A wafer clamping turntable

Abstract

This utility model discloses a wafer clamping turntable, including a turntable, a plurality of clamping members for clamping wafers evenly spaced along the circumference of the turntable surface edge, and a plurality of support members for supporting the wafers on the turntable surface. Each clamping member includes a support post and a clamping block connected to the upper end of the support post. Each support post and clamping block has a micro-adjustment structure that allows independent adjustment of the angle of the corresponding clamping block to maintain concentricity between the clamped wafer and the turntable. Thus, through the micro-adjustment structure on each clamping member, the angle of the corresponding clamping block can be adjusted individually, ensuring that all clamping blocks form effective contact with the wafer edge, reducing circular runout, and thus meeting the requirements of high-precision cleaning for rotational stability. Furthermore, by micro-adjusting the angle of each clamping block, the positional deviation of the wafer can be actively corrected, keeping the clamped wafer concentric with the turntable, thereby preventing cleaning solution from splashing onto surrounding workpieces during wafer rotation cleaning.

Description

Technical Field

[0001] This utility model relates to the semiconductor field, specifically to a wafer clamping turntable. Background Technology

[0002] In the semiconductor manufacturing industry, wet processing equipment is the core equipment for completing key processes such as wafer cleaning and etching. Due to the characteristics of the process, the wafer needs to be rotated for cleaning while being held in a clamped state, and the wafer clamping device, as the component that directly contacts the wafer, plays the role of fixing and precisely positioning the wafer.

[0003] Existing wafer clamping devices consist of a turntable and multiple clamping components evenly distributed on the turntable. The wafer is clamped and fixed by the coordinated clamping of these components. However, in actual production and assembly processes, limitations in machining accuracy and assembly techniques, such as dimensional errors in the clamping components themselves or slight angular deviations during installation on the turntable, can lead to situations where some clamping components fail to make effective contact with the wafer when multiple clamping components are used together. This can result in situations where a single clamping component fails to make contact, or multiple clamping components make poor contact. This abnormal contact has two main consequences: firstly, it causes instability during wafer rotation, resulting in excessive circular runout, which fails to meet the rotational stability requirements of high-precision cleaning; secondly, it causes positioning deviations on the turntable, leading to misalignment between the wafer and the turntable, causing cleaning solutions to splash onto surrounding components during the wafer rotation cleaning process. Utility Model Content

[0004] Based on this, and in response to the aforementioned technical problems, this utility model provides a wafer clamping turntable.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] A wafer clamping turntable includes a turntable, a plurality of clamping members for clamping wafers distributed at equal intervals along the circumference of the turntable surface edge, and a plurality of supporting members for supporting wafers on the turntable surface. Each clamping member includes a support post and a clamping block connected to the upper end of the support post. Each support post and clamping block has a fine-tuning structure that allows independent adjustment of the angle of the corresponding clamping block so that the clamped wafer and the turntable remain concentric.

[0007] The above technical solution utilizes a clamping mechanism that forms a wraparound grip from the wafer edge, with the top of the support contacting the bottom of the wafer. This not only disperses the wafer's weight and clamping force, preventing bending or deformation due to its thin and brittle nature, but also reduces the contact area, thus minimizing contact contamination. Secondly, the fine-tuning structure on each clamping component allows for individual adjustment of the angle of the corresponding clamping block, ensuring effective contact between all clamping blocks and the wafer edge, reducing circular runout and meeting the high-precision cleaning requirements for rotational stability. Furthermore, by fine-tuning the angle of each clamping block, the wafer's positional deviation can be actively corrected, keeping the clamped wafer concentric with the turntable and preventing cleaning solution from splashing onto surrounding workpieces during wafer rotation cleaning.

[0008] In a specific embodiment of this utility model: the fine-tuning structure includes a first shim and a second shim, the holding block has a receiving cavity, the upper part of the support column has a stop step, the upper end of the support column is inserted into the receiving cavity, the bottom surface of the holding block contacts the top surface of the stop step and is stopped and limited, the first shim is fixed on the top surface of the support column, the second shim is fixed on the top wall of the receiving cavity, and the contact surface between the first shim and the second shim is a toothed surface.

[0009] In a specific embodiment of this utility model: the turntable surface edge is provided with multiple through mounting holes, and each clamping component is installed in a corresponding mounting hole. The support column is located in the mounting hole, and a bushing is fixed inside the mounting hole and fitted onto the support column. In this way, by fixing the bushing inside the mounting hole and fitting it onto the support column, the position of the support column is fixed, the radial sway of the support column is restricted, and the position of the clamping block is ensured to be stable.

[0010] In a specific embodiment of this utility model: the clamping block is made of antistatic composite plastic. This gives the clamping block antistatic properties, effectively suppressing static electricity generated during contact and friction between the clamping block and the wafer, thereby preventing damage to the wafer circuitry from electrostatic discharge. Secondly, the plastic is elastic, forming a flexible fit when in contact with the wafer, thus reducing the risk of scratches and indentations on the wafer surface during clamping.

[0011] In a specific embodiment of this utility model: the support component is made of antistatic composite plastic. This structure has antistatic properties, effectively suppressing static electricity generated during contact and friction between the support component and the wafer, thereby preventing damage to the wafer circuitry from electrostatic discharge. Secondly, the plastic is elastic, reducing the likelihood of scratches on the wafer surface during contact.

[0012] In summary, this invention, through a fine-tuning structure, allows for individual adjustment of the angles of the corresponding clamping blocks, ensuring that all clamping components can effectively contact the wafer edge, reducing circular runout, and thus meeting the requirements of high-precision cleaning for rotational stability. Furthermore, by fine-tuning the angles of each clamping block, the wafer's positional deviation can be actively corrected, keeping the clamped wafer concentric with the turntable, thereby preventing cleaning solution from splashing onto surrounding workpieces during wafer rotation cleaning. Attached Figure Description

[0013] The present invention will be further described below with reference to the accompanying drawings.

[0014] Figure 1 This is a schematic diagram of the structure of a wafer clamping turntable according to the present invention;

[0015] Figure 2 The clamping device secures and holds the wafer in place.

[0016] Figure 3 This is a schematic diagram of the structure of the clamping component of this utility model;

[0017] Figure 4 yes Figure 3 Sectional view at point AA;

[0018] Figure 5 This is a schematic diagram of the structure of the support rod of this utility model;

[0019] Figure 6 yes Figure 5 Enlarged view at point B in the middle;

[0020] Figure 7 This is a schematic diagram of the structure of the first gasket of this utility model;

[0021] Figure 8 This is a schematic diagram of the structure of the clamping block of this utility model. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1 and Figure 2As shown, this utility model is a wafer clamping turntable, including a turntable 10 and six clamping members 20 evenly distributed along the circumference of the surface edge of the turntable 10 for clamping wafers 9. Six supporting members 11 are provided on the surface of the turntable 10 to support the wafers 9, located in the middle of adjacent clamping members. In this way, the six clamping members form a ring-shaped clamping grip from the edge of the wafer 9, and the pointed tips of the supporting members 11 contact the bottom of the wafer to support it. This not only disperses the weight of the wafer itself and the clamping force to prevent the wafer from bending or deforming due to its thin and brittle nature, but also reduces the contact area, thereby reducing contact contamination.

[0024] In this embodiment, the support member 11 is made of antistatic composite plastic. This structure has antistatic properties, effectively suppressing static electricity generated during contact and friction between the support member and the wafer, thereby preventing damage to the wafer circuitry from electrostatic discharge. Secondly, the plastic is elastic, reducing the likelihood of scratches on the wafer surface during contact.

[0025] like Figures 1-4 As shown, in this embodiment, the turntable 10 has six through mounting holes 12 on its surface edge. Six clamping members 20 are respectively installed in the corresponding mounting holes 12. Each clamping member 20 includes a support post 21, a clamping block 22, and a bushing 23. The support post 21 is located in the corresponding mounting hole 12, with its upper end extending upwards out of the mounting hole 12 and connected to the corresponding clamping block 22 by screws. The bushing 23 is fixed in the corresponding mounting hole 12 and sleeved on the support post 21. Thus, by fixing the bushing 23 in the mounting hole 12 and sleeved on the support post 21, the position of the support post 21 is fixed, limiting radial sway of the support post and ensuring the stability of the clamping block 22. The clamping block 22 is cam-shaped; during clamping, each clamping block 22 directly contacts the edge of the wafer, cooperating to clamp the wafer.

[0026] In this embodiment, all clamping blocks 22 are made of antistatic composite plastic. This provides the clamping blocks with antistatic properties, effectively suppressing static electricity generated during contact and friction between the clamping blocks and the wafer, thereby preventing damage to the wafer circuitry from electrostatic discharge. Secondly, the plastic is elastic, forming a flexible fit when in contact with the wafer, thus reducing the risk of scratches and indentations on the wafer surface during clamping.

[0027] like Figure 4 As shown, in this embodiment, a fine-tuning structure 30 is provided between the support column 21 and the clamping block 22. Using this structure, by adjusting the fine-tuning structure 30 of each clamping component, the angle of the corresponding clamping block can be adjusted independently, ensuring that all clamping blocks can form effective contact with the wafer edge, reducing circular runout, and thus meeting the requirements of high-precision cleaning for rotational stability. Furthermore, by fine-tuning the angle of each clamping block, the positional deviation of the wafer can be actively corrected, keeping the clamped wafer concentric with the turntable, thereby preventing cleaning solution from splashing onto surrounding workpieces during wafer rotation cleaning.

[0028] like Figures 4-8 As shown, in this embodiment, the fine-tuning structure 30 includes a first shim 31 and a second shim 32. The clamping block 22 has a receiving cavity 221 with an open bottom. The support column 21 has a stop step 211 on its upper part. The upper end of the support column 21 is inserted into the receiving cavity 221, and the bottom surface of the clamping block 22 contacts and is stopped and limited by the top surface of the stop step 211. The first shim 31 is fixed to the top surface of the support column 21. The second shim 32 is fixed to the top wall of the receiving cavity 221. The contact surface between the first shim 31 and the second shim 32 is a toothed surface.

[0029] Thus, when the clamped wafer is not concentric with the turntable 10, the clamping block 22 is rotated by loosening the screws between the support post 21 and the clamping block 22 of the corresponding clamping member 20. After the clamping block 22 is rotated to the target position, the screws are tightened.

[0030] In summary, this invention, through a fine-tuning structure, allows for individual adjustment of the angles of the corresponding clamping blocks, ensuring that all clamping components can effectively contact the wafer edge, reducing circular runout, and thus meeting the requirements of high-precision cleaning for rotational stability. Furthermore, by fine-tuning the angles of each clamping block, the wafer's positional deviation can be actively corrected, keeping the clamped wafer concentric with the turntable, thereby preventing cleaning solution from splashing onto surrounding workpieces during wafer rotation cleaning.

[0031] The above description provides a detailed account of one embodiment of the present invention. However, this description is merely a preferred embodiment and should not be construed as limiting the scope of the present invention. All equivalent variations and improvements made within the scope of the claims of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A wafer clamping turntable, comprising a turntable, a plurality of clamping members for clamping wafers evenly spaced along the circumference of the turntable surface edge, and a plurality of supporting members disposed on the turntable surface for supporting the wafers, wherein the clamping members include supporting posts and clamping blocks connected to the upper ends of the supporting posts, characterized in that, Each support column and clamping block has a fine-tuning structure that allows for independent adjustment of the angle of the corresponding clamping block, so that the clamped wafer and the turntable remain concentric.

2. The wafer clamping turntable according to claim 1, characterized in that, The fine-tuning structure includes a first shim and a second shim. The holding block has a receiving cavity, and the upper part of the support column has a stop step. The upper end of the support column is inserted into the receiving cavity. The bottom surface of the holding block contacts the top surface of the stop step and is stopped and limited. The first shim is fixed to the top surface of the support column, and the second shim is fixed to the top wall of the receiving cavity. The contact surface between the first shim and the second shim is a toothed surface.

3. The wafer clamping turntable according to claim 1, characterized in that, The turntable surface edge has multiple through mounting holes, and each clamping component is installed in the corresponding mounting hole. The support column is located in the mounting hole, and a bushing fitted on the support column is fixed in the mounting hole.

4. The wafer clamping turntable according to claim 1, characterized in that, The clamping blocks are all made of antistatic composite plastic, and the support components are also made of antistatic composite plastic.

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