Wafer film peeling machine

CN309211405SActive Publication Date: 2025-04-01江苏元夫半导体科技有限公司
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Patent Information

Application Number
CN202430479026.3
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2024-07-30
Publication Date
2025-04-01
Estimated Expiration
2039-07-30

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Abstract

1. The name of the product of this design: Wafer film peeling and laminating machine. 2. Purpose of the product with this design: This product with this design is used for peeling and pasting films on semiconductor wafers. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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