Bus bar bonding material layer

CN310039222SActive Publication Date: 2026-06-19BIZCONN INT CORP (SHEN ZHEN)

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
BIZCONN INT CORP (SHEN ZHEN)
Filing Date
2025-12-24
Publication Date
2026-06-19

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Abstract

1. The name of the design product: busbar junction edge material layer. 2. The use of the design product: the product is arranged in the busbar to assist in placing the cable in the busbar. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view. 5. The design product is an elongated article, and the length is omitted. 6. Other circumstances that need to be explained: the reference drawing of the use state is the state of the fixed support plate arranged in the busbar.
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