Heat dissipation substrate (for power module)
CN309315320SActive Publication Date: 2025-05-30SHANGHAI DAOZHI TECH CO LTD
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Patent Information
- Application Number
- CN202430635268.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2039-10-09
Smart Images
Figure 000007_ABST
Abstract
1. Name of the design product: Heat dissipation substrate (for power module). 2. Use of the design product: For automotive electronic components. 3. Design key points of the design product: Lies in the shape. 4. Picture or photo that best shows the design key points: Perspective view 1.
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