeding spare silicon wafer to remove dust, residue and other substances from the feeding spare silicon wafer. The specific cleaning method of the cleaning mechanism 124 is not limited. In this embodiment, blowing air is used to clean the feeding spare silicon wafer as an example.
[0034] The feeding auxiliary module 12 in this embodiment also includes a housing 125. The housing 125 forms an accommodating space (not shown in the figure) and an opening (not shown in the figure) communicating with the accommodating space. The base 121 is movably disposed in the accommodating space so that the storage component 122 and the receiving component 123 can be moved into or out of the accommodating space through the opening, thereby adding the feeding spare silicon wafers in the storage space and / or recovering the feeding overflow silicon wafers in the receiving space. For example, in this embodiment, the base 121 can be pulled by the handle 121a connected to the base 121, so that the storage component 122 and the receiving component 123 can be moved into or out of the accommodating space through the opening.
[0035] Please refer to the following: Figure 3 , Figure 4 and Figure 8 , Figure 8 yes Figure 3 A three-dimensional structural diagram of the feeding module 11 is shown. The feeding module 11 is used to feed the silicon wafer to be transported in the first direction X. The receiving space 101 and the storage space 102 are arranged sequentially along the second direction Y. The first direction X and the second direction Y are intersected. In this embodiment, the first direction X and the second direction Y are perpendicular to each other.
[0036] Optionally, there may be multiple feeding auxiliary modules 12, which are arranged sequentially along the first direction X. For example, in this embodiment, there are two feeding auxiliary modules 12.
[0037] The above-described configuration makes the layout of the entire feeding device 10 more reasonable and the structure more compact, thereby reducing the footprint of the entire device.
[0038] Furthermore, the feeding module 11 includes multiple sub-modules 11a, which are arranged sequentially along the first direction X. For example, in this embodiment, there are four sub-modules 11a, and each sub-module 11a can carry one silicon wafer to be fed.
[0039] Please refer to the following: Figure 3 and Figure 9 , Figure 9 yes Figure 3 A three-dimensional structural diagram of the feeding and transfer module 13 is shown. The feeding and transfer module 13 includes a transfer drive mechanism 131 and a transfer unit 132. The transfer unit 132 is used to adsorb the spare silicon wafers or the silicon wafers to be transported. The transfer drive mechanism 131 is connected to the transfer unit 132 to drive the transfer unit 132 to reciprocate in the second direction Y, thereby transferring the spare silicon wafers to the feeding module 11 or transferring the overflowing silicon wafers to be transported to the receiving space 102.
[0040] Optionally, there may be multiple feeding and transfer modules 13, which are arranged sequentially in the first direction X. For example, similar to the feeding auxiliary module 12 mentioned above, there are two feeding and transfer modules 13 in this embodiment, each corresponding to one of the two feeding auxiliary modules 12.
[0041] Please refer to the following: Figure 9 and Figure 10 , Figure 10 yes Figure 9 A three-dimensional structural diagram of the feeding correction module is shown. In this embodiment, the feeding device 10 also includes a feeding correction module 14, which includes a correction drive mechanism 141 and a correction component 142. The correction drive mechanism 141 is connected to the correction component 142 to drive the correction component 142 to correct the posture of the silicon wafer to be fed, so as to avoid inaccurate posture and feeding failure.
[0042] The feeding and straightening module 141 also includes a transmission assembly 143, which includes a drive wheel 1431, a driven wheel 1432, and a transmission belt 1433. The drive wheel 1431 is connected to the straightening drive mechanism 141. The transmission belt 1433 is wound around the drive wheel 1431 and the driven wheel 1432 to form a first transmission part 143a and a second transmission part 143b that are arranged opposite to each other and move in opposite directions. There are two straightening members 142. One of the two straightening members 142 is connected to the first transmission part 143a, and the other of the two straightening members 142 is connected to the second transmission part 143b.
[0043] Specifically, the silicon wafer to be transported on the feeding module 11 is located between two straightening members 142. When the straightening drive mechanism 141 drives the drive wheel 1431 to rotate, it drives the driven wheel 1432 and the transmission belt 1433 to rotate. At this time, the first transmission part 143a and the second transmission part 143b move in opposite directions, thereby causing the two straightening members 142 to move closer or further away from each other. In the process of moving closer to each other, the silicon wafer to be transported between the two straightening members 142 is pushed to move, thereby performing posture correction.
[0044] The beneficial effects of this application are as follows: Unlike existing technologies, the feeding device provided in this application includes: a feeding module for receiving and feeding silicon wafers; a feeding auxiliary module having a storage space and a receiving space, wherein the storage space stores spare silicon wafers and the receiving space receives overflowing silicon wafers; and a feeding transfer module for transferring the spare silicon wafers to the feeding module so that they serve as the silicon wafers to be fed, or for transferring the silicon wafers to the receiving space so that they serve as overflowing silicon wafers. With this configuration, in cases of untimely feeding, the spare silicon wafers stored in the storage space can be used for feeding; and in cases of overflowing, the overflowing silicon wafers can be received through the receiving space. This ensures continuous feeding and prevents overflowing silicon wafers.
[0045] The above description is only a partial embodiment of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or directly or indirectly applied to other related technical fields, are similarly included within the scope of patent protection of this application.
Claims
1. A feeding device, characterized in that, The feeding device includes: A feeding module is used to receive silicon wafers to be transported and to feed the silicon wafers to be transported. The feeding auxiliary module has a storage space and a receiving space. The storage space is used to store spare silicon wafers for feeding, and the receiving space is used to receive silicon wafers that overflow from the feeding process. A feeding and transfer module is used to transfer the feeding spare silicon wafer to the feeding module so that the feeding spare silicon wafer can be used as the silicon wafer to be transported, or the feeding and transfer module is used to transfer the silicon wafer to be transported to the receiving space so that the silicon wafer to be transported can be used as the feeding overflow silicon wafer.
2. The feeder of claim 1, wherein The feeding device further includes a feeding correction module, which includes a correction drive mechanism and a correction component. The correction drive mechanism is connected to the correction component to drive the correction component to correct the posture of the silicon wafer to be fed.
3. The feeding device according to claim 2, characterized in that, The feeding and straightening module further includes a transmission assembly, which includes a drive wheel, a driven wheel, and a transmission belt. The drive wheel is connected to the straightening drive mechanism. The transmission belt is wound around the drive wheel and the driven wheel to form a first transmission part and a second transmission part that are arranged oppositely and move in opposite directions. There are two straightening components. One of the two straightening components is connected to the first transmission part, and the other of the two straightening components is connected to the second transmission part.
4. The feeding device according to claim 1, characterized in that, The feeding module is used to feed the silicon wafer to be transported in a first direction. The receiving space and the storage space are arranged sequentially along a second direction, and the first direction and the second direction are arranged to intersect.
5. The feeding device according to claim 4, characterized in that, The number of feeding auxiliary modules is multiple, and the multiple feeding auxiliary modules are arranged sequentially along the first direction.
6. The feeding device according to claim 4, characterized in that, The feeding and transfer module includes a transfer drive mechanism and a transfer unit. The transfer unit is used to adsorb the feed spare silicon wafer or the silicon wafer to be transported. The transfer drive mechanism is connected to the transfer unit to drive the transfer unit to reciprocate in the second direction.
7. The feeding device according to claim 4, characterized in that, The feeding module includes multiple sub-modules, which are arranged sequentially along the first direction.
8. A silicon wafer processing equipment, characterized in that, The silicon wafer processing equipment includes a silicon wafer processing device and a feeding device as described in any one of claims 1 to 7; The feeding module is used to feed the unprocessed silicon wafer to a preset loading position so that the silicon wafer processing device can process the silicon wafer; and / or The feeding module is used to feed the processed silicon wafer to the preset unloading position.
9. The silicon wafer processing equipment according to claim 8, characterized in that, The feeding device includes a feeding unit and a discharging unit, and the feeding unit and the discharging unit respectively include the feeding module, the feeding auxiliary module and the feeding transfer module.
10. The silicon wafer processing equipment according to claim 9, characterized in that, The loading unit and the unloading unit are respectively located on opposite sides of the silicon wafer processing device.