Chip package lead frame (SOP7-13R)

Abstract

1. The name of the design product: chip package lead frame (SOP7-13R). 2. The use of the design product: for the packaging of semiconductor integrated circuit chips. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: front view. 5. The design product is a thin product, omitting the rear view; the design product is a thin product, omitting the left view; the design product is a thin product, omitting the right view; the design product is a thin product, omitting the top view; the design product is a thin product, omitting the bottom view.

Images