Groove of the upper punch tool for die attach

Abstract

1. The name of the product of this design: Groove portion of a punch tool for chip bonding. 2. Purpose of the product of this design: The overall product where the partial design for which protection is sought is located is a punch tool for chip bonding, which is mounted on a chip bonding device and is used to peel off chips separated from semiconductor wafers. The partial design for which protection is sought is for the groove portion on the upper surface of the punch tool. 3. The key design point of this design product lies in the shape of the part shown by the solid line. 4. The picture or photo that best illustrates the key points of the design: main view. 5. Other situations that need to be explained Other explanations: The solid line part is the part that requires protection, and the dotted line part is the part that does not require protection.

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