Multi-layer 3D PCB

CN309884929SActive Publication Date: 2026-03-31HANGZHOU XINYI ZHIWU CULTURAL CREATIVE INTELLIGENCE CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2025-09-18
Publication Date
2026-03-31

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Abstract

1. Name of the design product: multi-layer three-dimensional PCB board. 2. Use of the design product: circuit board. 3. Design points of the design product: in shape. 4. Picture or photo best indicating the design points: assembly state perspective view. 5. Assembly description of other circumstances needing to be explained: the assembly state is the combination of component 1 and component 2.
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