Wafer contact portion of a wafer position adjustment tool

CN309303100SActive Publication Date: 2025-05-23SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
CN202430594365.6
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Priority Date
2024-06-27
Filing Date
2024-09-18
Publication Date
2025-05-23
Estimated Expiration
2039-09-18

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Abstract

1. The name of the product of this design: Wafer contact portion of a wafer position adjustment tool. 2. Purpose of the product of this design: This product as a whole is used in a wafer cleaning device to press the side of the wafer to locate and adjust the position of the wafer. The part to be protected is used to press the wafer. 3. The key design point of this design product lies in the shape of the part shown by the solid line. 4. The picture or photo that best illustrates the design points: three-dimensional picture. 5. The rear view is symmetrical with the front view, so the rear view is omitted; the top view is symmetrical with the top view, so the top view is omitted. 6. The solid line portion is the portion for which protection is sought, and the dotted line is the dividing line used to distinguish the portion for which protection is sought from other portions.
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Citation Information

Cited By

  • Substrate positioning jig

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