heat sink (MX40)
CN310040856SActive Publication Date: 2026-06-19DONGGUAN BINGMAN ELECTRONIC TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- DONGGUAN BINGMAN ELECTRONIC TECH CO LTD
- Filing Date
- 2025-09-12
- Publication Date
- 2026-06-19
Smart Images

Figure 000009_ABST
Abstract
1. Name of the product in this design: Heat sink (MX40). 2. Purpose of this design: To dissipate heat from the computer CPU motherboard, chassis, and electronic components. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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