Submerged liquid-cooled compute module
CN310028971SActive Publication Date: 2026-06-12BITDEER SEMICONDUCTOR TECHNOLOGY PTE LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- BITDEER SEMICONDUCTOR TECHNOLOGY PTE LTD
- Filing Date
- 2025-10-21
- Publication Date
- 2026-06-12
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Figure 000007_ABST
Abstract
1. The name of the design product: immersion liquid cooling computing module. 2. The use of the design product: mainly used for immersion liquid cooling computing equipment for data processing. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1. 5. Other circumstances that need to be explained: A part enlarged view is a partial enlarged view of part A in perspective view 1; B part enlarged view is a partial enlarged view of part B in perspective view 2.
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