Memory module heat sink (F1)
CN309204880SActive Publication Date: 2025-03-28SHENZHEN ENSHI TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202430273979.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-10
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2039-05-10
Smart Images
Figure 000007_ABST
Abstract
1. The name of this design product: memory module heat sink (F1). 2. The purpose of this design product: to assist in the heat dissipation of memory modules. 3. The design key point of this appearance design product lies in the shape of the product. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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