Semiconductor device packaging shell
CN309003685SActive Publication Date: 2024-12-13WUXI CHINA RESOURCES HUAJING MICROELECTRONICS
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Patent Information
- Application Number
- CN202430164040.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2039-03-27
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Figure 000007_ABST
Abstract
1. The name of the product of this design: semiconductor device package shell. 2. Purpose of this design product: used for packaging semiconductor devices and circuit board welding. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1.
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