Semiconductor device mounting assembly
CN309211151SActive Publication Date: 2025-04-01JIAN IGOR ELECTRIC CO LTD
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Patent Information
- Application Number
- CN202430548455.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-28
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2039-08-28
Smart Images
Figure 000017_ABST
Abstract
1. Name of the product of this design: semiconductor device mounting assembly. 2. Purpose of the product of this design: It is a semiconductor device mounting component used to mount a semiconductor device (component 1) and a heat sink (component 2) in combination on a circuit board. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: reference diagram of the combined state.
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