Heat dissipation module (mainboard heat dissipation)
CN309137437SActive Publication Date: 2025-02-25SHENZHEN ERYING TECH CO LTD
Patent Information
- Application Number
- CN202430416629.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-04
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2039-07-04
Smart Images
Figure 000013_ABST
Abstract
1. The name of this design product: heat dissipation module (mainboard heat dissipation). 2. Purpose of this product with design: This product with design is used for motherboard heat dissipation. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the key points of the design: use a state diagram.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Cited By
Motherboard heat dissipation module (three)
TWD241454S
motherboard heat dissipation module (two)
TWD241455S
Motherboard heat dissipation module (one)
TWD241456S