Laser stealth cutting equipment
CN309314375SActive Publication Date: 2025-05-30SILICON SEMICONDUCTOR (WUHAN) CO LTD
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Patent Information
- Application Number
- CN202530219697.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-22
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2040-04-22
Smart Images
Figure 000007_ABST
Abstract
1. Name of the Design Product: Laser Hidden Cutting Equipment. 2. Use of the Design Product: The design product is used for laser hidden cutting equipment. 3. Design Key Points of the Design Product: Lies in the shape. 4. Picture or Photograph Most Indicating the Design Key Points: Perspective view.
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