Headset connection structure (HM33)
CN310037522SActive Publication Date: 2026-06-19SHENZHEN HUANGMAI TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHENZHEN HUANGMAI TECH CO LTD
- Filing Date
- 2025-07-11
- Publication Date
- 2026-06-19
Smart Images

Figure 000009_ABST
Abstract
1. Name of the product in this design: Headphone Connection Structure (HM33). 2. Application of this design: This design is applied to the headphone connection structure between the headphone body and the wearing structure of an earphone. 3. The key design features of this product are the shape shown in the solid lines. 4. The image or photograph that best illustrates the design's key points: a 3D model. 5. Other situations requiring explanation: Component 1 is the headphone body, and component 2 is the wearing structure. The parts of the product's appearance that are to be protected are shown in dashed lines, while the parts that are not to be protected are shown in dashed lines.
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