Chip package (TSSOP11L)
CN309275353SActive Publication Date: 2025-05-06HUAYUAN SEMICON SHENZHEN LTD
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Patent Information
- Application Number
- CN202430606302.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2039-09-24
Smart Images
Figure 000007_ABST
Abstract
1. The name of this design product: chip package (TSSOP11L). 2. The purpose of this design product: chip heat dissipation and chip packaging. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1.
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