Wafer mounter

CN309172706SActive Publication Date: 2025-03-14DONGGUAN JUDE WEIYE ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202430447624.2
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2024-07-17
Publication Date
2025-03-14
Estimated Expiration
2039-07-17

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Abstract

1. The name of the product of this design: wafer mounting machine. 2. The purpose of this design product: used for film bonding on wafers. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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