Semiconductor Equipment Front End Module (EFEM)
CN309011944SActive Publication Date: 2024-12-17苏州盛拓半导体科技有限公司
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Patent Information
- Application Number
- CN202430315920.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2039-05-27
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Figure 000001_ABST
Abstract
1. The name of the product of this design: semiconductor equipment front-end module (EFEM). 2. Purpose of this design product: This design product is used for semiconductor lithography machine. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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