A detection mechanism for semiconductor production

Abstract

This utility model discloses a testing mechanism for semiconductor production, belonging to the field of semiconductor production equipment technology. It includes a semiconductor body, a testing platform, and a testing camera. Four sets of supports, a frame, and an L-shaped column are fixedly installed on the top of the testing platform. Conveyor wheels are rotatably installed inside adjacent sets of supports, and conveyor belts are driven to the outer sides of the two sets of conveyor wheels. The semiconductor body is placed on the conveyor belt. Two sets of guide rods are fixedly installed inside the frame, and two sets of moving plates are slidably installed on the outer sides of the two sets of guide rods. A transmission rod is hinged to the top of each of the two sets of moving plates, and a turntable is hinged to one end of each of the two sets of transmission rods. A frame is fixedly installed on one side of each of the two sets of moving plates, and a connecting block is slidably installed inside each of the two sets of frames. This achieves automated, high-precision centering positioning, and makes the clamping force soft and elastic, firmly positioning the workpiece while effectively avoiding physical damage to the semiconductor body during the positioning process.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a testing mechanism for semiconductor manufacturing. Background Technology

[0002] In the semiconductor manufacturing industry, surface defects of semiconductors such as wafers and chips directly determine product yield and reliability. Therefore, achieving accurate defect identification through visual inspection has become a key link in production.

[0003] Most testing institutions rely on manual positioning or simple mechanical limiting, which is difficult to adapt to the batch testing needs of production lines. Some automated positioning equipment adopts a single-sided drive clamping structure, and the movement of the clamping components on both sides is not synchronized, which directly causes the focusing deviation of the testing camera and leads to the missed detection of nanoscale defects. Therefore, we propose a testing institution for semiconductor production to solve this problem. Utility Model Content

[0004] The purpose of this invention is to provide a testing mechanism for semiconductor manufacturing to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A semiconductor manufacturing inspection mechanism includes: a semiconductor body, an inspection table, and an inspection camera. Four sets of supports, a frame, and L-shaped columns are fixedly mounted on the top of the inspection table. Conveyor wheels are rotatably mounted inside each pair of adjacent sets of supports, and conveyor belts are driven to the outer sides of the two sets of conveyor wheels. The semiconductor body is mounted on the conveyor belts. Two sets of guide rods are fixedly mounted inside the frame, and two sets of movable plates are slidably mounted on the outer sides of the two sets of guide rods. A transmission rod is hinged to the top of each set of movable plates, and one end of each transmission rod is hinged to the same turntable. Each of the two sets of movable plates has a frame fixedly installed on one side. Connecting blocks are slidably installed inside each of the two sets of frames. Two sets of buffer springs are fixedly installed on one side of each of the two sets of connecting blocks. Push plates are fixedly installed on the other side of each of the two sets of connecting blocks. A second motor is fixedly installed on the top of the frame. A turntable is fixedly installed on the output end of the second motor. A transmission rod is hinged between the turntable and the top of each of the two sets of movable plates. An electric push rod is fixedly installed on the top of the L-shaped column. A mounting plate is fixedly installed on the output of the electric push rod. The detection camera is located at the bottom of the mounting plate.

[0007] Preferably, a support plate is fixedly installed on the top of the testing platform, a motor is fixedly installed on one side of the support plate, a sector gear is fixedly installed on the output end of the motor, a transmission gear is fixedly installed on one side of one set of conveying wheels, and two sets of lifting rods are provided between the top of the mounting plate and the bottom of the L-shaped column.

[0008] Preferably, the two sets of connecting blocks are slidably installed in the corresponding frame, and the other end of the two sets of buffer springs is fixedly installed on the inner wall of one side of the corresponding frame.

[0009] Preferably, a second motor is fixedly installed on the top of the frame, and the turntable is fixedly installed on the output end of the second motor.

[0010] Preferably, both sets of movable plates have two sets of sliding holes inside, and the two sets of guide rods are adapted to the corresponding sliding holes.

[0011] Preferably, the transmission gear meshes with the sector gear.

[0012] In this utility model, a semiconductor production testing mechanism is provided, which drives a sector gear to rotate by a motor. Because the sector gear meshes with the transmission gear, the conveyor wheel connected to the transmission gear rotates intermittently. The conveyor belt is driven between the two sets of conveyor wheels, and the conveyor belt operates intermittently to transport the semiconductor body. This ensures the coordination of testing and positioning, improves testing accuracy, is suitable for mass production on assembly lines, and balances efficiency and safety.

[0013] In this invention, a semiconductor manufacturing inspection mechanism is described. By setting an electric push rod to move the mounting plate up and down along the lifting rod, the height of the inspection camera is adjusted to meet the inspection requirements of semiconductor bodies of different thicknesses. Subsequently, the surface of the semiconductor body is photographed or scanned to obtain its appearance image. The inspection camera transmits the acquired image data to an external control system. The system analyzes and processes the image to determine whether the semiconductor body meets the production standards. This allows the same inspection equipment to adapt to semiconductor bodies of various thicknesses without the need to replace or modify the camera bracket, greatly improving the versatility and flexibility of the equipment.

[0014] This utility model has a reasonable structural design. By setting up a second motor to drive the turntable to rotate, the rotation of the turntable pulls two sets of moving plates to slide relative to each other in the guide rod through the transmission rod. Subsequently, it drives the connected frame, connecting block, push plate and other components to move relative to each other. At this time, the push plate first contacts the semiconductor body, and then the connecting block slides in the frame. The buffer spring is compressed and generates a flexible clamping force to avoid damaging the semiconductor body. At the same time, it accurately centers and positions the semiconductor body in the detection area, realizing automated and high-precision centering and positioning. Moreover, this design makes the clamping force soft and elastic, which can firmly position the workpiece and effectively avoid physical damage to the semiconductor body during the positioning process. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a testing mechanism for semiconductor production proposed in this utility model;

[0016] Figure 2 This is a cross-sectional structural diagram of a testing mechanism for semiconductor production proposed in this utility model;

[0017] Figure 3 This is a partial cross-sectional view of a testing mechanism for semiconductor production proposed in this utility model.

[0018] In the diagram: 1. Semiconductor body; 2. Testing table; 3. Support; 4. Conveyor wheel; 5. Conveyor belt; 6. Transmission gear; 7. Support plate; 8. Motor 1; 9. Frame; 10. Motor 2; 11. Guide rod; 12. Moving plate; 13. Frame; 14. Connecting block; 15. Push plate; 16. Buffer spring; 17. L-shaped column; 18. Electric push rod; 19. Mounting plate; 20. Lifting rod; 21. Testing camera; 22. Turntable; 23. Transmission rod; 24. Sector gear. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Reference Figure 1-3 A semiconductor manufacturing inspection mechanism includes: a semiconductor body 1, an inspection table 2, and an inspection camera 21. Four sets of supports 3, a frame 9, and L-shaped columns 17 are fixedly mounted on the top of the inspection table 2. Conveyor wheels 4 are rotatably mounted inside adjacent sets of supports 3, and conveyor belts 5 are driven to the outer sides of the two sets of conveyor wheels 4. The semiconductor body 1 is mounted on the conveyor belts 5. Two sets of guide rods 11 are fixedly mounted inside the frame 9, and two sets of moving plates 12 are slidably mounted on the outer sides of the two sets of guide rods 11. A transmission rod 23 is hinged to the top of each set of moving plates 12, and one end of each set of transmission rods 23 is hinged to the same turntable 22. A frame 13 is fixedly installed on one side of each plate 12. A connecting block 14 is slidably installed inside each of the two sets of frame 13. Two sets of buffer springs 16 are fixedly installed on one side of each of the two sets of connecting blocks 14. A push plate 15 is fixedly installed on the other side of each of the two sets of connecting blocks 14. A motor 20 is fixedly installed on the top of the frame 9. A turntable 22 is fixedly installed on the output end of the motor 20. A transmission rod 23 is hinged between the turntable 22 and the top of each of the two sets of moving plates 12. An electric push rod 18 is fixedly installed on the top of the L-shaped column 17. A mounting plate 19 is fixedly installed on the output of the electric push rod 18. A detection camera 21 is located at the bottom of the mounting plate 19.

[0021] In this embodiment, a support plate 7 is fixedly installed on the top of the testing station 2, a motor 8 is fixedly installed on one side of the support plate 7, a sector gear 24 is fixedly installed on the output end of the motor 8, a transmission gear 6 is fixedly installed on one side of a set of conveyor wheels 4, and two sets of lifting rods 20 are provided between the top of the mounting plate 19 and the bottom of the L-shaped column 17 to realize the orderly conveying of the semiconductor body 1 and adapt to the batch testing requirements of the production line.

[0022] In this embodiment, two sets of connecting blocks 14 are slidably installed in the corresponding frame 13, and the other end of two sets of buffer springs 16 is fixedly installed on the inner wall of one side of the corresponding frame 13 to avoid scratches on the surface of the semiconductor body 1 or damage to the internal structure due to rigid clamping, which is especially suitable for fragile semiconductor components.

[0023] In this embodiment, a second motor 10 is fixedly installed on the top of the frame 9, and a turntable 22 is fixedly installed on the output end of the second motor 10 to avoid product offset caused by asynchronous positioning on both sides.

[0024] In this embodiment, each of the two sets of movable plates 12 has two sets of sliding holes inside. The two sets of guide rods 11 are matched with the corresponding sliding holes to prevent them from tilting or shifting during movement, ensuring that the push plate 15 can move smoothly in a straight line and improving positioning accuracy.

[0025] In this embodiment, the transmission gear 6 meshes with the sector gear 24, which can precisely control the dwell time of the semiconductor body 1 in the detection area, ensuring that the positioning and detection process is fully performed.

[0026] In this embodiment, during use, the operator places the semiconductor body 1 on the conveyor belt 5, and then starts the motor 8 on one side of the support plate 7 to drive the sector gear 24 to rotate. Since the sector gear 24 meshes with the transmission gear 6, the conveyor wheel 4 connected to the transmission gear 6 is driven to rotate intermittently, and the conveyor belt 5 is driven between the two sets of conveyor wheels 4, so the conveyor belt 5 operates intermittently and transports the semiconductor body 1.

[0027] When the semiconductor body 1 is transported into the frame 9, the motor 2 10 starts and drives the turntable 22 to rotate. Then, through the transmission rod 23, the two sets of moving plates 12 slide relative to each other in the guide rod 11. Then, the frame 13, connecting block 14, push plate 15 and other components connected to it move relative to each other. At this time, the push plate 15 contacts the semiconductor body 1 first, and then the connecting block 14 slides in the frame 13. The buffer spring 16 is compressed to generate a flexible clamping force to avoid damaging the semiconductor body 1, and at the same time, it is accurately centered and positioned in the detection area.

[0028] When the semiconductor body 1 is transported into the L-shaped column 17, the electric push rod 18 is activated to push the mounting plate 19 to move up and down along the lifting rod 20, adjusting the height of the detection camera 21 to meet the detection requirements of semiconductor bodies 1 of different thicknesses; then the surface of the semiconductor body 1 is photographed or scanned to obtain its appearance image, and the detection camera 21 transmits the acquired image data to the external control system, which analyzes and processes the image to determine whether the semiconductor body 1 meets the production standards.

[0029] The above provides a detailed description of a semiconductor manufacturing testing mechanism provided by this utility model. Specific embodiments have been used to illustrate the principles and implementation methods of this utility model. The descriptions of these embodiments are merely for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. A testing mechanism for semiconductor manufacturing, characterized in that, include: The semiconductor body (1), the testing stage (2), and the testing camera (21) are provided. The testing stage (2) has four sets of brackets (3), a frame (9), and an L-shaped column (17) fixedly installed on its top. Each of the two adjacent sets of brackets (3) has a conveyor wheel (4) rotatably mounted inside. A conveyor belt (5) is driven onto the outer side of each of the two sets of conveyor wheels (4). The semiconductor body (1) is mounted on the conveyor belt (5). Two sets of guide rods (11) are fixedly installed inside the frame (9). Two sets of moving plates (12) are slidably mounted on the outer side of each of the two sets of guide rods (11). A transmission rod (23) is hinged to the top of each of the two sets of moving plates (12). One end of each of the two sets of transmission rods (23) is hinged to the same turntable (22). One side of each of the two sets of moving plates (12) has... A frame (13) is fixedly installed. Connecting blocks (14) are slidably installed inside both sets of the frame (13). Two sets of buffer springs (16) are fixedly installed on one side of each set of the connecting blocks (14). Push plates (15) are fixedly installed on the other side of each set of the connecting blocks (14). A second motor (10) is fixedly installed on the top of the frame (9). A turntable (22) is fixedly installed on the output end of the second motor (10). A transmission rod (23) is hinged between the turntable (22) and the top of each of the two sets of moving plates (12). An electric push rod (18) is fixedly installed on the top of the L-shaped column (17). An installation plate (19) is fixedly installed on the output of the electric push rod (18). The detection camera (21) is located at the bottom of the installation plate (19).

2. The semiconductor manufacturing testing mechanism according to claim 1, characterized in that, A support plate (7) is fixedly installed on the top of the testing platform (2). A motor (8) is fixedly installed on one side of the support plate (7). A sector gear (24) is fixedly installed on the output end of the motor (8). A transmission gear (6) is fixedly installed on one side of one set of the conveying wheels (4). Two sets of lifting rods (20) are provided between the top of the mounting plate (19) and the bottom of the L-shaped column (17).

3. The semiconductor manufacturing testing mechanism according to claim 1, characterized in that, The two sets of connecting blocks (14) are slidably installed in the corresponding frame (13), and the other end of the two sets of buffer springs (16) is fixedly installed on the inner wall of one side of the corresponding frame (13).

4. The semiconductor manufacturing testing mechanism according to claim 1, characterized in that, The top of the frame (9) is fixedly installed with motor 2 (10), and the turntable (22) is fixedly installed on the output end of motor 2 (10).

5. A testing mechanism for semiconductor manufacturing according to claim 1, characterized in that, Both sets of movable plates (12) have two sets of sliding holes inside, and the two sets of guide rods (11) are adapted to the corresponding sliding holes.

6. A testing mechanism for semiconductor manufacturing according to claim 2, characterized in that, The transmission gear (6) meshes with the sector gear (24).

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