Laptop memory passive heat sink
CN309181441SActive Publication Date: 2025-03-18邵音子
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Patent Information
- Application Number
- CN202430444933.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2039-07-16
Smart Images
Figure 000005_ABST
Abstract
1. The name of the product of this design: Passive heat sink for notebook memory module. 2. The purpose of this design product: to be used for passive heat dissipation of memory modules in the narrow space of notebook computers. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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