Eutectic Bonding Machine
CN308996982SInactive Publication Date: 2024-12-10SHANGHAI TUOSHEN ELECTRONIC TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202430222934.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-19
- Publication Date
- 2024-12-10
- Estimated Expiration
- Not applicable · inactive patent
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Figure 000001_ABST
Abstract
1. The name of the product under this design: Eutectic Chip Mounter. 2. Purpose of the product with this design: A placement machine that provides heating for substrates and chips during eutectic placement and provides a nitrogen protective atmosphere and vacuum adsorption of substrates. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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