A weight detection device and preparation equipment

Abstract

This application provides a weight detection device and fabrication equipment, relating to the field of semiconductor technology. The device includes a stage on which a wafer to be tested is placed. A weight detection component and a lifting mechanism are disposed within the stage. The weight detection component is mounted on the lifting mechanism, which drives the weight detection component to move up and down to detect the weight of the wafer. The device also includes a control component connected to the weight detection component. The control component contains preset weight data. Based on the measured weight and the preset weight, it detects whether the edge of the wafer to be tested has been trimmed. When the accuracy of the edge trimming of the wafer to be tested is high, the edge integrity of the wafer is good, without defects such as gaps, and the wafer to be tested is a complete structure with the required preset weight. Conversely, if the wafer to be tested cannot be a complete structure, affecting the weight of the wafer, it is determined that the edge of the wafer to be tested does not meet the requirements, thus completing the edge detection of the wafer to be tested.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, specifically to a weight detection device and a preparation apparatus. Background Technology

[0002] Some semiconductor processes require trimming and finishing the wafer edges, which involves removing steps of fixed depth and width from the wafer edges to create a flush, circular surface. In current processes, the trimming of the wafer edges is inspected using a measurement stage to determine if there are any anomalies such as gaps on the wafer edges after the steps have been removed.

[0003] One method is to use an external measurement platform for testing. However, this increases the platform cost, and due to cost considerations, external measurement platforms have lower hardware configurations, resulting in lower accuracy and a higher frequency of false alarms. Therefore, they can only be used as a rough judgment standard. Alternatively, a non-external measurement platform can be used. This method requires wafer testing according to certain rules, leading to lower timeliness. In practice, sampling is often used, and the accuracy is also lower when the platform is unstable. Utility Model Content

[0004] The purpose of this application is to provide a weight detection device and preparation equipment that can improve the accuracy and efficiency of detection, and has a simple structure and low cost.

[0005] One aspect of this application provides a weight detection device, including a stage for placing a wafer to be tested on the stage, a weight detection component and a lifting mechanism disposed within the stage, the weight detection component being disposed on the lifting mechanism, and the lifting mechanism being used to drive the weight detection component to move up and down to detect the weight of the wafer to be tested; further including a control component connected to the weight detection component, the control component being configured with preset weight data, and detecting whether the edge of the wafer to be tested has been trimmed based on the measured weight and the preset weight.

[0006] Optionally, the lifting mechanism includes a telescopic cylinder and a carrier plate connected to the telescopic cylinder, the weight detection component is located on the carrier plate, and the telescopic cylinder is positioned toward the wafer to be tested.

[0007] Optionally, a receiving cavity is formed within the stage, and both the lifting mechanism and the weight detection component are located within the receiving cavity. The receiving cavity forms an opening facing the wafer to be tested, and the lifting mechanism drives the weight detection component to move up and down through the opening.

[0008] Optionally, the lifting mechanism lowers the weight detection component into the accommodating cavity. When the surface of the weight detection component is lower than the end face of the accommodating cavity opening of the stage, the wafer under test contacts the stage.

[0009] Optionally, the lifting mechanism raises the weight detection component to outside the accommodating cavity, and when the surface of the weight detection component is higher than the end face of the accommodating cavity opening of the stage, the wafer under test contacts the weight detection component.

[0010] Optionally, the weight detection component includes a weighing platform, a weighing sensor is disposed inside the weighing platform, and the weighing platform carries the wafer to be tested.

[0011] Optionally, a rotation mechanism is also connected to the side of the stage away from the wafer under test. The rotation mechanism is connected to the control component and drives the stage to rotate to confirm the positioning point of the wafer under test on the stage.

[0012] Optionally, the rotating mechanism includes a rotary motor and a rotary table connected to the rotary motor, with the platform located on the rotary table.

[0013] In another aspect of this application, a fabrication apparatus is provided, comprising: the aforementioned weight detection device, and further comprising a notch detection device and a trimming device disposed on one side of the weight detection device, wherein the notch detection device and the trimming device are respectively connected to the control component; the trimming device is used to trim the edge of the wafer to be tested, the notch detection device detects notches on the edge of the wafer to be tested, and then the weight of the wafer to be tested is detected by the weight detection device.

[0014] Optionally, the device also includes a robotic arm disposed on one side of the weight detection device, the robotic arm being connected to the control component, and the robotic arm being used to transfer the wafer to be tested between the weight detection device, the trimming device, and the notch detection device.

[0015] The weight detection device provided in this application measure the weight of the wafer under test using a weight detection component. A control component compares the measured weight with a preset weight stored within it, enabling edge detection of the wafer. When the accuracy of edge step trimming on the wafer is high, the wafer's edge integrity is good, with no defects such as gaps, indicating a complete structure with the required preset weight. Conversely, when the accuracy of edge step trimming is low, the wafer's edge integrity does not meet requirements, with defects such as gaps, preventing it from forming a complete structure and affecting its weight. Therefore, it can be determined that the wafer's edge does not meet the requirements, thus completing the edge detection of the wafer. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is one of the structural schematic diagrams of the weight detection device provided in the embodiments of this application; Figure 2 This is the second schematic diagram of the weight detection device provided in the embodiments of this application; Figure 3 This is a schematic diagram of the preparation equipment provided in the embodiments of this application; Figure 4 This is a flowchart of the wafer cleaning process transmission loop with weighing technology provided in an embodiment of this application.

[0018] Icons: 10-Stage; 101-Cavity; 11-Rotation mechanism; 12-Weight detection component; 13-Lifting mechanism; 131-Telescopic cylinder; 132-Carrier plate; 20-Wafer to be tested; 30-Notch detection device; 40-Loading port; 41-Robot; 42-Chuck stage; 43-Cleaning station; 44-Rotation stage. Detailed Implementation

[0019] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0020] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] It should also be noted that, unless otherwise explicitly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] Please refer to Figure 1 As shown, this application embodiment provides a weight detection device, including: a stage 10 for supporting a wafer 20 to be tested, a weight detection component 12 disposed in the stage 10, the weight detection component 12 being used to measure the weight of the wafer 20 to be tested, and a control component connected to the weight detection component 12, the control component being configured with preset weight data, and detecting whether the edge of the wafer 20 to be tested has been trimmed based on the measured weight and the preset weight.

[0023] The stage 10 carries the wafer 20 to be tested. For example, the stage 10 is a cylindrical stage with a certain thickness. A receiving cavity 101 is provided in the thickness direction of the stage 10 to accommodate the weight detection component 12. The weight detection component 12 in the stage 10 is used to measure the weight of the wafer 20 to be tested. When applied to the edge step trimming process of the wafer 20 to be tested, after the steps on the edge of the wafer 20 to be tested are trimmed and the edge is trimmed, the edge of the wafer 20 to be tested should not have defects such as gaps. When there are gaps in the wafer 20 to be tested after trimming the steps on its edge, it indicates that the trimmed weight is unqualified. At this time, when the weight detection component 12 is used to weigh the wafer 20 to be tested, since there are gaps on the edge of the wafer 20 to be tested, there is a difference in weight compared with the complete wafer 20 to be tested. Therefore, it can be determined whether the weight of the wafer 20 to be tested is qualified, and thus whether the edge of the wafer 20 to be tested meets the requirements.

[0024] The complete weight of the wafer 20 to be tested can be used as a preset weight and stored in the control component in advance; the weight detection component 12 feeds back the weight data obtained by weighing the wafer 20 to the control component. By comparing the measured weight with the preset weight, the control component can determine whether the weight of the wafer 20 to be tested is qualified and whether the edge of the wafer 20 to be tested meets the requirements.

[0025] In some embodiments, the weight detection component 12 includes a weighing platform with a weighing sensor inside. The weighing sensor is used to collect the weight data of the wafer 20 to be tested. The weighing platform is used to support the wafer 20 to be tested. The weighing sensor is connected to a control component and can feed back the weight obtained from the weighing to the control component, so that the control component can compare it with a preset weight. When the control component is set, automated data transmission and control can be realized. The control component automatically controls the lifting mechanism 13 to lift and lower. When the lifting mechanism 13 drives the weighing sensor to push out the wafer 20 to be tested, separating the wafer 20 from the platform 10, the weighing sensor feeds back the weight of the wafer 20 to the control component. The control component can compare it with the preset weight of the wafer 20 to determine whether the wafer 20 to be tested is a complete structure and whether its edges meet the requirements. Weighing with a weighing sensor is a common weighing method, so the structure of the weighing sensor will not be described in detail here.

[0026] Of course, the weight detection component 12 of this application weighs the wafer 20 under test. In addition to the edge step trimming process of the wafer 20 under test mentioned above, it can also be applied to other preparation processes of the wafer 20 under test. The control component obtains the weight of the wafer 20 under test before and after the process, and compares the weight change of the wafer 20 under test before and after the process in order to detect the relevant parameters of the wafer 20 under test.

[0027] The stage 10 is also equipped with a lifting mechanism 13, and the weight detection component 12 is mounted on the lifting mechanism 13. The lifting mechanism 13 drives the weight detection component 12 to lift the wafer 20 to be tested on the stage 10 and separate it from the stage 10, so that the weight detection component 12 contacts the wafer 20 to be tested and detects the weight of the wafer 20 to be tested.

[0028] The lifting mechanism 13 is placed inside the receiving cavity 101 of the platform 10, and the weight detection component 12 is located on the lifting mechanism 13. The lifting mechanism 13 can drive the weight detection component 12 to move up and down. Figure 1 , Figure 2 As can be seen, the wafer under test 20 is located on the stage 10 and in contact with the upper surface of the stage 10. The stage 10 is used to support the wafer under test 20. When the wafer under test 20 needs to be weighed, in order to ensure the accuracy of the weighing, the wafer under test 20 needs to be removed from the stage 10. At this time, the lifting mechanism 13 drives the weight detection component 12 to rise. The weight detection component 12 lifts the wafer under test 20, so that the wafer under test 20 is separated from the stage 10. The weight of the wafer under test 20 is completely pressed on the weight detection component 12, and the weight detection component 12 weighs the wafer under test 20.

[0029] In some embodiments, the lifting mechanism 13 includes a telescopic cylinder 131 and a carrier plate 132 connected to the telescopic cylinder 131. The weight detection component 12 is located on the carrier plate 132, and the carrier plate 132 carries the weight detection component 12. The telescopic cylinder 131 is arranged in the direction of the wafer 20 to be tested. By telescopically extending and retracting the telescopic cylinder 131, the weight detection component 12 is lifted to measure the wafer 20 to be tested.

[0030] Therefore, the weight detection device provided in this application embodiment measures the weight of the wafer 20 under test through the weight detection component 12 and compares it with a preset weight to detect the edge of the wafer 20 under test. When the accuracy of the edge step trimming of the wafer 20 under test is high, the edge integrity of the wafer 20 under test is good, without defects such as gaps, and thus the wafer 20 under test is a complete structure with the required weight. When the accuracy of the edge step trimming of the wafer 20 under test is low, the edge integrity of the wafer 20 under test does not meet the requirements, and its edge has defects such as gaps, making the wafer 20 under test unable to be a complete structure, thus affecting the weight of the wafer 20 under test. Therefore, it can be determined that the edge of the wafer 20 under test does not meet the requirements, and the edge detection of the wafer 20 under test is completed.

[0031] Specifically, such as Figure 1 As shown, a cavity is formed inside the stage 10. The cavity 101 is a hollow cavity formed inside the stage 10. The lifting mechanism 13 and the weight detection component 12 are both located inside the cavity. The cavity also forms an opening on the stage 10. The opening faces the wafer 20 to be tested. The lifting mechanism 13 drives the weight detection component 12 to move up and down through the opening.

[0032] The accommodating cavity of the platform 10 contains a lifting mechanism 13 and a weight detection component 12 located above the lifting mechanism 13. The accommodating cavity forms an opening, which allows the lifting mechanism 13 to drive the weight detection component 12 to move up and down from the opening.

[0033] Figure 1 In the process, when the wafer 20 under test is subjected to surface inspection, the lifting mechanism 13 drives the weight detection component 12 to descend into the accommodating cavity. When the surface of the weight detection component 12 is lower than the surface of the stage 10 that carries the wafer 20 under test, that is, the end face of the cavity opening of the accommodating cavity 101 of the stage 10, the wafer 20 under test and the stage 10 are in contact.

[0034] After the edge trimming process is completed, the wafer under test 20 is transferred to the stage 10 for surface inspection to observe whether there are defects such as gaps on the surface of the wafer under test 20. At this time, the lifting mechanism 13 drives the weight detection component 12 to retract into the accommodating cavity, so that the surface of the wafer under test 20 contacts the stage 10, and the stage 10 supports the wafer under test 20.

[0035] Figure 2In the process of weighing the wafer 20 under test, the lifting mechanism 13 drives the weight detection component 12 to rise outside the accommodating cavity. The surface of the weight detection component 12 is higher than the surface of the stage 10 that carries the wafer 20 under test, so that the wafer 20 under test and the stage 10 are separated and the wafer 20 under test comes into contact with the weight detection component 12.

[0036] When weighing the wafer 20 under test, to ensure weighing accuracy, the lifting mechanism 13 raises the weight detection component 12 to extend it outside the receiving cavity. At this time, the wafer 20 under test and the stage 10 separate, and the weight detection component 12 takes over the function of supporting the wafer 20 under test and weighing it. Since the wafer 20 under test is separated from the stage 10, the weight data obtained by the weight detection component 12 when weighing the wafer 20 under test is accurate and can reflect the true weight of the wafer 20 under test at this time.

[0037] Based on this, this application utilizes the existing platform 10 to place the weight detection component 12 within the existing platform 10, eliminating the need for an additional platform 10 for the weight detection component 12 and thus avoiding additional space occupation.

[0038] For example, the stage 10 of this application is a positioning stage. A rotation mechanism 11 is also connected to the side of the stage 10 away from the wafer 20 to be tested. The rotation mechanism 11 drives the stage 10 to rotate. The rotation mechanism 11 drives the stage 10 to rotate in order to confirm the positioning point of the wafer 20 to be tested on the stage 10 and prepare for the next process step.

[0039] The rotation mechanism 11 includes a rotary motor and a rotary table connected to the rotary motor, with the stage 10 located on the rotary table. The rotary motor drives the stage 10 and the wafer 20 under test to rotate.

[0040] The stage 10 of this application can be used to confirm the positioning point of the wafer 20 under test. The stage 10 is rotated by the rotating mechanism 11, and the wafer 20 under test is rotated accordingly to determine the positioning point of the wafer 20 under test. The next fabrication process of the wafer 20 under test is completed according to the positioning point. This is prior art and will not be described in detail.

[0041] This application utilizes the existing positioning stage 10 and integrates the weight detection component 12, thereby improving the integration of the stage 10, reducing the space occupied by the stage 10, and facilitating the control of process costs.

[0042] Similarly, to improve automation, the aforementioned control components can also be connected to the rotating mechanism 11, thereby enabling the control components to coordinate the operation of the rotating mechanism 11, the lifting mechanism 13, and the weight detection component 12.

[0043] On the other hand, refer to Figure 3As shown in the embodiments of this application, a fabrication apparatus is also disclosed, including a weight detection device as described above, and a notch detection device 30 and a trimming device disposed on one side of the weight detection device. The trimming device is used to trim the edge of the wafer 20 to be tested, the notch detection device 30 detects notches on the edge of the wafer 20 to be tested, and then the weight of the wafer 20 to be tested is detected by the weight detection device.

[0044] During preparation, the edge steps of the wafer 20 to be tested are first trimmed by a trimming device. After trimming, the weight detection device and the notch detection device 30 work together. After the complete edge of the wafer 20 to be tested is trimmed, the notch detection device 30 is used to detect the edge notch of the wafer 20 to be tested. For example, the notch detection device 30 can be a notch detection sensor. It determines whether there is a notch by sensing light passing through the notch. The specific detection is based on the prior art and will not be described here.

[0045] The wafer 20 to be tested is then weighed using a weight detection device to determine the weight change of the wafer 20 to be tested, and then to further determine whether the edge of the wafer 20 to be tested meets the requirements.

[0046] Furthermore, it also includes a robotic arm, which is positioned on one side of the weight detection device and is used to transfer the wafer 20 to be tested between the weight detection device, the trimming device, and the notch detection device 30.

[0047] After the edge steps of the wafer 20 to be tested are trimmed, the wafer 20 to be tested can be transferred to the notch detection device 30 by a robotic arm for notch detection, and then the weight detection device will detect the weight of the wafer 20 to be tested.

[0048] In the example of this application, the stage 10 of the notch detection device 30 and the stage 10 of the weight detection device are shared to reduce the space occupied by the equipment and reduce the manufacturing cost.

[0049] Furthermore, the aforementioned weight detection device, trimming device, notch detection device 30, and robotic arm are all connected to a control component, which can control the process sequence of the aforementioned devices to perform automatic operation, thereby achieving automated production.

[0050] The weight detection device of this application can be integrated into the corresponding process flow, such as the notch detection process, without adding extra wafer fabrication process and process chain, and can also realize real-time detection of wafer weight, timely detection of abnormalities, and reduction of wafer scrap rate.

[0051] For example, when the weight detection device of this application is integrated into the wafer cleaning process, Figure 4The diagram shows a wafer cleaning process transfer loop with a weighing process: the wafer enters the process flow directly from the loading port 40, or is transferred into the process flow by the robot 41, and is weighed on the stage 10 to detect whether the wafer edge has been trimmed; the qualified wafer is then transferred to the chuck stage 42, and the back side of the wafer is cleaned at the cleaning station 43. During cleaning, the wafer is rotated by the rotary table 44 to make the cleaning solution evenly cover the wafer, achieving efficient wafer cleaning. Finally, after cleaning, the wafer is transferred by the robot 41.

[0052] During this process, wafers that fail to meet the weight requirements can be returned from stage 10 to robot 41 for reprocessing to the defective product station. Robot 41 can also rotate the wafer from stage 10 back to loading port 40, allowing the wafer to re-enter the process flow from loading port 40 to complete subsequent processes.

[0053] In addition, the robotic arm, trimming device, and notch detection device 30 are all connected to the control component, which controls the above steps in a unified manner to achieve an automated preparation process and improve preparation efficiency.

[0054] This preparation apparatus has the same structure and beneficial effects as the weight detection device in the foregoing embodiments. The structure and beneficial effects of the weight detection device have been described in detail in the foregoing embodiments and will not be repeated here.

[0055] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A weight detection device, characterized in that, include: A stage is provided for placing a wafer to be tested. The stage is equipped with a weight detection component and a lifting mechanism. The weight detection component is mounted on the lifting mechanism, which drives the weight detection component to move up and down to detect the weight of the wafer to be tested. The stage also includes a control component connected to the weight detection component. The control component is equipped with preset weight data and detects whether the edge of the wafer to be tested has been trimmed based on the measured weight and the preset weight.

2. The weight detection device according to claim 1, characterized in that, The lifting mechanism includes a telescopic cylinder and a carrier plate connected to the telescopic cylinder. The weight detection component is located on the carrier plate, and the telescopic cylinder is positioned toward the wafer to be tested.

3. The weight detection device according to claim 1, characterized in that, A cavity is formed within the stage, and both the lifting mechanism and the weight detection component are located within the cavity. The cavity forms an opening facing the wafer to be tested, and the lifting mechanism drives the weight detection component to move up and down through the opening.

4. The weight detection device according to claim 3, characterized in that, The lifting mechanism lowers the weight detection component into the accommodating cavity. When the surface of the weight detection component is lower than the end face of the accommodating cavity opening of the stage, the wafer under test contacts the stage.

5. The weight detection device according to claim 3, characterized in that, The lifting mechanism raises the weight detection component to outside the accommodating cavity. When the surface of the weight detection component is higher than the end face of the accommodating cavity opening of the stage, the wafer under test comes into contact with the weight detection component.

6. The weight detection device according to any one of claims 1 to 5, characterized in that, The weight detection component includes a weighing platform, a weighing sensor is installed inside the weighing platform, and the weighing platform carries the wafer to be tested.

7. The weight detection device according to claim 6, characterized in that, A rotation mechanism is also connected to the side of the stage away from the wafer under test. The rotation mechanism is connected to the control component and drives the stage to rotate in order to confirm the positioning point of the wafer under test on the stage.

8. The weight detection device according to claim 7, characterized in that, The rotating mechanism includes a rotary motor and a rotary table connected to the rotary motor, with the platform located on the rotary table.

9. A preparation apparatus, characterized in that, The weight detection device according to any one of claims 1 to 8 further includes a notch detection device and a trimming device disposed on one side of the weight detection device, wherein the notch detection device and the trimming device are respectively connected to the control component; the trimming device is used to trim the edge of the wafer to be tested, the notch detection device detects notches on the edge of the wafer to be tested, and then the weight detection device detects the weight of the wafer to be tested.

10. The preparation apparatus according to claim 9, characterized in that, It also includes a robotic arm disposed on one side of the weight detection device, the robotic arm being connected to the control component, the robotic arm being used to transfer the wafer to be tested between the weight detection device, the trimming device and the notch detection device.

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