Integrated circuit ceramic glass four-side parallel precision lead

Abstract

This utility model discloses a precision ceramic-glass four-sided parallel lead for integrated circuits, including a main frame. Multiple pins are fixedly connected to each of the four sides of the main frame, and each pin is equipped with a stabilizing and protective mechanism. The main frame and the stabilizing and protective mechanisms are equipped with positioning mechanisms. The stabilizing and protective mechanism includes an outer frame, and multiple first and second stabilizing frames are provided on the pins. This belongs to the field of lead frame technology. This precision ceramic-glass four-sided parallel lead for integrated circuits connects the outer frame to the outer ends of the pins on the four sides. The first and second stabilizing frames can connect and fix adjacent pins. Furthermore, the first and second reinforcing rods enhance the deformation resistance of the first stabilizing frame, and the third and fourth reinforcing rods enhance the deformation resistance of the second stabilizing frame. This provides excellent stable support for the pins, prevents pin deformation under stress, and improves the protection effect on the pins.

Description

Technical Field

[0001] This utility model relates to the field of lead frame technology, specifically to a precision lead wire for four parallel sides of ceramic glass for integrated circuits. Background Technology

[0002] As a chip carrier for integrated circuits, the leadframe is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit leads of the chip and the external leads, forming an electrical circuit. It acts as a bridge connecting to external wires. Most semiconductor integrated circuits require the use of leadframes, making it an important basic material in the electronics and information industry. CQFP packaging uses a two-stage dry-pressing ceramic sheet and glass welding process. The leadframe is embedded into a softened glass layer by heating to achieve mechanical fixation, ultimately sealing the chip connection. In existing technologies, the pins on the leadframe are relatively small, which makes the pins prone to deformation under stress, resulting in insufficient protection for the pins.

[0003] For example, patent publication number CN222507628U specifically relates to lead frames, specifically the field of lead frame technology. It includes a wafer base and multiple pins, each pin located on the side of the wafer base. The bottom surface of the pins has pre-cut grooves for cutting the pins at these grooves during separation and dicing after packaging. During the packaging process using this lead frame, an electroplating process forms an electroplating layer on the pin surface, including the pre-cut grooves. When separating and dicing after packaging, the pins are cut at the pre-cut grooves. The cut surface of the pins is small, and the sidewalls of the pre-cut grooves have an electroplating layer, which facilitates stable solder creep during SMT, resulting in higher solder reliability. However, the pins on this lead frame are relatively small, making the lead frame susceptible to deformation under stress, leading to insufficient protection for the pins. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a precision ceramic glass four-sided parallel lead wire for integrated circuits. This solves the problem that the leads on the lead frame are relatively small, which makes the lead frame prone to deformation under stress, resulting in insufficient protection for the leads.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: a precision lead wire for four parallel sides of an integrated circuit ceramic glass, including a main frame, on which multiple pins are fixedly connected on all four sides, and a stabilizing and protective mechanism is provided on the multiple pins; a positioning mechanism is provided on the main frame and the stabilizing and protective mechanism. The stabilization and protection mechanism includes an outer frame, and multiple first and second stabilizing frames are provided on multiple pins; The first stabilizer is internally fixedly connected to a first reinforcing rod and a second reinforcing rod, and a first triangular stabilizing region is formed between the two ends of the first and second reinforcing rods and the first stabilizer. The second stabilizer is internally fixedly connected with a third reinforcing rod and a fourth reinforcing rod, and the two ends of the third reinforcing rod and the fourth reinforcing rod form a second triangular stabilizing zone with the second stabilizer.

[0006] Preferably, the first stabilizer and the second stabilizer are respectively mounted on the pins on the four sides of the main frame, which can stabilize the pins.

[0007] Preferably, the first or second stabilizer is fixedly connected between each pair of pins, so that the first and second stabilizers can provide stable support for the pins.

[0008] Preferably, the cross-sectional shape of the first stabilizer and the second stabilizer is U-shaped, and the first stabilizer and the second stabilizer are disposed on the pins near the outer frame, so that they can be removed together with the outer frame after packaging.

[0009] Preferably, the first reinforcing rod and the second reinforcing rod are arranged in an intersecting manner, and the third reinforcing rod and the fourth reinforcing rod are arranged in an intersecting manner, so that the first stabilizer and the second stabilizer can be more stable.

[0010] Preferably, the bottom of the main frame is provided with a glass insulation layer, which is bonded to the main frame by low-temperature sintering and can play a supporting role.

[0011] Preferably, the positioning mechanism includes multiple laser alignment marks, which are respectively disposed at the four corners of the outer frame. The positioning mechanism also includes multiple first auxiliary positioning holes and second auxiliary positioning holes, which are respectively disposed at the center of the four sides of the main frame, thereby enhancing the positioning effect.

[0012] This invention provides a precision lead wire for four parallel sides of ceramic glass used in integrated circuits. Compared with the prior art, it has the following advantages: 1. The integrated circuit features four parallel precision leads on ceramic glass, which are connected to the outer ends of the pins on the four sides via an outer frame. The first and second stabilizers can connect and fix two adjacent pins. The first and second reinforcing rods enhance the deformation resistance of the first stabilizer, while the third and fourth reinforcing rods enhance the deformation resistance of the second stabilizer. This provides excellent stability support for the pins, prevents pin deformation under stress, and improves the protection of the pins.

[0013] 2. The integrated circuit features parallel precision leads on all four sides of the ceramic glass. Laser alignment marks at the four corners improve positioning accuracy and meet packaging requirements. The first and second auxiliary positioning holes in the center of the four sides are used for positioning, which enhances the overall positioning effect. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the stabilizing and protective mechanism of this utility model; Figure 3 This is a schematic diagram of the first and second stabilizers of this utility model; Figure 4 This is a schematic diagram of the positioning mechanism of this utility model.

[0015] In the diagram: 1. Main frame; 2. Stabilizing and protective mechanism; 201. Outer frame; 202. First stabilizer; 203. Second stabilizer; 204. First reinforcing rod; 205. Second reinforcing rod; 206. First triangular stabilizing area; 207. Third reinforcing rod; 208. Fourth reinforcing rod; 209. Second triangular stabilizing area; 3. Pin; 4. Positioning mechanism; 401. Laser alignment mark; 402. First auxiliary positioning hole; 403. Second auxiliary positioning hole. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figures 1-3This utility model provides a technical solution: a precision ceramic glass four-sided parallel lead for an integrated circuit, including a main frame 1. The main frame 1 is made of Kova alloy or copper-tungsten alloy with a coefficient of thermal expansion matching that of the ceramic shell, which can reduce thermal stress. A glass insulating layer is provided at the bottom of the main frame 1. The glass insulating layer is bonded to the main frame 1 by low-temperature sintering, which can provide support. Multiple pins 3 are fixedly connected to the four sides of the main frame 1. The precision pins 3 are arranged at equal intervals and in equal numbers on the four sides to achieve a symmetrical layout. Alternatively, the number of pins 3 can be unequal to meet functional requirements. A stabilizing and protective mechanism 2 is provided on the multiple pins 3. A positioning mechanism 4 is provided on the main frame 1 and the stabilizing and protective mechanism 2. The stabilizing and protective mechanism 2 can provide good stabilizing support for the pins 3 and can be cut off after packaging to prevent the pins 3 from deforming under force and improve the protection effect of the pins 3.

[0018] The stabilizing and protective mechanism 2 includes an outer frame 201, which is connected to the outer end of the pin 3 via a breakable connecting rib for easy removal. Multiple first stabilizers 202 and second stabilizers 203 are provided on multiple pins 3. The multiple first stabilizers 202 and multiple second stabilizers 203 are respectively installed on multiple pins 3 on the four sides of the main frame 1, which can stabilize the pins 3. The aforementioned first stabilizer 202 or second stabilizer 203 is fixedly connected between every two pins 3, so that the first stabilizer 202 and second stabilizer 203 can provide stable support for the pins 3. The cross-sectional shape of the first stabilizer 202 and second stabilizer 203 is set to U-shape, and the first stabilizer 202 and second stabilizer 203 are located on the pins 3 near the outer frame 201, so that they can be removed together with the outer frame 201 after encapsulation.

[0019] The first stabilizer 202 has a first reinforcing rod 204 and a second reinforcing rod 205 fixedly connected inside. The first reinforcing rod 204 and the second reinforcing rod 205 form a first triangular stabilizing area 206 between their ends and the first stabilizer 202. The second stabilizer 203 has a third reinforcing rod 207 and a fourth reinforcing rod 208 fixedly connected inside. The third reinforcing rod 207 and the fourth reinforcing rod 208 form a second triangular stabilizing area 209 between their ends and the second stabilizer 203. The first reinforcing rod 204 and the second reinforcing rod 205 are arranged intersectingly, and the third reinforcing rod 207 and the fourth reinforcing rod 208 are arranged intersectingly, so that the first stabilizer 202 and the second stabilizer 203 can be more stable.

[0020] Please see Figure 1 and Figure 4The positioning mechanism 4 includes multiple laser alignment marks 401, which are respectively set at the four corners of the outer frame 201. The positioning mechanism 4 also includes multiple first auxiliary positioning holes 402 and second auxiliary positioning holes 403, which are respectively set at the center of the four sides of the main frame 1. The positioning accuracy can be improved by using the laser alignment marks 401 at the four corners to meet the packaging requirements, and the positioning can be performed by using the first auxiliary positioning holes 402 and second auxiliary positioning holes 403 at the center of the four sides. The overall positioning mechanism can enhance the positioning effect.

[0021] During operation, the outer frame 201 is connected to the outer end of the pin 3 via a fracture-resistant connecting rib. The outer frame 201 connects to the outer ends of the four pins 3. Furthermore, a first stabilizer 202 or a second stabilizer 203 is fixedly connected between the outer ends of every two pins 3. The first stabilizer 202 and the second stabilizer 203 are U-shaped, which can connect and fix two adjacent pins 3. The first reinforcing rod 204 and the second reinforcing rod 205 arranged crosswise inside the first stabilizer 202 form two first triangular stabilizing regions 206 with the first stabilizer 202, forming a triangular stabilizing structure, which can enhance the deformation resistance of the first stabilizer 202. Similarly, the third reinforcing rod 207 and the fourth reinforcing rod 208 arranged crosswise inside the second stabilizer 203 form two second triangular stabilizing regions 209 with the second stabilizer 203, which can enhance the deformation resistance of the second stabilizer 203. Thus, it can provide good stable support for the pins 3 and can be cut off after packaging to prevent the pins 3 from being deformed by force, thereby improving the protection effect of the pins 3.

[0022] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

Claims

1. A precision lead wire for four parallel sides of an integrated circuit ceramic glass, comprising a main frame (1), characterized in that: Multiple pins (3) are fixedly connected to the four sides of the main frame (1), and a stabilizing protection mechanism (2) is provided on the multiple pins (3). A positioning mechanism (4) is provided on the main frame (1) and the stabilizing protection mechanism (2). The stabilizing and protective mechanism (2) includes an outer frame (201), and multiple first stabilizers (202) and second stabilizers (203) are provided on multiple pins (3); The first stabilizer (202) has a first reinforcing rod (204) and a second reinforcing rod (205) fixedly connected inside. The first reinforcing rod (204) and the second reinforcing rod (205) form a first triangular stabilizing area (206) between their ends and the first stabilizer (202). The second stabilizer (203) is internally fixedly connected with a third reinforcing rod (207) and a fourth reinforcing rod (208), and the two ends of the third reinforcing rod (207) and the fourth reinforcing rod (208) form a second triangular stabilizing area (209) between them and the second stabilizer (203).

2. The integrated circuit ceramic glass four-sided parallel precision lead according to claim 1, characterized in that: Multiple first stabilizers (202) and multiple second stabilizers (203) are respectively mounted on multiple pins (3) on the four sides of the main frame (1).

3. The integrated circuit ceramic glass four-sided parallel precision lead according to claim 1, characterized in that: The first stabilizer (202) or the second stabilizer (203) described above are fixedly connected between each pair of pins (3).

4. The integrated circuit ceramic glass four-sided parallel precision lead according to claim 1, characterized in that: The cross-sectional shape of the first stabilizer (202) and the second stabilizer (203) is set to U-shape, and the first stabilizer (202) and the second stabilizer (203) are set on the pin (3) near one end of the outer frame (201).

5. The integrated circuit ceramic glass four-sided parallel precision lead according to claim 1, characterized in that: The first reinforcing rod (204) and the second reinforcing rod (205) are arranged to cross each other, and the third reinforcing rod (207) and the fourth reinforcing rod (208) are arranged to cross each other.

6. The integrated circuit ceramic glass four-sided parallel precision lead according to claim 1, characterized in that: The bottom of the main frame (1) is provided with a glass insulation layer, which is combined with the main frame (1) by low-temperature sintering.

7. The integrated circuit ceramic glass four-sided parallel precision lead according to claim 1, characterized in that: The positioning mechanism (4) includes multiple laser alignment marks (401), which are respectively set at the four corners of the outer frame (201).

8. The integrated circuit ceramic glass four-sided parallel precision lead according to claim 1, characterized in that: The positioning mechanism (4) also includes a plurality of first auxiliary positioning holes (402) and second auxiliary positioning holes (403), which are respectively located at the center of the four sides of the main frame (1).

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