Semiconductor wafer electroplating machine
CN310062968SActive Publication Date: 2026-06-30JIANGSU WUXI JINGWEI TIANDI SEMICONDUCTOR TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- JIANGSU WUXI JINGWEI TIANDI SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2025-12-05
- Publication Date
- 2026-06-30
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Semiconductor wafer electroplating machine. 2. Purpose of this design: To electroplate a metal layer on the plating surface of a wafer. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
Need to check novelty before this filing date? Find Prior Art