Cupping device (silicone negative pressure conductive)

CN309315542SActive Publication Date: 2025-05-30SHENZHEN DEKANGYUAN IND DEV CO LTD
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Patent Information

Application Number
CN202430426263.3
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2024-07-09
Publication Date
2025-05-30
Estimated Expiration
2039-07-09

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Abstract

1. Name of the design product: Cupping device (silicone negative pressure conductive). 2. Use of the design product: Silicone can body for physical therapy of the body. 3. Design key points of the design product: Lies in the shape. 4. Picture or photograph that best shows the design key points: Stereogram.
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