A wafer carrier leveling assembly

Abstract

This utility model relates to the field of semiconductor technology and discloses a wafer carrier leveling assembly, comprising: a carrier body with a through hole, a leveling component threaded into the through hole, a connecting hole on the leveling component, the connecting hole penetrating the leveling component circumferentially; a mounting base, parallel to one side of the carrier body, with the end of the leveling component facing the mounting base abutting against the mounting base; and a locking component, installed in the connecting hole, penetrating the connecting hole and locking the carrier body in place. Because the leveling component and the locking component are coaxially designed, eccentric forces are avoided during leveling, increasing the contact area between the leveling component and the mounting base, reducing local pressure, and minimizing the risk of component wear. Simultaneously, this structure simplifies the leveling operation, eliminating the need for multiple adjustments of components on different axes, significantly shortening the leveling time, and improving leveling efficiency and stability.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a wafer carrier leveling assembly. Background Technology

[0002] In semiconductor equipment, during the actual wafer fabrication process, the wafer support stage needs to meet certain level requirements to ensure that the actual position of the wafer during the process matches the theoretical design. At the same time, ensuring the levelness of the wafer can also ensure the stability of the wafer during the process.

[0003] In existing wafer stage devices, the stage body is locked to the mounting base by locking bolts, and leveling screws are used between the mounting base and the stage body to adjust the levelness of the stage. Figure 1 As shown, the locking bolts and leveling screws on the support plate body are arranged circumferentially. During the leveling process of the support plate body, the bolts are first loosened to release the locking state between the mounting base and the support plate body. Then, the support plate body is leveled by rotating the leveling screws, and the locking bolts are tightened to fix it, so that the support plate body maintains the current leveling state.

[0004] However, because there is a certain distance between the locking bolts and the leveling screws on the plate holder body, an additional eccentric force is applied to the plate holder body during the tightening of the locking bolts. This causes the leveling state of the plate holder body to change after it is locked and fixed, requiring further fine-tuning. This makes the leveling operation of the plate holder body cumbersome and time-consuming. Utility Model Content

[0005] In view of this, the present invention provides a wafer substrate leveling component to solve the problem that the wafer substrate leveling operation is cumbersome and time-consuming in the prior art.

[0006] In a first aspect, this utility model provides a wafer support stage leveling assembly, comprising: a wafer support stage body having a through hole thereon, a leveling component being threaded into the through hole, a connecting hole thereon having a connecting hole that passes through the leveling component along its axial direction; The mounting base is installed parallel to one side of the plate support body, and the end of the leveling component facing the mounting base abuts against the mounting base. A locking component is installed in the connecting hole, and after passing through the connecting hole, the locking component cooperates with the support platform body to lock and fix it.

[0007] The locking and leveling components are arranged axially on the support platform body. During leveling, the locking components are first released, disengaging the mounting base from the support platform body. Then, a leveling tool is used to rotate the leveling component, which is threaded into the through hole of the support platform body. As the leveling component rotates, it moves along the axial direction. Since one end of the leveling component abuts against the mounting base, its axial movement allows for fine-tuning of the parallelism between the support platform body and the mounting base. After adjustment, the locking component is inserted into the connecting hole of the leveling component and locked, fixing the support platform body, the leveling component, and the mounting base, achieving stable leveling. Because the leveling and locking components are coaxial, eccentric forces are avoided during leveling, increasing the contact area between the leveling component and the mounting base, reducing local pressure, and minimizing the risk of component wear. Simultaneously, this structure simplifies the leveling operation, eliminating the need for multiple adjustments of different axial components, significantly shortening leveling time, and improving leveling efficiency and stability.

[0008] In one optional embodiment, the leveling component includes a leveling part and an abutting part. The abutting part is disposed at one end of the leveling part, the leveling part is threadedly engaged with the connecting hole, and the abutting part extends outside the connecting hole and abuts against the mounting base.

[0009] The large contact area between the abutment part and the mounting base optimizes load distribution. The low pressure on the contact surface between the abutment part and the mounting base prevents localized wear or damage to the base and makes it more stable after fixing, which is beneficial for secondary adjustment and equipment operation stability, thus improving efficiency. The leveling part and the threaded connection hole enable precise axial displacement control.

[0010] In one optional embodiment, the cross-sectional area of ​​the abutting portion is not less than the cross-sectional area of ​​the leveling portion.

[0011] By ensuring that the cross-sectional area of ​​the abutment part is not less than that of the leveling part, the contact area between the abutment part and the mounting base is guaranteed, reducing the pressure on the contact surface and preventing localized wear or damage to the base.

[0012] In one alternative embodiment, the abutment portion is provided with an operating plane in the circumferential direction, the operating plane being adapted to cooperate with an external adjustment tool.

[0013] The operating plane is designed to provide a clear force-bearing area for external adjustment tools, preventing the tools from directly acting on the contact part and potentially damaging its surface. This ensures the structural integrity and long-term durability of the leveling component. At the same time, operators can apply precise force through external adjustment tools, thereby achieving accurate and controllable adjustment of the leveling component's rotation angle and axial displacement.

[0014] In one optional embodiment, the outer diameter of the locking member matches the inner diameter of the connecting hole, so that when the locking member is inserted into the connecting hole, the outer wall of the locking member fits tightly against the inner wall of the connecting hole, forming a stable fit and ensuring that the locking member does not wobble within the connecting hole. This prevents misalignment or loosening caused by gaps and enhances the overall structural rigidity and reliability after locking.

[0015] In one alternative embodiment, the locking member, the connecting hole, and the leveling member are arranged coaxially.

[0016] The precise coaxial arrangement of the locking component, connecting hole, and leveling component ensures that the force line of the locking operation coincides with the force center line of the leveling component. This eliminates the eccentric force that the locking process may generate on the already leveled support platform body, ensuring that the levelness obtained after leveling remains consistent before and after locking, avoiding secondary leveling and improving leveling efficiency.

[0017] In one optional embodiment, a limiting portion is provided at the end of the locking member opposite to the mounting base, and the outer diameter of the limiting portion is not less than the inner diameter of the connecting hole.

[0018] When the locking component is inserted into the connecting hole and locked, the limiting part is located at the outer end of the connecting hole. Since the outer diameter of the limiting part is not less than the inner diameter of the connecting hole, the limiting part plays an axial limiting role, preventing the locking component from being over-inserted. At the same time, the limiting part can also provide reliable axial positioning for the locking component, preventing the locking component from accidentally loosening or falling off during vibration or use, thus improving the safety and maintenance convenience of the component.

[0019] In one optional embodiment, the side of the plate support body facing the mounting base is provided with a clearance groove, and the clearance groove is provided corresponding to the through hole.

[0020] The clearance groove is located on the surface of the support platform body opposite to the mounting base and is aligned with the through hole, providing additional accommodating space for the abutment portion of the leveling component. This avoids structural interference between the leveling component and the support platform body, allowing the leveling component to be adjusted in height over a wider range.

[0021] In one optional embodiment, a plurality of through holes are provided at circumferential intervals along the body of the support platform, and the leveling component and the locking component are installed in each of the plurality of through holes.

[0022] The multi-point leveling structure can improve the overall flatness adjustment capability of the wafer stage, effectively compensate for the tilt caused by uneven mounting base or uneven load, and ensure the levelness of wafer placement and process stability.

[0023] In one optional embodiment, the locking member is threadedly engaged with the mounting base for locking and fixing; or, the locking member is snap-fitted with the mounting base for fixing.

[0024] When using a threaded connection, the locking element passes through the connecting hole and engages with the threaded hole on the mounting base, achieving fixation through thread tightening. When using a snap-fit ​​connection, the locking element forms a mechanical interlock with the mounting base through a snap-fit, elastic clip, or other structure. Threaded locking provides a reliable connection and strong vibration resistance, maintaining a stable connection during use and preventing leveling failure. Snap-fit ​​locking allows for quick installation and removal of the locking element, improving locking efficiency. Attached Figure Description

[0025] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a wafer carrier leveling assembly in the prior art. Figure 2 This is a schematic diagram of the wafer support leveling assembly in this utility model.

[0027] Figure 3 This is a schematic diagram of the wafer support leveling assembly of this utility model from another angle.

[0028] Explanation of reference numerals in the attached figures: 1. Plate holder body; 2. Mounting base; 3. Locking component; 4. Through hole; 5. Leveling component; 501. Leveling part; 502. Abutment part; 6. Connecting hole; 7. Limiting part; 8. Relief groove. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0030] The following is combined with Figures 1 to 3 The following describes embodiments of the present invention.

[0031] According to an embodiment of the present invention, a wafer stage leveling assembly is provided, comprising: a stage body 1, a mounting base 2, and a locking member 3.

[0032] The support platform body 1 has a through hole 4, and a leveling component 5 is threaded into the through hole 4. The leveling component 5 has a connecting hole 6, which passes through the leveling component 5 along its axial direction. The mounting base 2 is installed parallel to one side of the support platform body 1, and the end of the leveling component 5 facing the mounting base 2 abuts against the mounting base 2. The locking component 3 is installed in the connecting hole 6, and after passing through the connecting hole 6, it engages with the support platform body 1 to lock and fix it in place.

[0033] The locking member 3 and the leveling member 5 are arranged axially on the support platform body 1. During leveling, the locking member 3 is first released, thus releasing the locking between the mounting base 2 and the support platform body 1. Then, a leveling tool is used to rotate the leveling member 5, which is installed in the through hole 4 of the support platform body 1 via a rotating thread. As the leveling member 5 rotates, it moves along the axial direction. Since one end of the leveling member 5 abuts against the mounting base 2, the axial movement of the leveling member 5 can finely adjust the parallelism of the support platform body 1 relative to the mounting base 2. After adjustment, the locking member 3 is inserted into the connecting hole 6 of the leveling member 5 and locked, thus fixing the support platform body 1, the leveling member 5, and the mounting base 2 relative to each other, achieving stable leveling. Because the leveling component 5 and the locking component 3 are coaxially designed, eccentric force is avoided during the leveling process, the contact area between the leveling component 5 and the mounting base 2 is increased, the local pressure is reduced, and the risk of component wear is reduced. At the same time, this structure simplifies the leveling operation, eliminates the need to adjust different axis components multiple times, significantly shortens the leveling time, and improves the leveling efficiency and stability.

[0034] In one embodiment, the leveling component 5 includes a leveling part 501 and an abutting part 502. The abutting part 502 is disposed at one end of the leveling part 501. The leveling part 501 is threadedly engaged with the connecting hole 6. The abutting part 502 extends outside the connecting hole 6 and abuts against the mounting base 2.

[0035] The contact area between the abutment part 502 and the mounting base 2 is large, which optimizes the load distribution. The contact surface pressure between the abutment part 502 and the mounting base 2 is small, which will not cause local wear or damage to the base. Moreover, it is more stable after fixing, which is conducive to secondary adjustment and equipment operation stability, and improves efficiency. The leveling part 501 is threaded with the connecting hole 6 to realize axial displacement control.

[0036] Specifically, the leveling part 501 is a set screw, and the abutting part 502 is an abutting block.

[0037] In one embodiment, the cross-sectional area of ​​the abutment portion 502 is not less than the cross-sectional area of ​​the leveling portion 501.

[0038] By ensuring that the cross-sectional area of ​​the abutment portion 502 is not less than the cross-sectional area of ​​the leveling portion 501, the contact area between the abutment portion 502 and the mounting base 2 is guaranteed, reducing the pressure on the contact surface and preventing localized wear or damage to the base. Specifically, in this embodiment, the cross-sectional area of ​​the abutment portion 502 is larger than the cross-sectional area of ​​the leveling portion 501, so that the cross-sectional area of ​​the abutment portion 502 is not less than the through hole 4, ensuring that the abutment portion 502 does not move axially, reducing adjustment errors introduced by axial movement, and facilitating higher precision horizontal calibration.

[0039] In one embodiment, the abutment portion 502 is provided with an operating plane in the circumferential direction, and the operating plane is adapted to cooperate with an external adjustment tool.

[0040] The operation plane provides a clear force-bearing area for the external adjustment tool to apply force, avoiding direct action of the external adjustment tool on the contact part 502, which may damage the surface of the contact part 502, thus ensuring the structural integrity and long-term durability of the leveling part 5. At the same time, the operator can apply precise force through the external adjustment tool, thereby achieving precise and controllable adjustment of the rotation angle and axial displacement of the leveling part 5.

[0041] Specifically, the operating surface of the abutment part 502 is a hexagonal bolt, and the external adjustment tool is a wrench.

[0042] In one embodiment, the outer diameter of the locking member 3 matches the inner diameter of the connecting hole 6.

[0043] The matching design of the outer diameter of the locking component 3 and the inner diameter of the connecting hole 6 makes the two form a tight fit, reducing the shaking of the locking component 3 in the connecting hole 6, ensuring the stability between the support platform body 1, the leveling component 5 and the mounting base 2 after the locking operation is completed, and effectively preventing changes in the leveling state caused by vibration or external force interference.

[0044] Specifically, in this embodiment, the outer diameter of the locking member 3 is the same as the inner diameter of the connecting hole 6, and the outer peripheral wall of the locking member 3 is tightly fitted with the inner wall of the connecting hole 6.

[0045] In one embodiment, the locking member 3, the connecting hole 6, and the leveling member 5 are arranged coaxially.

[0046] By precisely arranging the locking component 3, connecting hole 6, and leveling component 5 coaxially, the force line of the locking operation coincides with the force center line of the leveling component 5, eliminating the eccentric force that may be generated on the already leveled support platform body 1 during the locking process. This ensures that the levelness obtained after leveling remains consistent before and after locking, avoids secondary leveling, and improves leveling efficiency.

[0047] In one embodiment, the locking member 3 is provided with a limiting part 7 at the end opposite to the mounting base 2, and the outer diameter of the limiting part 7 is not less than the inner diameter of the connecting hole 6.

[0048] By setting a limiting part 7 with an outer diameter not less than the inner diameter of the connecting hole 6, a reliable mechanical stop is provided for the axial movement of the locking part 3 in the connecting hole 6, preventing the locking part 3 from accidentally falling out of the connecting hole 6 during complete loosening or installation.

[0049] Specifically, in this embodiment, the outer diameter of the limiting part 7 is larger than the inner diameter of the connecting hole 6. In another embodiment, the limiting part 7 may be omitted, and a bolt with a hexagonal interior may be provided on the top of the locking member 3.

[0050] In one embodiment, the side of the plate support body 1 facing the mounting base 2 is provided with a clearance groove 8, and the clearance groove 8 is provided corresponding to the through hole 4.

[0051] By setting a clearance groove 8 corresponding to the through hole 4, sufficient physical clearance is provided for the leveling component 5 to move between the support platform body 1 and the mounting base 2, avoiding mechanical interference of the support platform body 1 on the stroke of the contact part 502, and ensuring the range and flexibility of the leveling operation.

[0052] Specifically, the clearance groove 8 is larger than the abutment part 502.

[0053] In one embodiment, multiple through holes 4 are provided at intervals along the circumference of the support plate body 1, and leveling components 5 and locking components 3 are installed in each of the multiple through holes 4.

[0054] By setting multiple independent leveling and locking units at intervals along the circumference of the bearing platform body 1, the load borne by the bearing platform body 1 can be evenly and dispersedly transferred to the mounting base 2, avoiding local deformation or stress concentration that may be caused by too few support points, and improving stability; the bearing platform body 1 can be leveled at multiple points, realizing high-precision control of the global flatness of the bearing platform body 1.

[0055] Specifically, four through holes 4 are evenly spaced on the substrate 1.

[0056] In one embodiment, the locking member 3 is locked and fixed with the mounting base 2 by thread engagement. After passing through the connecting hole 6, the locking member 3 engages with the threaded hole on the mounting base 2, and the fixing is achieved by tightening the thread.

[0057] When using threaded locking, the connection is reliable and has strong vibration resistance, maintaining a stable connection during use and preventing leveling failure. When using snap-fit ​​locking, the locking component 3 can be quickly installed and removed, improving locking efficiency.

[0058] In another embodiment, the locking member 3 is snapped into and fixed to the mounting base 2, and the locking member 3 forms a mechanical interlock with the elastic claw structure on the mounting base 2 through a snap-fit. This enables quick installation and removal of the locking member 3 and improves locking efficiency.

[0059] Specifically, the locking element 3 and the mounting base 2 are locked together by a threaded connection.

[0060] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A wafer carrier leveling assembly, characterized in that, include: The support platform body (1) has a through hole (4) thereon, and a leveling component (5) is installed in the through hole (4) with an internal thread. The leveling component (5) has a connecting hole (6) thereon, and the connecting hole (6) is provided through the leveling component (5) along the axial direction of the leveling component (5). The mounting base (2) is installed parallel to one side of the plate support body (1), and the leveling component (5) is in contact with the mounting base (2) at one end facing the mounting base (2). The locking member (3) is installed in the connecting hole (6). After the locking member (3) passes through the connecting hole (6), it cooperates with the support plate body (1) to lock and fix it.

2. The wafer carrier leveling assembly according to claim 1, characterized in that, The leveling component (5) includes a leveling part (501) and an abutting part (502). The abutting part (502) is located at one end of the leveling part (501). The leveling part (501) is threaded into the connecting hole (6). The abutting part (502) extends outside the connecting hole (6) and abuts against the mounting base (2).

3. The wafer carrier leveling assembly according to claim 2, characterized in that, The cross-sectional area of ​​the contact part (502) is not less than the cross-sectional area of ​​the leveling part (501).

4. The wafer carrier leveling assembly according to claim 2 or 3, characterized in that, The abutment part (502) is provided with an operating plane in the circumferential direction, and the operating plane is adapted to cooperate with an external adjustment tool.

5. The wafer carrier leveling assembly according to any one of claims 1 to 3, characterized in that, The outer diameter of the locking member (3) matches the inner diameter of the connecting hole (6).

6. The wafer carrier leveling assembly according to any one of claims 1 to 3, characterized in that, The locking member (3), the connecting hole (6), and the leveling member (5) are arranged coaxially.

7. The wafer carrier leveling assembly according to any one of claims 1 to 3, characterized in that, The locking member (3) has a limiting part (7) at one end away from the mounting base (2), and the outer diameter of the limiting part (7) is not less than the inner diameter of the connecting hole (6).

8. The wafer carrier leveling assembly according to any one of claims 1 to 3, characterized in that, The support platform body (1) has a relief groove (8) on the side facing the mounting base (2), and the relief groove (8) is correspondingly provided with the through hole (4).

9. The wafer carrier leveling assembly according to any one of claims 1 to 3, characterized in that, Multiple through holes (4) are provided at intervals along the circumference of the support plate body (1), and the leveling component (5) and the locking component (3) are installed in each of the multiple through holes (4).

10. The wafer carrier leveling assembly according to any one of claims 1 to 3, characterized in that, The locking member (3) is locked and fixed with the mounting base (2) by a threaded engagement; Alternatively, the locking member (3) may be engaged and fixed to the mounting base (2).

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