Splitting and tray placing apparatus

CN310040042SActive Publication Date: 2026-06-19KUNSHAN ZYLT ELECTRONIC TECH CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
KUNSHAN ZYLT ELECTRONIC TECH CO LTD
Filing Date
2025-10-10
Publication Date
2026-06-19

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Abstract

1. Name of the product in this design: Split plate arrangement device. 2. Purpose of this design: For automatic wafer dicing and tray placement. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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