An auxiliary device for rapid wafer flipping

Abstract

This utility model discloses an auxiliary device for rapid wafer flipping, belonging to the field of semiconductor chip manufacturing technology. It includes a wafer carrier placement platform with supporting feet fixedly connected to its bottom. Two opposing wafer carrier limiting base plates are fixedly installed on the top of the platform. A pusher mechanism is installed on the left side of the platform, comprising a pusher component, a connecting rod, a fixing module, and a knob. The upper part of the pusher component extends to the top of the wafer carrier placement platform and corresponds to the wafer workpiece. The pusher component includes a first pusher and a second pusher. When flipping an entire wafer, the pusher component acts as the first pusher; when flipping a single wafer, it acts as the second pusher. This utility model offers flexible mode switching, strong wafer protection, precise and controllable positioning, and high adaptability, achieving efficient, stable, and accurate wafer flipping operations.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor chip manufacturing technology, and in particular relates to an auxiliary device for rapid wafer flipping. Background Technology

[0002] In the semiconductor wafer manufacturing industry, wafers are normally housed in wafer carriers. During production, wafers need to be transferred and moved between different production processes or scenarios. This requires transferring wafers between wafer carriers by flipping them over. During this transfer process, improper operation by operators can lead to surface scratches, breakage, and other abnormalities on the wafers, resulting in defective products and losses.

[0003] In existing technologies, after cleaning, wafers need to be transferred from PFA wafer carriers to PP wafer carriers. Current popular wafer flipping operations include whole-wafer flipping and single-wafer flipping. During flipping, machines automatically flip the wafers, while operators use vacuum pens or flipping between two wafer carriers. These methods have the following drawbacks: 1. Automated wafer flipping using machines is costly; 2. Improper operation with vacuum pens can cause wafer scratches, breakage, and other defects; 3. During wafer carrier flipping, the positioning posts of the wafer carrier itself are prone to breakage and deformation, failing to provide positioning and causing the wafer to be flipped crookedly or scratched; 4. Broken or deformed positioning posts of the wafer carrier require scrapping, resulting in wasted costs; 5. During the wafer flipping process, personnel may come into contact with the wafer, causing defects. Utility Model Content

[0004] To address the problems existing in the prior art, this utility model provides an auxiliary device for rapid wafer flipping, which has the advantages of flexible mode switching, strong wafer protection, precise and controllable positioning, and high adaptability, enabling efficient, stable and accurate wafer flipping operations. It solves the problems of single flipping mode, easy wafer damage, difficult positioning and poor adaptability in the prior art.

[0005] This utility model is implemented as follows: an auxiliary device for rapid wafer flipping includes a wafer carrier placement platform. Support feet are fixedly connected to the four corners of the bottom of the wafer carrier placement platform. Two opposing wafer carrier limiting base plates are fixedly installed on the top of the wafer carrier placement platform. A push rod mechanism is installed on the left side of the wafer carrier placement platform. The push rod mechanism includes a push rod component, connecting rods, a fixing module, and a knob. A linear bearing base is fixed to the bottom of the wafer carrier placement platform by screws. Two connecting rods are installed through the linear bearing base. The fixing module is fixedly connected between one end of the connecting rods. The lower part of the push rod component slides through the fixing module. The knob is threaded onto the fixing module and locks the push rod component. The upper part of the push rod component extends to the top of the wafer carrier placement platform and corresponds to the wafer workpiece. The push rod component includes a first push rod and a second push rod. When flipping an entire wafer, the push rod component is the first push rod; when flipping a single wafer, the push rod component is the second push rod.

[0006] This setting allows for quick switching between whole-wafer / single-wafer flipping modes based on production needs. The first pusher completes batch flipping of the entire wafer group, meeting the requirements for efficient transfer. Switching to the second pusher enables single-wafer flipping, adapting to small-batch and differentiated process requirements. There is no need to purchase multiple sets of equipment, significantly reducing flipping costs. At the same time, it simplifies the operation process, improves the flexibility and versatility of flipping operations, and helps avoid the limitations of traditional flipping methods, which are characterized by limited modes and high costs.

[0007] As a preferred embodiment of this invention, the contact surface between the push rod and the wafer is fixedly connected to an anti-static PE pad, and the entire device is made of insulating and anti-static materials.

[0008] This setup utilizes the soft protective and insulating properties of the anti-static PE pad to prevent the push rod from directly contacting the wafer and causing scratches or damage. It also eliminates the risk of electrostatic adsorption of impurities and wafer breakdown. The entire device is insulated and anti-static, creating a stable wafer flipping environment. This helps ensure wafer surface quality, reduces the defect rate caused by operation, and avoids the wafer damage and electrostatic interference that are common with traditional wafer flipping methods.

[0009] As a preferred embodiment of this invention, a limiting baffle is fixedly connected to one end of the top of the crystal boat box placement platform.

[0010] This setup, through the cooperation of the crystal boat box limiting base plate and the limiting baffle, can precisely limit its boundary position, preventing wafer misalignment and wafer slippage caused by placement deviation, ensuring the relative position stability of the crystal boat box and the wafer, improving the safety and accuracy of the wafer flipping process, and helping to avoid the situation of easy displacement and wafer flipping loss of traditional wafer flipping crystal boat boxes. In addition, the crystal boat box limiting base plate can be used with 4-inch, 6-inch and 8-inch standard crystal boat boxes respectively, with high compatibility and improved usage efficiency.

[0011] As a preferred embodiment of this invention, a limit block is fixedly connected to the other end of the connecting rod.

[0012] This setting limits the maximum stroke of the linkage, preventing the push rod from extending too far forward, causing the wafer to be pushed out of the wafer carrier and damaged by collision, and from being pulled too far back out of the working area. By mechanically limiting the range of motion of the push rod, it ensures that the wafer rewinding operation is always within a safe and controllable range, which helps to avoid the situation of uncontrolled stroke of the traditional push rod and easy damage to the wafer.

[0013] As a preferred embodiment of this utility model, a ball head spring screw is installed inside the fixing module, and a limiting hole groove is formed on the lower inner side of the push rod. The ball head spring screw and the limiting hole groove are matched and connected accordingly.

[0014] With this design, the ball head spring screw engages with the limiting hole slot to automatically limit the push rod. Combined with the knob, it enables quick positioning and fixing of the push rod. When replacing the push rod or adjusting the height, the ball head spring screw elastically extends and retracts to fit the limiting hole slot, reducing the difficulty of operation, preventing the push rod from loosening or shifting during use, ensuring the stability of the push rod position during the film rewinding process, and avoiding the problems of easy loosening and difficult positioning of traditional film rewinding push rods.

[0015] As a preferred embodiment of this invention, the inner side of the second push rod has a plurality of limiting holes and slots evenly distributed along the second push rod, and the ball head spring screw is matched and connected with the corresponding limiting holes and slots. The limiting holes and slots are used to adjust the height of the second push rod to correspond to the wafer of the corresponding layer.

[0016] With this setting, the height of the second push rod can be flexibly adjusted through the multi-layer limiting slot, accurately matching the wafer turning requirements of wafers with different layers. During operation, the limiting slot position can be adjusted as needed, and multiple wafer specifications can be adapted without replacing the push rod. The height adjustment is precise, ensuring uniform force and accurate position when turning a single wafer, which helps to avoid the poor adaptability and easy deviation of traditional single wafer turning.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows: The mode switching is convenient, allowing for quick switching between overall and single-wafer flipping modes, saving production preparation time and adapting to different production needs; cost reduction is achieved because the limit base plate is compatible with multi-size wafer carriers, reducing the cost of wafer carrier scrapping due to damage to positioning posts, eliminating the need for high-cost automatic wafer flipping equipment, and saving equipment investment; the wafers are well protected with anti-static materials and soft PE protection, and the push rods reduce personnel contact, reducing the risk of wafer scratches, breakage, and other defects, improving wafer yield; the wafer flipping accuracy is high, reducing operation difficulty and effectively improving work efficiency. Attached Figure Description

[0018] Figure 1This is a schematic diagram of the structure when the entire wafer is flipped, as provided in an embodiment of this utility model; Figure 2 This is a schematic diagram of the bottom structure provided in an embodiment of the present utility model; Figure 3 This is a schematic diagram of the first push rod structure provided in this embodiment of the utility model; Figure 4 This is a schematic diagram of the structure when a single wafer is flipped, as provided in an embodiment of this utility model; Figure 5 This is a cross-sectional structural schematic diagram provided in an embodiment of the present utility model; Figure 6 This is a schematic diagram of the second push rod structure provided in an embodiment of the present utility model; Figure 7 This is provided by the embodiment of the present utility model. Figure 5 Enlarged structural diagram at point A in the middle.

[0019] In the diagram: 1. Crystal boat box placement platform; 101. Support foot; 102. Limiting baffle; 103. Linear bearing base; 2. Crystal boat box limiting base plate; 3. Connecting rod; 301. Limiting block; 302. Fixing module; 303. Knob; 304. Ball head spring screw; 4. First push rod; 5. Second push rod; 6. Limiting hole slot. Detailed Implementation

[0020] To further understand the utility model content, features and effects of this utility model, the following embodiments are provided, and detailed descriptions are given in conjunction with the accompanying drawings.

[0021] The structure of this utility model will now be described in detail with reference to the accompanying drawings.

[0022] refer to Figures 1 to 7As shown in the figure, an auxiliary device for rapid wafer flipping provided by this utility model includes a wafer carrier placement platform 1. Support feet 101 are fixedly connected to the four corners of the bottom of the wafer carrier placement platform 1. Two opposing wafer carrier limiting base plates 2 are fixedly installed on the top of the wafer carrier placement platform 1. A push rod mechanism is installed on the left side of the wafer carrier placement platform 1. The push rod mechanism includes a push rod component, a connecting rod 3, a fixing module 302, and a knob 303. A linear bearing base 103 is fixed to the bottom of the wafer carrier placement platform 1 by screws. Two connecting rods 3 are mounted through the linear bearing base 103. The fixing module 302 is fixedly connected between one end of the connecting rods 3. The lower part of the push rod slides through the fixing module 302. The knob 303 is threadedly connected to the fixing module 302 and locks the push rod. The upper part of the push rod extends to the top of the crystal boat box placement platform 1 and corresponds to the wafer workpiece. The push rod includes a first push rod 4 and a second push rod 5. When the entire wafer is flipped, the push rod is the first push rod 4. When a single wafer is flipped, the push rod is the second push rod 5.

[0023] Using the above solution, the overall / single wafer flipping mode can be quickly switched according to production needs. The first pusher 4 is used to complete the batch flipping of the entire group of wafers, meeting the requirements of efficient transfer. By replacing it with the second pusher 5, single wafer flipping can be carried out, which is suitable for small batch and differentiated process requirements. There is no need to purchase multiple sets of equipment, which significantly reduces the cost of wafer flipping. At the same time, the operation process is simplified, and the flexibility and versatility of wafer flipping operations are improved, which helps to avoid the situation of traditional wafer flipping methods being single-mode and costly.

[0024] Specifically, the contact surface between the push rod and the wafer is fixedly connected with an anti-static PE pad, and the entire device is made of insulating and anti-static materials.

[0025] By adopting the above solution, the soft protection and insulation properties of the anti-static PE pad are utilized to avoid the push rod directly contacting the wafer and causing scratches or damage. This eliminates the risk of electrostatic adsorption of impurities and wafer breakdown. The entire device is insulated and anti-static, creating a stable wafer flipping environment, which helps to ensure wafer surface quality, reduce the defect rate caused by operation, and avoid the problems of wafer damage and electrostatic interference that are common in traditional wafer flipping.

[0026] Specifically, a limiting baffle 102 is fixedly connected to one end of the top of the crystal boat box placement platform 1.

[0027] By adopting the above solution, the boundary position can be precisely limited through the cooperation of the crystal boat box limiting base plate 2 and the limiting baffle 102, avoiding wafer misalignment and wafer slippage caused by placement offset, ensuring the relative position stability of the crystal boat box and the wafer, improving the safety and accuracy of the wafer flipping process, and avoiding the situation of easy displacement and wafer flipping loss of traditional wafer flipping crystal boat boxes. In addition, the crystal boat box limiting base plate 2 can be used for 4-inch, 6-inch and 8-inch standard crystal boat boxes respectively, with high compatibility and improved usage efficiency.

[0028] Specifically, the other end of the connecting rod 3 is fixedly connected to a limit block 301.

[0029] Using the above solution, the limit block 301 can limit the maximum stroke of the connecting rod 3, preventing the push rod from extending too far forward, causing the wafer to be pushed out of the wafer carrier and damaged by collision, and from being pulled too far back out of the working area. By mechanically limiting the range of motion of the push rod, the wafer flipping operation is always kept within a safe and controllable range, which helps to avoid the situation of uncontrolled stroke of the traditional push rod and easy damage to the wafer.

[0030] Specifically, a ball head spring screw 304 is installed inside the fixing module 302, and a limiting hole groove 6 is opened on the lower inner side of the push rod. The ball head spring screw 304 and the limiting hole groove 6 are matched and connected.

[0031] Using the above solution, the ball head spring screw 304 cooperates with the limiting hole groove 6 to automatically limit the push rod. In conjunction with the knob 303, it can quickly position and fix the push rod. When the push rod is replaced or the height is adjusted, the ball head spring screw 304 elastically extends and retracts to adapt to the limiting hole groove 6, reducing the difficulty of operation, preventing the push rod from loosening and shifting during use, ensuring the stability of the push rod position during the film rewinding process, and avoiding the situation of easy loosening and difficult positioning of traditional film rewinding push rods.

[0032] Specifically, the second push rod 5 has several limiting holes 6 on its inner side, which are evenly distributed along the second push rod 5. The ball head spring screw 304 is matched and connected with the corresponding limiting hole 6. The limiting hole 6 is used to adjust the height of the second push rod 5 to correspond to the wafer of the corresponding layer.

[0033] Using the above solution, the height of the second push rod 5 can be flexibly adjusted by the multi-layer limiting slot 6 to accurately match the wafer turning requirements of wafers with different layers. During operation, the positioning of the limiting slot 6 can be adjusted as needed, and multiple wafer specifications can be adapted without replacing the push rod. The height adjustment is precise, ensuring uniform force and accurate positioning when turning a single wafer, which helps to avoid the poor adaptability and easy deviation of traditional single wafer turning.

[0034] The working principle of this utility model: In use, the standard crystal boat box containing the wafer and the empty crystal boat box are precisely positioned by the limiting base plate set opposite to each other on the crystal boat box placement platform 1, ensuring that the two are in corresponding positions and aligned on the axis. When the whole wafer is flipped, the first push rod 4 is pushed to push the whole group of wafers from the crystal boat box to be transferred into the empty crystal boat box on the opposite side, completing the batch transfer. At this time, the linear bearing base 103 ensures that the connecting rod 3 slides smoothly, and the limiting block 301 limits the push rod stroke to avoid excessive pushing and causing the wafer to fall out. When switching to single-wafer flipping mode, loosen knob 303 to release the first push rod 4, remove it and replace it with the second push rod 5. The ball head spring screw 304 built into the fixing module 302 is precisely engaged with the limiting hole slot 6 of the second push rod 5. Tighten knob 303 to lock it in place. The operator can adjust the height of the second push rod 5 according to the target wafer layer number so that the limiting hole slot 6 corresponds to the specific wafer position. Pushing the second push rod 5 can realize the directional transfer of single wafer. Throughout the process, the orderly cooperation of the mechanical structure realizes the rapid switching and precise operation between the overall and single-wafer flipping modes.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An auxiliary device for rapid wafer flipping, comprising a wafer boat placement platform (1), characterized in that: Support feet (101) are fixedly connected to the four corners of the bottom of the crystal boat box placement platform (1). Two opposing crystal boat box limiting base plates (2) are fixedly installed on the top of the crystal boat box placement platform (1). A push rod mechanism is installed on the left side of the crystal boat box placement platform (1). The push rod mechanism includes a push rod, a connecting rod (3), a fixing module (302), and a knob (303). A linear bearing base (103) is fixed to the bottom of the crystal boat box placement platform (1) by screws. The two connecting rods (3) are installed through the linear bearing base (103). On 03), the fixing module (302) is fixedly connected to one end of the connecting rod (3), the lower part of the push rod slides through the fixing module (302), the knob (303) is threadedly connected to the fixing module (302) and locks the push rod, the upper part of the push rod extends to the top of the crystal boat box placement platform (1) and corresponds to the wafer workpiece, the push rod includes a first push rod (4) and a second push rod (5), when the whole wafer is flipped, the push rod is the first push rod (4), when a single wafer is flipped, the push rod is the second push rod (5).

2. The auxiliary device for rapid wafer flipping as described in claim 1, characterized in that: The contact surface between the push rod and the wafer is fixedly connected to an anti-static PE pad, and the entire device is made of insulating and anti-static materials.

3. The auxiliary device for rapid wafer flipping as described in claim 1, characterized in that: A limiting baffle (102) is fixedly connected to one end of the top of the crystal boat box placement platform (1).

4. The auxiliary device for rapid wafer flipping as described in claim 1, characterized in that: The other end of the connecting rod (3) is fixedly connected to a limit block (301).

5. The auxiliary device for rapid wafer flipping as described in claim 1, characterized in that: The fixed module (302) is equipped with a ball head spring screw (304), and the lower inner side of the push rod is provided with a limiting hole groove (6). The ball head spring screw (304) and the limiting hole groove (6) are matched and connected accordingly.

6. The auxiliary device for rapid wafer flipping as described in claim 5, characterized in that: The second push rod (5) has several limiting holes (6) on its inner side, which are evenly distributed along the second push rod (5). The ball head spring screw (304) is matched and connected with the corresponding limiting hole (6). The limiting hole (6) is used to adjust the height of the second push rod (5) to correspond to the wafer of the corresponding layer.

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