Wafer retest analysis graphical user interface for electronic devices

CN309204811SActive Publication Date: 2025-03-28SEMITRONIX
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Patent Information

Application Number
CN202430332172.3
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2024-05-31
Publication Date
2025-03-28
Estimated Expiration
2039-05-31

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Abstract

1. The name of the product of this design: Graphical user interface for wafer retest analysis of electronic equipment. 2. Purpose of this design product: This design product is used for an electronic device. 3. The key design point of this appearance design product lies in the graphical user interface. 4. The picture or photo that best illustrates the key points of the design: Main view of Design 1. 5. Designate Design 1 as the base design. 6. Purpose of the graphical user interface: This appearance design product is used to view wafer retest data, including wafer retest conditions under different data dimensions; interface interaction process: the upper part of the main view of Design 1 is the wafer failure type statistics and retest statistics under each data dimension (such as each wafer dimension), and the lower part is the wafer failure map and / or wafer failure overlay map; the interaction method and purpose of Design 2 are similar to those of Design 1, the only difference is that the main view of Design 2 only displays charts showing wafer failure type statistics and retest statistics. Select the failure type statistics to be analyzed in the chart of the main view of Design 2 and jump to the Design 2 change state chart. The Design 1 change state chart can display the wafer failure map and / or wafer failure overlay map before and after the retest of the wafer selected by the user; the interaction method and purpose of Design 3 are similar to those of Design 1, the only difference is that the upper side of the main view of Design 3 has a data bar, which may include filtering information such as product information / data range, statistical information on the number of wafers under different data dimensions, yield-related information before and after retest, and retest-related statistical information.
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