Inductively coupled plasma etching equipment
CN309257986SActive Publication Date: 2025-04-25ADVANCED MATERIALS TECH & ENG INC +1
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Patent Information
- Application Number
- CN202430514630.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2039-08-14
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Figure 000007_ABST
Abstract
1. The name of the product of this design: Inductively coupled plasma etching equipment. 2. Purpose of the product of this design: Etching process equipment used for processing semiconductor components. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1. 5. Other situations that need explanation: Other explanations: The enlarged view of part A is the enlarged view of part A in the rear view; the enlarged view of part B is the enlarged view of part B in the stereoscopic view 1; the enlarged view of part C is the enlarged view of part C in the stereoscopic view 1; the enlarged view of part D is the enlarged view of part D in the stereoscopic view 1.
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