Wafer contact portion of a wafer position adjustment tool
CN309303100SActive Publication Date: 2025-05-23SCREEN HOLDINGS CO LTD
Patent Information
- Application Number
- CN202430594365.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2024-06-27
- Filing Date
- 2024-09-18
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2039-09-18
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Figure 000005_ABST
Abstract
1. The name of the product of this design: Wafer contact portion of a wafer position adjustment tool. 2. Purpose of the product of this design: This product as a whole is used in a wafer cleaning device to press the side of the wafer to locate and adjust the position of the wafer. The part to be protected is used to press the wafer. 3. The key design point of this design product lies in the shape of the part shown by the solid line. 4. The picture or photo that best illustrates the design points: three-dimensional picture. 5. The rear view is symmetrical with the front view, so the rear view is omitted; the top view is symmetrical with the top view, so the top view is omitted. 6. The solid line portion is the portion for which protection is sought, and the dotted line is the dividing line used to distinguish the portion for which protection is sought from other portions.
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Citation Information
Cited By
Substrate positioning jig
USD1146851S