Vacuum welding furnace
CN309218400SActive Publication Date: 2025-04-04HANMEI SEMICONDUCTOR (WUXI) CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202430481860.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2039-07-31
Smart Images
Figure 000015_ABST
Abstract
1. The name of the product of this design: vacuum welding furnace. 2. Purpose of this design product: used for vacuum welding of semiconductor chips. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture. 5. The bottom surface of this design product is a part that is not easily visible or cannot be seen when in use, so the top view is omitted.
Need to check novelty before this filing date? Find Prior Art