Wafer Rapid Thermal Processing Chamber
CN309136726SActive Publication Date: 2025-02-25NEW SHANGLIAN SEMICONDUCTOR EQUIPMENT (SHANGHAI) CO LTD
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Patent Information
- Application Number
- CN202430360282.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-13
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2039-06-13
Smart Images
Figure 000007_ABST
Abstract
1. The name of the product of this design: wafer rapid thermal processing chamber. 2. Purpose of this design product: This design product is used for rapid heat treatment of wafers. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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