Semiconductor radiator (ultra-thin X155)
CN309259012SActive Publication Date: 2025-04-25曾银平
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202430585291.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2039-09-12
Smart Images

Figure 000007_ABST
Abstract
1. The name of the product of this design: semiconductor radiator (ultra-thin version X155). 2. Purpose of the product with this appearance design: a heat dissipation product used to cool down mobile phones. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
Need to check novelty before this filing date? Find Prior Art