Integrated circuit module
CN309892630SActive Publication Date: 2026-04-03BANKS & ACQUIRERS INT HLDG SAS
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-04
- Publication Date
- 2026-04-03
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Integrated Circuit Module. 2. Application of this design: for use in electronic payment terminal equipment, especially electronic payment terminal equipment integrating multiple wireless communication methods. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1. 5. Other situations requiring explanation: The main view is the pad surface of the module, and the usage state diagram shows that the module has a shielding cover on the electronic component side when in use.
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