Top heat dissipation packaging structure

CN309141488SActive Publication Date: 2025-02-28华羿微电子股份有限公司
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202430439741.4
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2024-07-15
Publication Date
2025-02-28
Estimated Expiration
2039-07-15

Smart Images

  • Figure 000007_ABST
    Figure 000007_ABST
Patent Text Reader

Abstract

1. The name of this design product: top heat dissipation packaging structure. 2. Purpose of this design product: packaging structure of power devices. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the key points of the design: Design 1 Stereoscopic drawing 1. 5. Designate Design 1 as the base design.
Need to check novelty before this filing date? Find Prior Art