Pins of semiconductor package structure
CN309210560SActive Publication Date: 2025-04-01GANRICH SEMICON CORP
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Patent Information
- Application Number
- CN202430196956.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2023-10-18
- Filing Date
- 2024-04-10
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2039-04-10
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Figure 000007_ABST
Abstract
1. The name of the product of this design: Pins of a semiconductor package structure. 2. Purpose of the product of this design: The whole product is a packaging structure of a semiconductor element, and parts of the product are pins used for electrical connections. 3. The key point of the design of this product lies in the shape of the solid line part. 4. The picture or photo that best illustrates the key points of the design: Design 1 Stereoscopic drawing 1. 5. Other situations that need to be explained Other explanations: The dotted part in the figure is the content that is not requested for protection. 6. Specify the basic design: Design 1.
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