Memory stick heat sink (DH300)
CN309582600SActive Publication Date: 2025-11-04SHENZHEN CITY TECHWIN SEMICONDUCTOR COMPANY LIMITED
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Patent Information
- Application Number
- CN202530112915.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2040-03-11
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Figure 000007_ABST
Abstract
1. The name of the design product: memory stick radiator (DH300). 2. The use of the design product: for memory stick heat dissipation. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.
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