Wafer yield analysis graphical user interface for electronic devices

Abstract

1. The name of the product of this design: Graphical user interface for wafer yield analysis of electronic devices. 2. Purpose of this design product: This design product is used for an electronic device. 3. The key design point of this appearance design product lies in the graphical user interface. 4. The picture or photo that best illustrates the key points of the design: Design 1 changing state diagram 2. 5. Designate Design 1 as the base design. 6. Purpose of the graphical user interface: This appearance design product is used to view wafer yield data and yield-related data; Interface interaction process: The left side of the Design 1 main view is an operation bar that supports filtering of various data dimensions, and the right side is an analysis chart of the yield data, such as a yield trend chart; Design 1 State Diagram 1: Based on the Design 1 main view, select the wafer you want to view specifically in the Design 1 main view, and jump to the Design 1 Change State Diagram 1. The Design 1 Change State Diagram 1 can display the area selected by the user; Design 1 Change State Diagram 2: End the selection in the Design 1 Change State Diagram 1 and jump to the Design 1 Change State Diagram 2. The Design 1 Change State Diagram 2 can Generate a wafer failure map for the selected wafer for correlation; the interaction method and purpose of Design 2 are similar to those of Design 1, with the only difference being that on the basis of Design 2 change state diagram 2, by "double-clicking" the wafer failure map of Design 2 change state diagram 2, you can jump to Design 2 change state diagram 3, and Design 2 change state diagram 3 can display an enlarged view of the wafer failure map; the interaction method and purpose of Design 3 are similar to those of Design 1, with the only difference being that there is a data bar above the main view of Design 1, which may include filtering information such as product information / data range, statistical information on the number of wafers under different data dimensions, statistical information on yields with different requirements, and statistical information on failure types.

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