Conductive buffer spring (1)
CN309889989SActive Publication Date: 2026-04-03HANPIN (KUNSHAN) ELECTRONIC CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-20
- Publication Date
- 2026-04-03
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Figure 000001_ABST
Abstract
1. Name of the product in this design: Conductive buffer spring (1). 2. Application of this design: shock absorption, conductive grounding, and electromagnetic compatibility in electronic products. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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