Groove of the upper punch tool for die attach

Abstract

1. The name of the product of this design: Groove portion of a punch tool for chip bonding. 2. Purpose of the product of this design: The overall product in which the partial design for protection is located is an upper punch tool for chip bonding, which is mounted on a chip bonding device and is used to peel off chips separated from semiconductor wafers. The partial design for protection is for the groove portion on the upper surface of the upper punch tool, which has a vent for adsorbing semiconductor wafers by vacuuming. 3. The key design point of this design product lies in the shape of the part shown by the solid line. 4. The picture or photo that best illustrates the key points of the design: main view. 5. Other situations that need explanation Other explanations: The solid line portion is the portion for which protection is requested, the dotted line portion is the portion that is not for which protection is requested, and the single-point dash line is the dividing line between the portion for which protection is requested and other portions.

Images