Bus bar bonding material layer
CN310039222SActive Publication Date: 2026-06-19BIZCONN INT CORP (SHEN ZHEN)
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- BIZCONN INT CORP (SHEN ZHEN)
- Filing Date
- 2025-12-24
- Publication Date
- 2026-06-19
Smart Images

Figure 000007_ABST
Abstract
1. The name of the design product: busbar junction edge material layer. 2. The use of the design product: the product is arranged in the busbar to assist in placing the cable in the busbar. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view. 5. The design product is an elongated article, and the length is omitted. 6. Other circumstances that need to be explained: the reference drawing of the use state is the state of the fixed support plate arranged in the busbar.
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