Submerged liquid-cooled compute module

CN310028971SActive Publication Date: 2026-06-12BITDEER SEMICONDUCTOR TECHNOLOGY PTE LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
BITDEER SEMICONDUCTOR TECHNOLOGY PTE LTD
Filing Date
2025-10-21
Publication Date
2026-06-12

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Abstract

1. The name of the design product: immersion liquid cooling computing module. 2. The use of the design product: mainly used for immersion liquid cooling computing equipment for data processing. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1. 5. Other circumstances that need to be explained: A part enlarged view is a partial enlarged view of part A in perspective view 1; B part enlarged view is a partial enlarged view of part B in perspective view 2.
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